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CSD19536KTT

Texas Instruments

CSD19536KTT by Texas Instruments

CSD19536KTT by Texas Instruments is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 400A and EAS of 806mJ, operating in ENHANCEMENT MODE. This PLASTIC/EPOXY transistor has a max ID of 200A and 0.0028 ohm RDS(on), suitable for high-power switching circuits.

Median Price

$4.694

Lifecycle Status

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13

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1k+

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Texas Instruments

USA . 39 parts In-Stock

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$3.351

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$2.936

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$1.659

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39

$3.351

$2.936

$1.659

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Arrow

USA . 426 parts In-Stock

1+ parts

$4.139

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$2.841

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$2.128

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426

$4.139

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$2.128

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Chip1Stop

Japan . 78 parts In-Stock

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$5.250

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Mouser Electronics

USA . 5,796 parts In-Stock

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$5.270

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$2.630

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$2.370

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$5.270

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DigiKey

USA . 12,698 parts In-Stock

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$5.870

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$2.805

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Verical

USA . 206 parts In-Stock

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Digiode

USA . 2,911 parts In-Stock

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$3.097

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Nova Conductors

Japan . 10 parts In-Stock

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$3.474

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Chip Stock

USA . 14,870 parts In-Stock

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Next Level Components, LLC

USA . 2,500 parts In-Stock

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Vyrian

USA . 741 parts In-Stock

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Cyclops Electronics Ltd

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Elcom Components

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.968

100+ parts

$0.881

1k+ parts

$0.794

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40

$0.968

$0.881

$0.794

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Parana Technologies

USA . 8 parts In-Stock

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$0.999

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$1.882

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8

$0.999

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$1.882

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DigiPath Technology Company

USA . 1,152 parts In-Stock

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$1.101

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$1.012

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ChromeModa Solutions

Germany . 1,918 parts In-Stock

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$1.123

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$0.921

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

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$1.123

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Corohmni

South Africa . 49 parts In-Stock

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$1.665

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Continental Prestige Electronics

USA . 3,813 parts In-Stock

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Argo Parts USA

USA . 2,835 parts In-Stock

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Ampacity Inc.

Singapore . 574 parts In-Stock

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Semicontronic

India . 408 parts In-Stock

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Corphita

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Perfect Parts

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Lixinc

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Futuretech Components

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GreenTree Electronics

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Metaverse IC Inc.

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Modulus Dynamics

Lithuania . 90 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$3.405

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$3.301

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$3.231

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Overview

Elevate your power systems with the CSD19536KTT by Texas Instruments, a top-quality N-CHANNEL Power Field Effect Transistor that delivers unmatched performance and reliability. Manufactured with precision and expertise, this SWITCHING transistor offers enhanced efficiency, durability, and versatility for a wide range of applications. From automotive to industrial electronics, this product guarantees seamless operation and optimized energy management, making it an indispensable component for your projects. Experience the value and benefits of cutting-edge technology with the CSD19536KTT - your ultimate solution for power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in one direction, making it suitable for a wide range of switching applications.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltage applications, making it versatile and suitable for various circuits.

Maximum Pulsed Drain Current (IDM): 400 A

Capable of handling high current pulses, making it suitable for high-power switching applications.

Maximum Drain-Source On Resistance: 0.0028 ohm

Low on-resistance allows for efficient power transfer with minimal heat dissipation, increasing overall efficiency.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand elevated temperatures without sacrificing performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD19536KTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

806 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

61 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19536KTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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