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CSD18532Q5B

Texas Instruments

CSD18532Q5B by Texas Instruments

CSD18532Q5B by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 400A IDM, and 0.0043 ohm Drain-Source Resistance. Suitable for high-power switching circuits with operating temperatures from -55 to 150 °C.

Median Price

$2.655

Lifecycle Status

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17

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Texas Instruments

USA . 26,258 parts In-Stock

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$0.730

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Farnell

UK . 37 parts In-Stock

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$1.110

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$0.885

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Mouser Electronics

USA . 20,174 parts In-Stock

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$1.440

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Newark

USA . 1,362 parts In-Stock

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$1.480

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Element14

Singapore . 37 parts In-Stock

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$4.370

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37

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DigiKey

USA . 5,732 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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Digiode

USA . 346 parts In-Stock

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Maritex

Poland . 850 parts In-Stock

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$2.220

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$1.267

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Bristol Electronics

USA . 455 parts In-Stock

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$2.400

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$1.488

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$0.900

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Chip Stock

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Component Sense

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Vyrian

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Martec Srl

Italy . 2,500 parts In-Stock

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Sensible Micro Corp

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LWI Electronics Inc

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NAC Semi

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Parana Technologies

USA . 874 parts In-Stock

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$1.106

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$1.941

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DigiPath Technology Company

USA . 172 parts In-Stock

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$1.218

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$1.121

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$1.218

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ChromeModa Solutions

Germany . 6,221 parts In-Stock

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$1.243

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$1.019

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IDEA Electronic Components Group

UK . 632 parts In-Stock

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Modulus Dynamics

Lithuania . 22,591 parts In-Stock

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Semicontronic

India . 7,087 parts In-Stock

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$1.390

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$1.355

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$1.348

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Argo Parts USA

USA . 1,501 parts In-Stock

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Corphita

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Corohmni

South Africa . 271 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$1.638

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Ampacity Inc.

Singapore . 7,298 parts In-Stock

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iBuyXS LLC

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Perfect Parts

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Alle Elektronik GmbH

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Continental Prestige Electronics

USA . 318 parts In-Stock

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Infinite Electronics LLP (Excess)

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Futuretech Components

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Formix International (Excess)

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Lucentia Tech

USA . 100 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.374

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$1.332

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Overview

Boost your electronic designs with the CSD18532Q5B by Texas Instruments. As a leader in power FET technology, Texas Instruments delivers superior quality and reliability with this N-channel transistor, perfect for switching applications. With a maximum drain current of 23A and a low on resistance of 0.0043 ohms, this enhancement mode FET offers exceptional performance. The CSD18532Q5B's small outline package and high operating temperature range make it ideal for a wide range of projects, providing you with the power and efficiency you need for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel type allows for efficient current flow and switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides reverse current protection.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in such scenarios.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the transistor can withstand extreme conditions and long operating hours.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and reliability in the transistor's operation.

Technical Specifications

Power Field Effect Transistors (FET) CSD18532Q5B attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

320 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

17 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18532Q5B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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