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SIR422DP-T1-GE3

Vishay Intertechnology

SIR422DP-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIR422DP-T1-GE3 is an N-channel power FET with a built-in diode, ideal for switching applications. It features a min DS breakdown voltage of 40V, max pulsed drain current of 70A, and max operating temperature of 150°C. This MOSFET has a package style of small outline and offers low drain-source on resistance at 0.0066 ohm.

Median Price

$0.614

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Farnell

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$0.398

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Element14

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$0.694

TTI Europe

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Verical

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TME

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$0.750

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$0.720

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Vyrian

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NAC Semi

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Atlantic Semiconductor

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Argo Parts USA

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$0.841

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Overview

Unleash the power of cutting-edge technology with the SIR422DP-T1-GE3 by Vishay Intertechnology. As a leader in Power Field Effect Transistors, Vishay Intertechnology guarantees top-notch quality and reliability. Designed for switching applications, this N-CHANNEL transistor offers unparalleled performance with a built-in diode for added convenience. With a maximum pulsed drain current of 70A and a low on-resistance of 0.0066 ohm, this transistor is ideal for high-power applications where efficiency is key. Trust Vishay Intertechnology to deliver exceptional value and superior results with the SIR422DP-T1-GE3.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL -

Suitable for use in applications requiring N-channel polarity.

Configuration: SINGLE WITH BUILT-IN DIODE -

Provides added functionality with built-in diode for convenience.

Transistor Application: SWITCHING -

Ideal for use in switching applications for efficient performance.

Surface Mount: YES -

Allows for easy installation and space-saving design.

Minimum DS Breakdown Voltage: 40 V -

Ensures reliability and protection with a minimum breakdown voltage of 40V.

Package Shape: RECTANGULAR -

The rectangular shape allows for easy integration into various electronic devices.

Terminal Form: C BEND -

C bend terminals ensure secure connections for stability.

Operating Mode: ENHANCEMENT MODE -

Operates in enhancement mode for improved efficiency.

Maximum Pulsed Drain Current (IDM): 70 A -

Capable of handling high pulsed drain currents for robust performance.

Avalanche Energy Rating (EAS): 45 mJ -

Has a high avalanche energy rating for added reliability under stressful conditions.

Maximum Drain Current (Abs) (ID): 40 A -

Offers high maximum drain current to meet demanding requirements.

No. of Terminals: 5 -

Provides multiple terminals for flexible connectivity options.

Maximum Power Dissipation (Abs): 34.7 W -

Can dissipate up to 34.7W of power for effective heat management.

Package Style (Meter): SMALL OUTLINE -

Small outline package style for compact and efficient design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR -

Utilizes metal-oxide semiconductor technology for improved performance.

Maximum Operating Temperature: 150 °C -

Suitable for operation in high-temperature environments up to 150°C.

Transistor Element Material: SILICON -

Made of silicon for durability and performance.

Terminal Finish: Matte Tin (Sn) -

Matte tin terminal finish for corrosion resistance and longevity.

Maximum Drain Current (ID): 20.5 A -

Capable of handling a maximum drain current of 20.5A for reliable performance.

Maximum Drain-Source On Resistance: 0.0066 ohm -

Low drain-source on resistance for efficient power transfer.

Terminal Position: DUAL -

Dual terminal position for versatile installation options.

Case Connection: DRAIN -

Drain connection for efficient current flow.

Maximum Time At Peak Reflow Temperature (s): 30 -

Can withstand peak reflow temperatures for up to 30 seconds.

Peak Reflow Temperature °C: 260 -

Has a peak reflow temperature of 260°C for reliable soldering.

Technical Specifications

Power Field Effect Transistors (FET) SIR422DP-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

45 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

20.5 A

Maximum Drain-Source On Resistance:

.0066 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

70 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIR422DP-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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