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NDT452AP

Onsemi

NDT452AP by Onsemi

NDT452AP by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage and 5A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating from -65 to 150 °C, it has 0.065 ohm On Resistance and can handle up to 15A Pulsed Drain Current.

Median Price

$0.471

Lifecycle Status

Suppliers In-Stock

61

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,808 parts In-Stock

1+ parts

$0.370

100+ parts

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2,808

$0.370

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Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$0.405

100+ parts

$0.385

1k+ parts

$0.385

10k+ parts

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350

$0.405

$0.385

$0.385

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Mouser Electronics

USA . 14,520 parts In-Stock

1+ parts

$1.590

100+ parts

$0.667

1k+ parts

$0.467

10k+ parts

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14,520

$1.590

$0.667

$0.467

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Newark

USA . 34,420 parts In-Stock

1+ parts

$1.640

100+ parts

$0.686

1k+ parts

$0.490

10k+ parts

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34,420

$1.640

$0.686

$0.490

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Distrelec

Netherlands . 3,990 parts In-Stock

1+ parts

$1.801

100+ parts

$1.469

1k+ parts

$1.190

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3,990

$1.801

$1.469

$1.190

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Avnet

USA . 216,000 parts In-Stock

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Element14

Singapore . 66,648 parts In-Stock

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$0.698

1k+ parts

$0.591

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$0.698

$0.591

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DigiKey

USA . 50,400 parts In-Stock

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$0.352

50,400

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Arrow

USA . 20,000 parts In-Stock

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$0.339

20,000

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$0.339

Verical

USA . 20,000 parts In-Stock

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$0.337

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Master Electronics

USA . 5,704 parts In-Stock

1+ parts

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100+ parts

$0.636

1k+ parts

$0.418

10k+ parts

$0.412

5,704

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$0.636

$0.418

$0.412

Rochester

USA . 3,660 parts In-Stock

1+ parts

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$0.471

1k+ parts

$0.391

10k+ parts

$0.348

3,660

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$0.471

$0.391

$0.348

Farnell

UK . 2,110 parts In-Stock

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$0.194

1k+ parts

$0.097

10k+ parts

$0.085

2,110

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$0.194

$0.097

$0.085

RS (Exports)

UK . 1,250 parts In-Stock

1+ parts

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100+ parts

$0.579

1k+ parts

$0.417

10k+ parts

$0.407

1,250

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$0.579

$0.417

$0.407

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 1,770 parts In-Stock

1+ parts

$0.200

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DF Sales Co.

USA . 1,770 parts In-Stock

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$0.200

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$0.200

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Digiode

USA . 2,742 parts In-Stock

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$0.367

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2,742

$0.367

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Component Electronics Inc.

Canada . 910 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

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910

$0.770

$0.580

$0.500

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Nova Conductors

Japan . 550 parts In-Stock

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$1.104

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Maritex

Poland . 2,867 parts In-Stock

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$1.155

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$0.679

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$0.534

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Forefront Electronics and Design

USA . 150 parts In-Stock

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$1.470

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$1.470

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TME

Poland . 2,506 parts In-Stock

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$1.490

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$0.668

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$0.551

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$1.490

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Flip Electronics

USA . 44,000 parts In-Stock

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Chip Stock

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Vyrian

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NAC Semi

USA . 8,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6,696 parts In-Stock

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IBS Electronics

USA . 5,704 parts In-Stock

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$0.892

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$0.577

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$0.577

Component Sense

UK . 4,902 parts In-Stock

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Sunrise Surplus Inc.

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UK . 3,575 parts In-Stock

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South Electronics

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Rebound Electronics

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Lantek

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Bristol Electronics

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Goldney Electronics S.L.

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Electronic Expediters

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Zilex Electronics Inc.

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ABC Electronics Ltd.

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Connector Distribution Corp

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Right Parts Inc.

USA . 1,118 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1,000 parts In-Stock

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Pegasus Components GmbH

Germany . 991 parts In-Stock

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Whistler Technology

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Atlantic Semiconductor

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Connect4Technologies Inc.

Canada . 791 parts In-Stock

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Anansix

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Semi Source

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Extreme Components

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Ashlea Components Ltd

UK . 286 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 175 parts In-Stock

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Dan-Mar Components

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Prism Electronics

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Velocity Electronics

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SPM Sales

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GES GmbH

Germany . 64 parts In-Stock

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Speed Components Ltd

Israel . 32 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 30 parts In-Stock

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LWI Electronics Inc

India . 15 parts In-Stock

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Microfarads

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Corohmni

South Africa . 313 parts In-Stock

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$0.200

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Semicontronic

India . 19,116 parts In-Stock

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$0.244

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$0.238

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$0.237

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Ampacity Inc.

Singapore . 9,207 parts In-Stock

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$0.244

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Corphita

USA . 529 parts In-Stock

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$0.347

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529

$0.347

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.405

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$0.385

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$0.385

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350

$0.405

$0.385

$0.385

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Aztec Data Supply Inc.

USA . 541 parts In-Stock

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$0.409

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$0.409

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Continental Prestige Electronics

USA . 75,583 parts In-Stock

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$0.865

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$0.524

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$0.339

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$0.865

$0.524

$0.339

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Component Stockers USA

USA . 72,921 parts In-Stock

1+ parts

$0.900

100+ parts

$0.570

1k+ parts

$0.390

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$0.340

72,921

$0.900

$0.570

$0.390

$0.340

Argo Parts USA

USA . 4,187 parts In-Stock

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$1.104

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Netroflash

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 78,184 parts In-Stock

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Eastek

USA . 48,000 parts In-Stock

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Austria . 6,758 parts In-Stock

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Lixinc

USA . 5,598 parts In-Stock

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Latvia . 4,822 parts In-Stock

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UK . 4,157 parts In-Stock

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Germany . 2,850 parts In-Stock

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Computer Components Inc. - USA

USA . 2,535 parts In-Stock

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Spain . 2,279 parts In-Stock

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Israel . 2,258 parts In-Stock

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Singapore . 669 parts In-Stock

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UHIMA Technologies

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Fairview Electronics Ltd

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Infinite Electronics LLP (Excess)

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Overview

Enhance your electronic devices with the NDT452AP by Onsemi, a top-quality Power FET designed for switching applications. Manufactured by Onsemi, a trusted name in the industry, this P-CHANNEL transistor offers customers unmatched value and performance. With features like a built-in diode, high power dissipation, and a low on-resistance, the NDT452AP is perfect for a wide range of applications. Upgrade your devices today with the NDT452AP and experience the difference that quality and reliability can make.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and resistance to external factors, making it a reliable choice for various applications.

Polarity or Channel Type:

P-CHANNEL - Offers efficient current flow and control, providing a high level of performance in switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space, making it a cost-effective option for electronic projects.

Transistor Application:

SWITCHING - Designed specifically for switching applications, ensuring reliable operation and optimal performance.

Surface Mount:

YES - Allows for easy installation and integration into circuit boards, providing a convenient solution for assembly.

Minimum DS Breakdown Voltage:

30 V - Withstands high levels of voltage, ensuring the safety and reliability of the product in various operating conditions.

Package Shape:

RECTANGULAR - Offers a compact and space-saving design, making it suitable for applications with limited space constraints.

Terminal Form:

GULL WING - Facilitates efficient soldering and connection, ensuring a secure and stable electrical connection.

Operating Mode:

ENHANCEMENT MODE - Provides enhanced control and efficiency, making it ideal for applications requiring precise switching.

Maximum Pulsed Drain Current (IDM):

15 A - Handles high current loads with ease, making it suitable for demanding applications that require robust performance.

Maximum Drain Current (Abs) (ID):

5 A - Supports moderate current levels, making it versatile for a wide range of applications.

No. of Terminals:

4 - Offers multiple connection points, allowing for flexibility and versatility in circuit design.

Maximum Power Dissipation (Abs):

3 W - Handles power efficiently, ensuring stable operation and longevity of the product.

Package Style (Meter):

SMALL OUTLINE - Provides a sleek and compact design, ideal for applications where space is a premium.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Utilizes advanced semiconductor technology, ensuring high performance and reliability.

Maximum Operating Temperature:

150 °C - Operates effectively in high-temperature environments, providing durability and reliability under challenging conditions.

Transistor Element Material:

SILICON - Offers exceptional conductivity and performance, ensuring optimal functionality in a wide range of applications.

Minimum Operating Temperature:

65 °C - Functions reliably in low-temperature environments, making it suitable for a variety of operating conditions.

Terminal Finish:

MATTE TIN - Provides corrosion resistance and good conductivity, ensuring stable and durable connections.

Maximum Drain-Source On Resistance:

0.065 ohm - Offers low resistance for efficient current flow, ensuring high performance in switching applications.

Terminal Position:

DUAL - Allows for versatile installation options, providing flexibility in circuit layout and design.

Case Connection:

DRAIN - Enables efficient heat dissipation, ensuring reliable operation even under heavy loads.

Maximum Time At Peak Reflow Temperature (s):

30 - Can withstand high-temperature reflow processes, ensuring robust performance during assembly.

Peak Reflow Temperature °C:

260 - Endures high-temperature reflow conditions, making it ideal for use in manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NDT452AP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

3 W

Maximum Pulsed Drain Current (IDM):

15 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDT452AP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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