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IRF7759L2TRPBF

Infineon Technologies

IRF7759L2TRPBF by Infineon Technologies

Infineon's IRF7759L2TRPBF is a N-CHANNEL FET with 75V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 640A IDM, 257mJ EAS, and 0.0023 ohm RDS(on). Operates in ENHANCEMENT MODE with 175°C max temp, suitable for high-power requirements in various electronic devices.

Median Price

$3.831

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,770 parts In-Stock

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$3.831

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$3.831

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Chip1Stop

Japan . 1,589 parts In-Stock

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$4.620

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$2.800

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$2.400

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Verical

USA . 458 parts In-Stock

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$3.775

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$3.413

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$3.413

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Digiode

USA . 587 parts In-Stock

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$3.050

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Maritex

Poland . 42,000 parts In-Stock

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$4.435

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Nova Conductors

Japan . 604 parts In-Stock

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$4.778

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Chip Stock

USA . 15,630 parts In-Stock

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Bristol Electronics

USA . 3,782 parts In-Stock

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Vyrian

USA . 880 parts In-Stock

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LWI Electronics Inc

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Speed Components Ltd

Israel . 15 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 257 parts In-Stock

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$0.297

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257

$0.297

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Ampacity Inc.

Singapore . 1,015 parts In-Stock

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$2.730

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1,015

$2.730

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Semicontronic

India . 792 parts In-Stock

1+ parts

$2.730

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$2.662

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$2.648

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792

$2.730

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$2.648

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Corphita

USA . 416 parts In-Stock

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$2.889

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416

$2.889

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Modulus Dynamics

Lithuania . 6,654 parts In-Stock

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$4.630

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$4.445

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$4.260

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6,654

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Corohmni

South Africa . 931 parts In-Stock

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$4.630

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931

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$4.769

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$4.530

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Netroflash

USA . 100 parts In-Stock

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$4.778

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QUARKTWIN TECHNOLOGY LTD

USA . 24,058 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 12,000 parts In-Stock

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Microchip USA

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Robosynatics

Brazil . 5,000 parts In-Stock

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$0.469

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Lucentia Tech

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,950 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,896 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,042 parts In-Stock

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iodParts Technologies Inc.

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Argo Parts USA

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Overview

Unleash the power of innovation with the IRF7759L2TRPBF by Infineon Technologies. As a leading manufacturer in power field-effect transistors, Infineon is renowned for delivering top-notch quality and reliability. This N-channel transistor with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a maximum pulsed drain current of 640A and a minimum DS breakdown voltage of 75V, this chip carrier package is designed for optimal functionality. Experience the benefits of Infineon's cutting-edge technology and elevate your projects to new heights with the IRF7759L2TRPBF.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL: N-channel FETs typically have better performance and lower on-resistance compared to P-channel FETs, making them a good choice for switching applications.

Minimum DS Breakdown Voltage

75 V: High breakdown voltage allows for the FET to handle higher voltage applications without failure, making it a reliable option for various circuits.

Maximum Pulsed Drain Current (IDM)

640 A: High pulsed drain current capability enables the FET to handle large current spikes, which is essential for efficient switch-mode power supplies and motor control applications.

Maximum Power Dissipation (Abs)

125 W: High power dissipation rating ensures the FET can operate reliably under high power conditions without overheating, making it suitable for demanding applications.

Maximum Operating Temperature

175 °C: High operating temperature range allows the FET to be used in a wide variety of environments without risk of damage, ensuring reliable performance in different conditions.

Technical Specifications

Power Field Effect Transistors (FET) IRF7759L2TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

257 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

113 A

Maximum Drain Current (ID):

26 A

Maximum Drain-Source On Resistance:

.0023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N9

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

9

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

640 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF7759L2TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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