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CSD19534Q5A

Texas Instruments

CSD19534Q5A by Texas Instruments

CSD19534Q5A by Texas Instruments is an N-CHANNEL FET for SWITCHING applications. It features a 100V DS Breakdown Voltage, 137A IDM, and 0.0176 ohm Drain-Source On Resistance. With a max operating temperature of 150°C, this MOSFET is suitable for high-power switching circuits in various electronic devices.

Median Price

$0.727

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 47 parts In-Stock

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$0.675

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$0.463

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$0.389

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Texas Instruments

USA . 65,493 parts In-Stock

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Chip1Stop

Japan . 1,419 parts In-Stock

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DigiKey

USA . 25,431 parts In-Stock

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$1.470

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$0.618

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$0.441

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$0.399

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$1.470

$0.618

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$0.399

Mouser Electronics

USA . 364 parts In-Stock

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$1.470

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$0.618

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$0.442

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364

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$0.393

RS (Exports)

UK . 12,300 parts In-Stock

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Verical

USA . 47 parts In-Stock

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$0.463

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$0.389

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$0.389

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Distributors (In-Stock)

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Greenchips

USA . 115 parts In-Stock

1+ parts

$0.365

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$0.347

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$0.331

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$0.299

115

$0.365

$0.347

$0.331

$0.299

Ozdisan Elektronik

Türkiye . 10,922 parts In-Stock

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$0.379

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Nova Conductors

Japan . 300 parts In-Stock

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Digiode

USA . 445 parts In-Stock

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TME

Poland . 19 parts In-Stock

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IBS Electronics

USA . 49,999 parts In-Stock

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Chip Stock

USA . 23,500 parts In-Stock

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Semtec, LLC

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Vyrian

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NAC Semi

USA . 3,990 parts In-Stock

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$1.030

Velocity Electronics

USA . 1,497 parts In-Stock

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Bristol Electronics

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PC Components Company LLC

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Cyclops Electronics Ltd

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SIE Connect GmbH - GreenChips

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Distributors (Availability)

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Semicontronic

India . 12,442 parts In-Stock

1+ parts

$0.394

100+ parts

$0.384

1k+ parts

$0.382

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12,442

$0.394

$0.384

$0.382

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Ampacity Inc.

Singapore . 12,238 parts In-Stock

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$0.394

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Continental Prestige Electronics

USA . 3,778 parts In-Stock

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$0.477

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$0.468

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Argo Parts USA

USA . 2,644 parts In-Stock

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$0.477

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$0.463

2,644

$0.477

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$0.463

Corphita

USA . 386 parts In-Stock

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$0.611

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$0.611

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Corohmni

South Africa . 888 parts In-Stock

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$1.112

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$1.112

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$1.332

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$1.265

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$1.265

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$1.332

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$1.265

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Parana Technologies

USA . 1,112 parts In-Stock

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$1.335

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$2.069

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$1.335

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DigiPath Technology Company

USA . 1,407 parts In-Stock

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$1.470

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$1.352

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$1.470

$1.352

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ChromeModa Solutions

Germany . 3,749 parts In-Stock

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$1.500

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$1.230

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IDEA Electronic Components Group

UK . 1,149 parts In-Stock

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$1.500

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$1.350

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Authorized Procurement Solutions

USA . 35,625 parts In-Stock

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GreenTree Electronics

Israel . 33,497 parts In-Stock

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Futuretech Components

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Perfect Parts

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Lixinc

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Infinite Electronics LLP (Excess)

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S.R.D Solutions

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Speed Components Ltd (Excess)

Israel . 950 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.468

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$0.454

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$0.445

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$4.724

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$4.724

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$4.724

100

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$4.724

$4.724

$4.724

Overview

Elevate your power management solutions with the CSD19534Q5A by Texas Instruments. This top-of-the-line N-CHANNEL Power FET boasts unparalleled quality and reliability, thanks to its manufacturer's trusted reputation in the industry. Ideal for switching applications, this transistor offers enhanced performance and efficiency. With a compact package design and impressive specifications, this FET provides customers with unmatched value and benefits, making it the perfect choice for all their power-related needs. Experience the difference with Texas Instruments' CSD19534Q5A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FET durable and resistant to external elements, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

With N-channel polarity, this FET offers efficient and high-performance switching capabilities, making it ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET configuration helps to protect the circuit from voltage spikes and reverse currents, enhancing its reliability.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers fast response times and low power consumption, making it a reliable choice for switching circuits.

Surface Mount: YES

Being surface mountable, this FET is easy to install on PCBs, saving space and enhancing the overall compactness of the design.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltages, making it suitable for applications requiring robust performance under high voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape of this FET allows for easy placement and mounting on PCBs, simplifying the assembly process.

Terminal Form: NO LEAD

The absence of leads in the terminal form of this FET reduces the risk of short circuits and improves overall reliability in the circuit.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode, this FET offers improved control and efficiency in various applications, ensuring precise and reliable operation.

Maximum Pulsed Drain Current (IDM): 137 A

With a high pulsed drain current of 137A, this FET can handle momentary high currents, making it suitable for applications with variable power requirements.

Technical Specifications

Power Field Effect Transistors (FET) CSD19534Q5A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

55 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.0176 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7.4 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

137 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19534Q5A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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