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BSP318SH6327

Infineon Technologies

BSP318SH6327 by Infineon Technologies

Infineon's BSP318SH6327 is a N-CHANNEL FET with 60V DS Breakdown Voltage and 10.4A IDM. Ideal for automotive applications due to AEC-Q101 standard compliance, it features 0.15 ohm RDS(ON) and 60mJ EAS rating.

Median Price

$0.375

Lifecycle Status

EOL

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 33,816 parts In-Stock

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$0.375

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$0.373

33,816

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$0.375

$0.373

Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

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$0.438

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900

$0.438

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Vyrian

USA . 33,537 parts In-Stock

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33,537

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Chip Stock

USA . 33,500 parts In-Stock

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Freddi Giovanni

Italy . 4,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,405 parts In-Stock

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3,405

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ComSIT USA

USA . 2,200 parts In-Stock

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VNN

France . 1,000 parts In-Stock

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Cogito LLC

Ukraine . 497 parts In-Stock

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Digiode

USA . 379 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 113 parts In-Stock

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 66,727 parts In-Stock

1+ parts

$0.319

100+ parts

$0.311

1k+ parts

$0.309

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66,727

$0.319

$0.311

$0.309

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Ampacity Inc.

Singapore . 33,597 parts In-Stock

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$0.319

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33,597

$0.319

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Continental Prestige Electronics

USA . 5,580 parts In-Stock

1+ parts

$0.423

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$0.415

5,580

$0.423

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$0.415

Argo Parts USA

USA . 2,504 parts In-Stock

1+ parts

$0.423

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$0.410

2,504

$0.423

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$0.410

Aranea Global

USA . 500 parts In-Stock

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$0.429

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$0.412

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500

$0.429

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$0.412

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Advanced Electronics

New Zealand . 396 parts In-Stock

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$0.447

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$0.447

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$0.447

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396

$0.447

$0.447

$0.447

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Corohmni

South Africa . 81 parts In-Stock

1+ parts

$0.591

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81

$0.591

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Modulus Dynamics

Lithuania . 18,836 parts In-Stock

1+ parts

$0.754

100+ parts

$0.724

1k+ parts

$0.694

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18,836

$0.754

$0.724

$0.694

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Aztec Data Supply Inc.

USA . 1,319 parts In-Stock

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$1.150

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1,319

$1.150

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Andel Nordic

Denmark . 3,224 parts In-Stock

1+ parts

$56.690

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$39.686

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$39.686

3,224

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$39.686

$39.686

Infinite Electronics LLP (Excess)

. 247,144 parts In-Stock

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RC Electronics

USA . 52,963 parts In-Stock

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Futuretech Components

Singapore . 19,980 parts In-Stock

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A-Z Elektronik GmbH

Germany . 18,845 parts In-Stock

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Lixinc

USA . 11,466 parts In-Stock

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Perfect Parts

USA . 7,840 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,139 parts In-Stock

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Kepictronics

USA . 2,190 parts In-Stock

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Corphita

USA . 970 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$6.174

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$6.174

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$6.174

300

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$6.174

$6.174

$6.174

Overview

Discover the BSP318SH6327 by Infineon Technologies, a top-quality Power Field Effect Transistor that offers unmatched performance and reliability. Infineon Technologies is renowned for its cutting-edge technology and innovative solutions, making this N-CHANNEL FET a standout choice for a variety of applications. With a minimum DS Breakdown Voltage of 60V and a maximum Pulsed Drain Current of 10.4A, this transistor delivers superior efficiency and power handling capabilities. Trust in the value and benefits that the BSP318SH6327 provides, and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to environmental factors, ensuring reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can help protect the FET from voltage spikes and reverse polarity, enhancing overall system reliability.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage of 60V ensures that the FET can handle higher voltage applications without the risk of damage.

Package Shape: RECTANGULAR

Rectangular shape makes the FET easy to handle and mount on a PCB, contributing to efficient system integration.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, making them suitable for a wide range of applications requiring precise power management.

Maximum Pulsed Drain Current (IDM): 10.4 A

High pulsed drain current rating allows the FET to handle short-duration high current events, ensuring reliable operation under transient conditions.

Avalanche Energy Rating (EAS): 60 mJ

The high avalanche energy rating indicates that the FET can withstand energy spikes and surges, improving overall system robustness.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit design and allows for better control and monitoring of the FET operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, enabling compact and efficient system designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers fast switching speeds and low power consumption, making the FET suitable for high-performance applications.

Transistor Element Material: SILICON

Silicon-based FETs have good thermal stability and can operate at high temperatures, ensuring reliable performance in demanding environments.

Maximum Drain Current (ID): 2.6 A

High maximum drain current rating allows the FET to handle continuous current flow, making it suitable for applications requiring sustained power delivery.

Maximum Drain-Source On Resistance: 0.15 ohm

Low drain-source on resistance minimizes power losses and improves efficiency, making the FET ideal for high-performance power management applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and allows for easy connection to external components, enhancing overall system integration.

Case Connection: DRAIN

Having the case connection at the drain terminal simplifies design and layout, improving thermal management and overall performance of the FET.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality, making the FET suitable for automotive and other high-reliability applications.

Technical Specifications

Power Field Effect Transistors (FET) BSP318SH6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10.4 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

BSP318SH6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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