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FDD4141

Onsemi

FDD4141 by Onsemi

The Onsemi FDD4141 is a P-CHANNEL Power FET with 40V DS Breakdown Voltage and 100A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has low 0.0123 ohm Drain-Source Resistance and can handle up to 69W power dissipation.

Median Price

$0.500

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,733 parts In-Stock

1+ parts

$1.070

100+ parts

$0.435

1k+ parts

$0.303

10k+ parts

$0.236

2,733

$1.070

$0.435

$0.303

$0.236

Mouser Electronics

USA . 10,661 parts In-Stock

1+ parts

$1.600

100+ parts

$0.798

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10,661

$1.600

$0.798

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Verical

USA . 164,975 parts In-Stock

1+ parts

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$0.497

10k+ parts

$0.443

164,975

-

-

$0.497

$0.443

Rochester

USA . 164,975 parts In-Stock

1+ parts

-

100+ parts

$0.479

1k+ parts

$0.398

10k+ parts

$0.354

164,975

-

$0.479

$0.398

$0.354

Future Electronics

Canada . 60,000 parts In-Stock

1+ parts

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$0.500

60,000

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$0.500

Element14

Singapore . 16,201 parts In-Stock

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-

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$1.115

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$0.941

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16,201

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$1.115

$0.941

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RS (Exports)

UK . 2,900 parts In-Stock

1+ parts

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$0.490

2,900

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$0.490

Arrow

USA . 2,500 parts In-Stock

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$0.336

2,500

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$0.336

Farnell

UK . 1 parts In-Stock

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$0.526

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1

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$0.526

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Distributors (In-Stock)

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Digiode

USA . 2,892 parts In-Stock

1+ parts

$0.354

100+ parts

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2,892

$0.354

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Maritex

Poland . 108 parts In-Stock

1+ parts

$0.707

100+ parts

$0.413

1k+ parts

$0.383

10k+ parts

$0.343

108

$0.707

$0.413

$0.383

$0.343

Nova Conductors

Japan . 300 parts In-Stock

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$1.000

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$1.000

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NAC Semi

USA . 47,500 parts In-Stock

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Vyrian

USA . 45,084 parts In-Stock

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Chip Stock

USA . 33,500 parts In-Stock

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Sensible Micro Corp

USA . 5,000 parts In-Stock

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IBS Electronics

USA . 4,500 parts In-Stock

1+ parts

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$0.562

1k+ parts

$0.509

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$0.463

4,500

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$0.562

$0.509

$0.463

Cyclops Electronics Ltd

UK . 3,965 parts In-Stock

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3,965

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Schukat

Germany . 1,900 parts In-Stock

1+ parts

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100+ parts

$0.611

1k+ parts

$0.470

10k+ parts

$0.454

1,900

-

$0.611

$0.470

$0.454

Bristol Electronics

USA . 1,404 parts In-Stock

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1,404

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ComSIT Distribution GmbH

Germany . 1,031 parts In-Stock

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R&J Components

USA . 600 parts In-Stock

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600

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Flip Electronics

USA . 574 parts In-Stock

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574

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Martec Srl

Italy . 25 parts In-Stock

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25

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Prism Electronics

USA . 15 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corphita

USA . 1,481 parts In-Stock

1+ parts

$0.336

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1,481

$0.336

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$0.364

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$0.345

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$0.345

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300

$0.364

$0.345

$0.345

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Corohmni

South Africa . 290 parts In-Stock

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$0.373

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290

$0.373

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Ampacity Inc.

Singapore . 44,583 parts In-Stock

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$0.550

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44,583

$0.550

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Argo Parts USA

USA . 2,659 parts In-Stock

1+ parts

$0.653

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$0.633

2,659

$0.653

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$0.633

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.980

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$0.941

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500

$0.980

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$0.941

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Continental Prestige Electronics

USA . 21,750 parts In-Stock

1+ parts

$1.180

100+ parts

$0.829

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21,750

$1.180

$0.829

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Aztec Data Supply Inc.

USA . 1,604 parts In-Stock

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$1.734

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$1.734

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GreenTree Electronics

Israel . 227,432 parts In-Stock

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Perfect Parts

USA . 170,835 parts In-Stock

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RC Electronics

USA . 64,671 parts In-Stock

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$0.640

1k+ parts

$0.580

10k+ parts

$0.570

64,671

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$0.640

$0.580

$0.570

QUARKTWIN TECHNOLOGY LTD

USA . 27,237 parts In-Stock

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27,237

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CPlus Electronics

USA . 9,999 parts In-Stock

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Kulean Microsystems

USA . 8,123 parts In-Stock

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iodParts Technologies Inc.

India . 7,530 parts In-Stock

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Kepictronics

USA . 7,500 parts In-Stock

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Robosynatics

Brazil . 7,165 parts In-Stock

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$0.892

1k+ parts

$0.874

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$0.874

7,165

-

$0.892

$0.874

$0.874

Lucentia Tech

USA . 7,165 parts In-Stock

1+ parts

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$0.892

1k+ parts

$0.874

10k+ parts

$0.874

7,165

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$0.892

$0.874

$0.874

Problanco Electronics

Mexico . 6,435 parts In-Stock

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6,435

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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S.R.D Solutions

India . 5,000 parts In-Stock

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Allen Electronics Distributors

USA . 4,470 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,465 parts In-Stock

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TANS Electronics

Latvia . 2,955 parts In-Stock

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Supply Digital

USA . 2,758 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Lixinc

USA . 2,444 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,310 parts In-Stock

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SupplyDigital Components

Austria . 1,487 parts In-Stock

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1,487

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 438 parts In-Stock

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438

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Modulus Dynamics

Lithuania . 100 parts In-Stock

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100

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Overview

Discover the power and efficiency of the FDD4141 by Onsemi, a top-quality P-CHANNEL Power Field Effect Transistor with a built-in diode. Ideal for switching applications, this transistor offers enhanced performance and reliability, thanks to its innovative design and advanced technology. With a maximum pulsed drain current of 100A and a low on-resistance of 0.0123 ohm, the FDD4141 ensures optimal functionality in various electronic devices. Trust Onsemi's expertise and experience in semiconductor manufacturing to deliver a product that meets your needs and exceeds your expectations. Elevate your projects with the FDD4141 and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the transistor, making it suitable for various operating conditions.

Polarity or Channel Type:

P-CHANNEL - This channel type allows for efficient switching capabilities, improving overall performance of the transistor.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and enhances the functionality of the transistor.

Transistor Application:

SWITCHING - Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount:

YES - The surface mount design enables easy installation and space-saving on PCBs.

Minimum DS Breakdown Voltage:

40 V - The high breakdown voltage ensures the transistor can handle high voltage applications safely.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy integration into circuit designs.

Terminal Form:

GULL WING - The gull wing terminals provide secure connections and efficient heat dissipation.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation offers precise control and efficient power handling.

Maximum Pulsed Drain Current (IDM):

100 A - The high pulsed drain current capability ensures the transistor can handle sudden surges in power.

Avalanche Energy Rating (EAS):

337 mJ - The high avalanche energy rating makes the transistor suitable for applications requiring robustness and reliability.

No. of Terminals:

2 - The dual terminals provide easy connection to the circuit.

Maximum Power Dissipation (Abs):

69 W - The high power dissipation capability ensures the transistor can handle high power levels without overheating.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space on PCBs, making it ideal for compact designs.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - The MOSFET technology offers high efficiency and low power consumption.

Maximum Operating Temperature:

150 °C - The high operating temperature range allows for reliable performance in a variety of environments.

Transistor Element Material:

SILICON - The silicon element material provides high performance and durability for the transistor.

Maximum Turn On Time (ton):

32 ns - The fast turn-on time ensures quick response in switching applications.

Minimum Operating Temperature:

55 °C - The low operating temperature range makes the transistor suitable for use in extreme cold conditions.

Maximum Turn Off Time (toff):

87 ns - The fast turn-off time ensures efficient switching in high-speed applications.

Terminal Finish:

MATTE TIN - The matte tin finish provides a reliable and low-resistance terminal connection.

Maximum Drain Current (ID):

50 A - The high drain current capability allows for handling of high current loads.

Maximum Drain-Source On Resistance:

0.0123 ohm - The low on-resistance ensures efficiency and minimal power loss in the circuit.

Terminal Position:

SINGLE - The single terminal position simplifies circuit connections and layout.

Case Connection:

DRAIN - The drain case connection allows for efficient heat dissipation and electrical performance.

Maximum Time At Peak Reflow Temperature (s):

30 - The short reflow time ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance ensures reliable soldering during assembly.

Maximum Feedback Capacitance (Crss):

310 pF - The low feedback capacitance minimizes unwanted signal interference and ensures accurate performance.

Technical Specifications

Power Field Effect Transistors (FET) FDD4141 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

337 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0123 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

310 pF

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

87 ns

Maximum Turn On Time (ton):

32 ns

Trade Compliance

FDD4141 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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