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CSD17308Q3T

Texas Instruments

CSD17308Q3T by Texas Instruments

CSD17308Q3T by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. It features 30V DS Breakdown Voltage, 167A IDM, and 0.0165 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, it has a max temperature of 150°C and an EAS of 65mJ.

Median Price

$0.526

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

$0.442

100+ parts

$0.415

1k+ parts

$0.376

10k+ parts

-

250

$0.442

$0.415

$0.376

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Chip1Stop

Japan . 116 parts In-Stock

1+ parts

$0.504

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$0.278

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-

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116

$0.504

$0.278

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Adafruit Industries

USA . 2,500 parts In-Stock

1+ parts

$0.684

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$0.650

1k+ parts

$0.650

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2,500

$0.684

$0.650

$0.650

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Texas Instruments

USA . 4,622 parts In-Stock

1+ parts

$0.748

100+ parts

$0.576

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$0.303

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4,622

$0.748

$0.576

$0.303

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Mouser Electronics

USA . 709 parts In-Stock

1+ parts

$1.690

100+ parts

$0.626

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709

$1.690

$0.626

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RS (Exports)

UK . 410 parts In-Stock

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$0.526

10k+ parts

$0.491

410

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$0.526

$0.491

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

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$0.453

10k+ parts

$0.433

250

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-

$0.453

$0.433

DigiKey

USA . 55 parts In-Stock

1+ parts

-

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$0.575

10k+ parts

$0.498

55

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$0.575

$0.498

Verical

USA . 19 parts In-Stock

1+ parts

-

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$0.206

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19

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$0.206

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Distributors (In-Stock)

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Digiode

USA . 2,665 parts In-Stock

1+ parts

$0.329

100+ parts

-

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2,665

$0.329

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.584

100+ parts

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50

$0.584

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TME

Poland . 139 parts In-Stock

1+ parts

$1.589

100+ parts

$0.711

1k+ parts

$0.553

10k+ parts

$0.513

139

$1.589

$0.711

$0.553

$0.513

Chip Stock

USA . 52,590 parts In-Stock

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52,590

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Vyrian

USA . 1,032 parts In-Stock

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Cyclops Electronics Ltd

UK . 500 parts In-Stock

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Classic Components Corporation

USA . 154 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,120 parts In-Stock

1+ parts

$0.311

100+ parts

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$0.311

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Semicontronic

India . 756 parts In-Stock

1+ parts

$0.316

100+ parts

$0.308

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$0.307

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756

$0.316

$0.308

$0.307

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Ampacity Inc.

Singapore . 717 parts In-Stock

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$0.316

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717

$0.316

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Argo Parts USA

USA . 4,952 parts In-Stock

1+ parts

$0.535

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$0.519

4,952

$0.535

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$0.519

Continental Prestige Electronics

USA . 3,111 parts In-Stock

1+ parts

$0.535

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$0.524

3,111

$0.535

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$0.524

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.684

100+ parts

$0.650

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$0.650

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2,500

$0.684

$0.650

$0.650

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Parana Technologies

USA . 1,250 parts In-Stock

1+ parts

$0.749

100+ parts

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$1.756

10k+ parts

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1,250

$0.749

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$1.756

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Corohmni

South Africa . 237 parts In-Stock

1+ parts

$0.771

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237

$0.771

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DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$0.825

100+ parts

$0.759

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752

$0.825

$0.759

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ChromeModa Solutions

Germany . 1,441 parts In-Stock

1+ parts

$0.842

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$0.690

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1,441

$0.842

$0.690

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IDEA Electronic Components Group

UK . 392 parts In-Stock

1+ parts

$0.842

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$0.758

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392

$0.842

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$0.758

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.573

1k+ parts

$0.555

10k+ parts

$0.543

2,000

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$0.573

$0.555

$0.543

Overview

Upgrade your electronic devices with the high-quality CSD17308Q3T Power Field Effect Transistor from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch products that are perfect for switching applications. The N-channel configuration and built-in diode make this transistor a versatile and efficient choice for your projects. With a maximum drain current of 14A and a low on-resistance of 0.0165 ohm, you can trust that this transistor will provide reliable performance. Make the smart choice and invest in the CSD17308Q3T for exceptional value and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have higher mobility and conductivity, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect against reverse currents, providing added reliability and functionality to the FET.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and efficient performance.

Surface Mount: YES

Being surface mountable, this FET is easy to install and allows for compact and space-saving designs.

Minimum DS Breakdown Voltage: 30 V

The minimum breakdown voltage of 30 V ensures the FET can handle higher voltage levels, making it versatile for various voltage requirements.

Maximum Pulsed Drain Current (IDM): 167 A

With a high pulsed drain current rating of 167 A, this FET can handle peak current demands, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures reliability and stability of the FET even under elevated temperature conditions.

Maximum Drain-Source On Resistance: 0.0165 ohm

Low on-resistance results in reduced power losses and improved efficiency, making this FET a great choice for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD17308Q3T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

35 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

167 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD17308Q3T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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