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NDT454P

Onsemi

NDT454P by Onsemi

NDT454P by Onsemi is a P-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and ID of 5.9A, with 0.05 ohm RDS(on). The transistor operates in ENHANCEMENT MODE and has a max temp of 150°C, making it suitable for various power management tasks.

Median Price

$2.118

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$2.118

100+ parts

$1.927

1k+ parts

$1.737

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100

$2.118

$1.927

$1.737

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Distributors (In-Stock)

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Tomark Electronics Ltd

UK . 2,200 parts In-Stock

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$0.570

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2,200

$0.570

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Digiode

USA . 1,363 parts In-Stock

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$2.012

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Mobius Materials

USA . 197 parts In-Stock

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$3.560

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$2.853

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$2.853

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Chip Stock

USA . 39,000 parts In-Stock

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Vyrian

USA . 3,279 parts In-Stock

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Bristol Electronics

USA . 3,050 parts In-Stock

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Atlantic Semiconductor

USA . 3,050 parts In-Stock

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Anansix

USA . 634 parts In-Stock

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Semi Source

USA . 55 parts In-Stock

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55

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Nova Conductors

Japan . 10 parts In-Stock

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Electronic Expediters

USA . 9 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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Corohmni

South Africa . 320 parts In-Stock

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$0.570

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320

$0.570

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Ampacity Inc.

Singapore . 100 parts In-Stock

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$1.800

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100

$1.800

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Corphita

USA . 2,843 parts In-Stock

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$1.906

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2,843

$1.906

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Aztec Data Supply Inc.

USA . 3,151 parts In-Stock

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$1.909

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$1.909

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$2.118

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$1.927

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$1.737

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100

$2.118

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$1.737

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AZTECH Wire

Italy . 334 parts In-Stock

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$17.111

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334

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Kepictronics

USA . 27,860 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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TANS Electronics

Latvia . 6,324 parts In-Stock

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Continental Prestige Electronics

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A-Z Elektronik GmbH

Germany . 4,770 parts In-Stock

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SupplyDigital Components

Austria . 1,715 parts In-Stock

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Problanco Electronics

Mexico . 1,684 parts In-Stock

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Argo Parts USA

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UHIMA Technologies

Türkiye . 536 parts In-Stock

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Supply Digital

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Bastille Electronics

Australia . 81 parts In-Stock

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Overview

Enhance your electronic devices with the NDT454P Power Field Effect Transistor by Onsemi. Designed for efficient switching applications, this P-CHANNEL transistor offers high-quality performance and reliability. With a maximum pulsing drain current of 15A and a minimal drain-source on resistance of 0.05 ohms, this transistor delivers optimal power dissipation at 3W. The RECTANGULAR package style and GULL WING terminals make installation a breeze. Trust Onsemi's expertise in semiconductor technology to provide you with a top-tier product that will elevate your electronic projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

Offers efficient control over the flow of current, making it suitable for various circuit applications.

Transistor Application: SWITCHING

Ideal for applications where fast switching speeds are required, leading to improved performance.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltages without breakdown, increasing the reliability and safety of the product.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Maximum Pulsed Drain Current (IDM): 15 A

Capable of handling high currents during peak operation, making it suitable for power applications.

Maximum Power Dissipation (Abs): 3 W

Can dissipate heat effectively, preventing overheating and ensuring stable operation.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NDT454P attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

5.9 A

Maximum Drain Current (ID):

5.9 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

3 W

Maximum Pulsed Drain Current (IDM):

15 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDT454P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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