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CSD19534Q5AT

Texas Instruments

CSD19534Q5AT by Texas Instruments

CSD19534Q5AT by Texas Instruments is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It is used for switching applications, has a max IDM of 137A and an EAS rating of 55mJ.

Median Price

$1.864

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 69,195 parts In-Stock

1+ parts

$1.309

100+ parts

$1.007

1k+ parts

$0.530

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69,195

$1.309

$1.007

$0.530

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Chip1Stop

Japan . 105 parts In-Stock

1+ parts

$1.510

100+ parts

$0.889

1k+ parts

$0.791

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105

$1.510

$0.889

$0.791

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Farnell

UK . 795 parts In-Stock

1+ parts

$1.864

100+ parts

$1.026

1k+ parts

$1.007

10k+ parts

-

795

$1.864

$1.026

$1.007

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Newark

USA . 160 parts In-Stock

1+ parts

$2.440

100+ parts

$0.936

1k+ parts

$0.781

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160

$2.440

$0.936

$0.781

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Mouser Electronics

USA . 3,037 parts In-Stock

1+ parts

$2.530

100+ parts

$0.973

1k+ parts

$0.768

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3,037

$2.530

$0.973

$0.768

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Element14

Singapore . 220 parts In-Stock

1+ parts

$3.110

100+ parts

$1.330

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$1.000

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$0.990

220

$3.110

$1.330

$1.000

$0.990

DigiKey

USA . 11,289 parts In-Stock

1+ parts

-

100+ parts

-

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$0.845

10k+ parts

$0.739

11,289

-

-

$0.845

$0.739

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.054

100+ parts

-

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-

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100

$1.054

-

-

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Digiode

USA . 3,955 parts In-Stock

1+ parts

$1.244

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-

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3,955

$1.244

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Chip Stock

USA . 22,080 parts In-Stock

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22,080

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Vyrian

USA . 12,042 parts In-Stock

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12,042

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LIBRA Elektronik GmbH

Germany . 119 parts In-Stock

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119

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PC Components Company LLC

USA . 102 parts In-Stock

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102

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Bristol Electronics

USA . 102 parts In-Stock

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102

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Cogito LLC

Ukraine . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,392 parts In-Stock

1+ parts

$0.803

100+ parts

-

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1,392

$0.803

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.901

100+ parts

$0.856

1k+ parts

$0.856

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600

$0.901

$0.856

$0.856

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Semicontronic

India . 11,331 parts In-Stock

1+ parts

$1.110

100+ parts

$1.082

1k+ parts

$1.077

10k+ parts

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11,331

$1.110

$1.082

$1.077

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Ampacity Inc.

Singapore . 11,200 parts In-Stock

1+ parts

$1.110

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-

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11,200

$1.110

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$1.140

100+ parts

$0.844

1k+ parts

$0.725

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3

$1.140

$0.844

$0.725

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Modulus Dynamics

Lithuania . 900 parts In-Stock

1+ parts

$1.156

100+ parts

$1.145

1k+ parts

$1.110

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900

$1.156

$1.145

$1.110

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Corphita

USA . 1,942 parts In-Stock

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$1.178

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1,942

$1.178

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Corohmni

South Africa . 94 parts In-Stock

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$1.327

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94

$1.327

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Parana Technologies

USA . 2,322 parts In-Stock

1+ parts

$1.353

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$2.080

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2,322

$1.353

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$2.080

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DigiPath Technology Company

USA . 1,318 parts In-Stock

1+ parts

$1.490

100+ parts

$1.370

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1,318

$1.490

$1.370

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ChromeModa Solutions

Germany . 5,071 parts In-Stock

1+ parts

$1.520

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$1.246

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5,071

$1.520

$1.246

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IDEA Electronic Components Group

UK . 2,024 parts In-Stock

1+ parts

$1.520

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$1.368

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2,024

$1.520

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$1.368

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Robosynatics

Brazil . 12,334 parts In-Stock

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12,334

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Lucentia Tech

USA . 12,334 parts In-Stock

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-

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$0.341

1k+ parts

$0.334

10k+ parts

$0.334

12,334

-

$0.341

$0.334

$0.334

Lixinc

USA . 8,762 parts In-Stock

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8,762

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Perfect Parts

USA . 1,836 parts In-Stock

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1,836

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Netroflash

USA . 1,000 parts In-Stock

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$1.033

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$1.001

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$0.980

1,000

-

$1.033

$1.001

$0.980

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Kepictronics

USA . 648 parts In-Stock

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648

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Formix International (Excess)

India . 450 parts In-Stock

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450

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A-Z Elektronik GmbH

Germany . 342 parts In-Stock

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342

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Overview

Discover the CSD19534Q5AT by Texas Instruments, a high-quality Power Field Effect Transistor (FET) that brings unparalleled performance to your applications. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching purposes. Its small outline package, no-lead terminals, and surface mount capability make it easy to integrate into any project. Offering a maximum drain current of 10A and a minimum DS breakdown voltage of 100V, this enhancement mode transistor delivers exceptional power and reliability. Trust Texas Instruments for top-notch technology and experience the advantages of the CSD19534Q5AT in your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the Power FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration enables efficient switching, making this Power FET suitable for power management and control circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency, making this Power FET an ideal choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching operations, this Power FET provides fast and precise switching capabilities for enhanced performance.

Surface Mount: YES

With surface mount compatibility, this Power FET is easy to integrate into modern electronics, allowing for compact design and efficient PCB layouts.

Minimum DS Breakdown Voltage: 100 V

This high breakdown voltage ensures safe and reliable operation in high-voltage applications, making it a suitable choice for power switching tasks.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of handling and efficient space utilization, making installation and thermal management convenient.

Terminal Form: NO LEAD

With a lead-free terminal form, this Power FET complies with environmental regulations and ensures safer and more sustainable electronics.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation enhances the control and efficiency of the Power FET, making it a preferred choice for power switching.

No. of Elements: 1

With a single element, this Power FET simplifies circuit design and reduces overall complexity, providing a cost-effective solution.

Maximum Pulsed Drain Current (IDM): 137 A

The high maximum pulsed drain current allows this Power FET to handle high power loads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 55 mJ

The high avalanche energy rating ensures reliable operation in extreme conditions, making this Power FET a robust choice for rugged applications.

No. of Terminals: 8

With eight terminals, this Power FET offers versatile connections and facilitates flexible circuit configurations, expanding its compatibility and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-saving designs and efficient heat dissipation, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides high switching speeds and low conduction losses, enhancing the overall performance of this Power FET.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this Power FET to withstand elevated temperatures, ensuring reliable operation in demanding environments.

Transistor Element Material: SILICON

The silicon element material offers excellent electrical characteristics and thermal stability, making this Power FET a reliable choice for various applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this Power FET can perform reliably in extremely cold environments, expanding its range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and ease of assembly.

Maximum Drain Current (ID): 10 A

With a high maximum drain current rating, this Power FET can handle significant power demands, making it suitable for various power control applications.

Maximum Drain-Source On Resistance: 0.0176 ohm

The low on-resistance minimizes power losses and improves efficiency in power switching circuits, making this Power FET an optimal choice for high-performance applications.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layouts and multiple connection options, enhancing the versatility and usability of this Power FET.

Moisture Sensitivity Level (MSL): 1

With a MSL of 1 (lowest sensitivity), this Power FET can withstand moisture or humidity exposure during assembly, ensuring its reliability and long-term performance.

Case Connection: DRAIN

The drain case connection provides efficient heat dissipation and improved thermal management, contributing to the overall reliability and performance of this Power FET.

Maximum Time At Peak Reflow Temperature (s): 30

This Power FET can endure peak reflow temperatures for up to 30 seconds, allowing for efficient manufacturing processes and ensuring its reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C makes this Power FET suitable for lead-free soldering processes, ensuring efficient and environmentally friendly assembly.

Maximum Feedback Capacitance (Crss): 7.4 pF

The low feedback capacitance reduces the risk of unwanted oscillations in high-frequency applications, making this Power FET a reliable choice for precise signal control.

Technical Specifications

Power Field Effect Transistors (FET) CSD19534Q5AT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

55 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.0176 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7.4 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

137 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19534Q5AT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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