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CSD18537NQ5A

Texas Instruments

CSD18537NQ5A by Texas Instruments

CSD18537NQ5A by Texas Instruments is an N-CHANNEL power FET with a min DS breakdown voltage of 60V. It is used for switching applications and has a max pulsed drain current of 151A.

Median Price

$0.545

Lifecycle Status

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17

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Chip1Stop

Japan . 218 parts In-Stock

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Arrow

USA . 350 parts In-Stock

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$0.367

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Texas Instruments

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Farnell

UK . 54 parts In-Stock

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Mouser Electronics

USA . 1,932 parts In-Stock

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Verical

USA . 350 parts In-Stock

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Digiode

USA . 2,260 parts In-Stock

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Nova Conductors

Japan . 41 parts In-Stock

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Maritex

Poland . 16 parts In-Stock

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Component Sense

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Cyclops Electronics Ltd

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Vyrian

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Chip Stock

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Bristol Electronics

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Prism Electronics

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Semicontronic

India . 9,145 parts In-Stock

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$0.318

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$0.310

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$0.308

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Ampacity Inc.

Singapore . 9,089 parts In-Stock

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Corphita

USA . 1,601 parts In-Stock

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Continental Prestige Electronics

USA . 2,171 parts In-Stock

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$0.407

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Argo Parts USA

USA . 126 parts In-Stock

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$0.416

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Corohmni

South Africa . 744 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Parana Technologies

USA . 2,297 parts In-Stock

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DigiPath Technology Company

USA . 2,125 parts In-Stock

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IDEA Electronic Components Group

UK . 2,253 parts In-Stock

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ChromeModa Solutions

Germany . 213 parts In-Stock

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SIE Connect GmbH (Excess)

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A-Z Elektronik GmbH

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Lixinc

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Cyclops Electronics Ltd (Excess)

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Alle Elektronik GmbH

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Futuretech Components

Singapore . 196 parts In-Stock

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Overview

Experience the power and reliability of the CSD18537NQ5A by Texas Instruments. As a leader in semiconductor technology, Texas Instruments has crafted this N-CHANNEL Power Field Effect Transistor with precision and expertise. Whether you need it for switching applications or enhancing performance, this transistor delivers outstanding results. Its small outline package and no lead terminals make installation a breeze. With a maximum pulsed drain current of 151A and a maximum operating temperature of 150°C, this transistor is built to handle even the most demanding tasks. Trust in the quality and value that Texas Instruments provides, and take advantage of the benefits that the CSD18537NQ5A brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal insulation and protection against environmental factors, making the FET more durable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-state resistance and higher efficiency compared to P-Channel FETs, making them suitable for high-power applications.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can withstand high voltage applications without breakdown, ensuring reliable operation.

Maximum Pulsed Drain Current (IDM): 151 A

High pulsed drain current rating allows the FET to handle large current spikes, making it suitable for high-power transient applications.

Maximum Power Dissipation (Abs): 75 W

High power dissipation rating indicates the FET can handle high power levels without overheating, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures during operation, increasing its reliability in harsh environments.

Maximum Drain-Source On Resistance: 0.017 ohm

Low on-resistance leads to lower power losses and higher efficiency in switching applications, making this FET a good choice for high-power switching circuits.

Technical Specifications

Power Field Effect Transistors (FET) CSD18537NQ5A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

55 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.2 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

151 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18537NQ5A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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