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CSD19536KTTT

Texas Instruments

CSD19536KTTT by Texas Instruments

CSD19536KTTT by Texas Instruments is an N-CHANNEL FET for SWITCHING applications. It features a Max Pulsed Drain Current of 400A, Min DS Breakdown Voltage of 100V, and Max Operating Temperature of 175°C. With a low on-resistance of 0.0028 ohm, this MOSFET is ideal for high-power switching circuits.

Median Price

$6.920

Lifecycle Status

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13

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1k+

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Texas Instruments

USA . 50,283 parts In-Stock

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$4.749

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$4.161

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$2.351

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50,283

$4.749

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$2.351

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RS (Exports)

UK . 532 parts In-Stock

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$6.510

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$5.928

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532

$6.510

$5.928

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Mouser Electronics

USA . 768 parts In-Stock

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$7.330

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$3.500

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DigiKey

USA . 2,883 parts In-Stock

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$7.850

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$3.789

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$3.789

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Digiode

USA . 3,098 parts In-Stock

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$4.512

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Bristol Electronics

USA . 156 parts In-Stock

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$5.244

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$2.465

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$2.360

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156

$5.244

$2.465

$2.360

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TME

Poland . 73 parts In-Stock

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$6.940

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$4.080

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73

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$4.080

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Chip Stock

USA . 14,880 parts In-Stock

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Vyrian

USA . 12,677 parts In-Stock

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Component Sense

UK . 1,956 parts In-Stock

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Microfarads

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Cyclops Electronics Ltd

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Distributors (Availability)

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Parana Technologies

USA . 575 parts In-Stock

1+ parts

$0.632

100+ parts

$58.682

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$0.569

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575

$0.632

$58.682

$0.569

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DigiPath Technology Company

USA . 1,076 parts In-Stock

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$0.696

100+ parts

$0.640

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1,076

$0.696

$0.640

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ChromeModa Solutions

Germany . 2,048 parts In-Stock

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$0.710

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$0.582

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$0.710

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IDEA Electronic Components Group

UK . 1,566 parts In-Stock

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$0.710

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$0.639

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.918

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$0.872

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$0.872

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40

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Corohmni

South Africa . 685 parts In-Stock

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$1.897

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Ampacity Inc.

Singapore . 12,865 parts In-Stock

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Argo Parts USA

USA . 3,068 parts In-Stock

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$3.670

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Continental Prestige Electronics

USA . 1,158 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Semicontronic

India . 13,301 parts In-Stock

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$4.040

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Modulus Dynamics

Lithuania . 47 parts In-Stock

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$4.028

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Corphita

USA . 1,710 parts In-Stock

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Allen Electronics Distributors

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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GreenTree Electronics

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Futuretech Components

Singapore . 500 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Experience superior performance and reliability with the CSD19536KTTT by Texas Instruments, a leading manufacturer in the industry. This N-CHANNEL Power FET is ideal for switching applications, offering enhanced efficiency and power management. With a maximum drain current of 200A and low on-resistance, this transistor ensures optimal functionality. Its compact design and high-quality materials make it a top choice for various electronic projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the CSD19536KTTT and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the internal components of the FET, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications with ease, ensuring reliable performance under demanding conditions.

Maximum Pulsed Drain Current (IDM): 400 A

The high maximum pulsed drain current rating of 400A makes this FET suitable for applications requiring high current handling capability, such as power switching.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can operate in high temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD19536KTTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

806 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

61 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19536KTTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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