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BSP324H6327XTSA1

Infineon Technologies

BSP324H6327XTSA1 by Infineon Technologies

Infineon's BSP324H6327XTSA1 is a N-CHANNEL FET with 400V DS breakdown voltage, ideal for SWITCHING applications. It features a built-in diode, 25 ohm RDS(on), and 150°C max operating temp. Suitable for automotive (AEC-Q101) and industrial electronics due to its small outline package and high reliability.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

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Distrelec

Netherlands . 1,000 parts In-Stock

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$0.860

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$0.860

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DigiKey

USA . 4,970 parts In-Stock

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$1.090

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$0.448

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$0.314

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$0.238

4,970

$1.090

$0.448

$0.314

$0.238

Newark

USA . 146 parts In-Stock

1+ parts

$1.210

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$0.494

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$0.439

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146

$1.210

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$0.439

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Element14

Singapore . 1,835 parts In-Stock

1+ parts

$1.290

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$0.622

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$0.503

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$1.290

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Mouser Electronics

USA . 353 parts In-Stock

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$1.380

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$0.564

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$0.389

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$0.294

353

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Arrow

USA . 84,000 parts In-Stock

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$0.242

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Verical

USA . 65,000 parts In-Stock

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$0.225

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$0.207

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$0.225

$0.207

RS (Exports)

UK . 4,500 parts In-Stock

1+ parts

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$0.515

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$0.448

10k+ parts

$0.414

4,500

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$0.515

$0.448

$0.414

Farnell

UK . 2,107 parts In-Stock

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$0.456

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$0.299

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2,107

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$0.299

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Chip1Stop

Japan . 1,230 parts In-Stock

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$0.447

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EBV Elektronik

Germany . 1,000 parts In-Stock

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Rochester

USA . 460 parts In-Stock

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$0.308

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$0.256

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$0.228

460

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$0.228

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 696 parts In-Stock

1+ parts

$0.239

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696

$0.239

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Mobius Materials

USA . 2,953 parts In-Stock

1+ parts

$0.385

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$0.307

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2,953

$0.385

$0.307

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Nova Conductors

Japan . 90 parts In-Stock

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$0.412

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90

$0.412

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TME

Poland . 278 parts In-Stock

1+ parts

$1.090

100+ parts

$0.482

1k+ parts

$0.330

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278

$1.090

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$0.330

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Vyrian

USA . 15,298 parts In-Stock

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NAC Semi

USA . 12,000 parts In-Stock

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$0.393

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Bristol Electronics

USA . 10,952 parts In-Stock

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VNN

France . 8,165 parts In-Stock

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IBS Electronics

USA . 2,000 parts In-Stock

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$0.456

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$0.288

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Manotoh

Italy . 1,000 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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$0.283

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$0.218

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Schukat

Germany . 400 parts In-Stock

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$0.468

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$0.268

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400

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$0.468

$0.268

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,923 parts In-Stock

1+ parts

$0.157

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$0.157

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Semicontronic

India . 15,691 parts In-Stock

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$0.157

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$0.153

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$0.152

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Corphita

USA . 188 parts In-Stock

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$0.227

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$0.227

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Argo Parts USA

USA . 3,017 parts In-Stock

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$0.412

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$0.400

3,017

$0.412

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$0.400

Aztec Data Supply Inc.

USA . 334 parts In-Stock

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$0.544

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334

$0.544

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Corohmni

South Africa . 255 parts In-Stock

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$0.629

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$0.629

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Component Stockers USA

USA . 22,605 parts In-Stock

1+ parts

$0.810

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$0.450

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$0.310

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$0.260

22,605

$0.810

$0.450

$0.310

$0.260

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$0.850

100+ parts

$0.774

1k+ parts

$0.697

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70

$0.850

$0.774

$0.697

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Modulus Dynamics

Lithuania . 13,646 parts In-Stock

1+ parts

$1.880

100+ parts

$1.805

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$1.730

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13,646

$1.880

$1.805

$1.730

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RC Electronics

USA . 64,427 parts In-Stock

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$0.430

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$0.390

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$0.380

64,427

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$0.430

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BidChips

USA . 10,952 parts In-Stock

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iBuyXS LLC

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Glotronic Ltd.

UK . 8,000 parts In-Stock

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Perfect Parts

USA . 2,299 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 1,706 parts In-Stock

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$0.473

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$0.266

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$0.252

1,706

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$0.473

$0.266

$0.252

Eastek

USA . 1,000 parts In-Stock

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$0.477

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$0.477

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.404

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$0.392

10k+ parts

$0.383

100

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$0.404

$0.392

$0.383

Overview

Discover the BSP324H6327XTSA1 by Infineon Technologies, a high-quality N-CHANNEL Power Field Effect Transistor with a single configuration and built-in diode. Perfect for switching applications, this transistor offers a maximum DS breakdown voltage of 400V and a maximum pulsing drain current of 0.68A. With a small outline package style, this transistor is ideal for various electronic devices where space is limited. Trust in Infineon Technologies for reliable performance and innovative technology that delivers value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

Ideal for use in applications where an n-channel transistor is required.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates the flow of current in one direction, making it efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Minimum DS Breakdown Voltage: 400 V

Can handle high voltage requirements, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

Provides a compact and space-saving design for efficient integration into circuits.

Terminal Form: GULL WING

Facilitates easy soldering and connection to circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control and efficient switching.

Maximum Pulsed Drain Current (IDM): 0.68 A

Capable of handling high current pulses, ensuring reliable performance under varying load conditions.

No. of Terminals: 4

Provides multiple connection points for versatile circuit design.

Maximum Power Dissipation (Abs): 1.8 W

Can dissipate higher power levels without overheating, ensuring stable operation.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for efficient layout in circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for high efficiency and fast switching speeds.

Maximum Operating Temperature: 150 °C

Can operate effectively in high-temperature environments, suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon material ensures reliable and consistent performance over time.

Maximum Turn On Time (ton): 13.5 ns

Fast turn-on time allows for quick switching and response in dynamic applications.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments, making it suitable for various operating conditions.

Maximum Turn Off Time (toff): 127 ns

Quick turn-off time ensures efficient switching and minimal power loss during transitions.

Terminal Finish: TIN

Tin finish provides corrosion resistance and ensures reliable connections.

Maximum Drain Current (ID): 0.17 A

Can handle continuous drain current, suitable for various applications.

Maximum Drain-Source On Resistance: 25 ohm

Low on-resistance minimizes power loss and heat generation during operation.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and connection options.

Case Connection: DRAIN

Drain connection ensures efficient current flow and heat dissipation.

Maximum Feedback Capacitance (Crss): 5.7 pF

Low feedback capacitance minimizes signal distortion and improves overall performance.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) BSP324H6327XTSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.7 pF

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

.68 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

127 ns

Maximum Turn On Time (ton):

13.5 ns

Trade Compliance

BSP324H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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