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IRF3205ZSTRLPBF

Infineon Technologies

IRF3205ZSTRLPBF by Infineon Technologies

IRF3205ZSTRLPBF by Infineon Technologies is a power FET with N-channel polarity. It has a min DS breakdown voltage of 55V and can handle a max pulsed drain current of 440A. This transistor is commonly used for switching applications.

Median Price

$1.020

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27

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1k+

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Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$1.820

100+ parts

$1.729

1k+ parts

$1.729

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-

3,000

$1.820

$1.729

$1.729

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Newark

USA . 565 parts In-Stock

1+ parts

$2.670

100+ parts

$1.170

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565

$2.670

$1.170

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Mouser Electronics

USA . 2,424 parts In-Stock

1+ parts

$3.020

100+ parts

$1.330

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$1.010

10k+ parts

$0.943

2,424

$3.020

$1.330

$1.010

$0.943

DigiKey

USA . 4,167 parts In-Stock

1+ parts

$3.240

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$1.431

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$3.240

$1.431

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Element14

Singapore . 759 parts In-Stock

1+ parts

$147.000

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$101.960

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$101.130

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759

$147.000

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$101.130

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Avnet

USA . 16,000 parts In-Stock

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$0.666

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$0.636

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$0.666

$0.636

Arrow

USA . 3,200 parts In-Stock

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$0.633

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$0.602

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$0.602

Verical

USA . 3,200 parts In-Stock

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$0.629

10k+ parts

$0.598

3,200

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$0.598

Rochester

USA . 3,200 parts In-Stock

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-

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$1.020

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$0.847

10k+ parts

$0.755

3,200

-

$1.020

$0.847

$0.755

Chip1Stop

Japan . 2,400 parts In-Stock

1+ parts

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$0.520

10k+ parts

$0.465

2,400

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$0.520

$0.465

Farnell

UK . 596 parts In-Stock

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$0.930

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$0.911

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596

-

$0.930

$0.911

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Nova Conductors

Japan . 10 parts In-Stock

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$1.148

100+ parts

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10

$1.148

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Digiode

USA . 609 parts In-Stock

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$1.558

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609

$1.558

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Maritex

Poland . 100 parts In-Stock

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$1.787

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100

$1.787

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TME

Poland . 37 parts In-Stock

1+ parts

$2.310

100+ parts

$1.160

1k+ parts

$0.801

10k+ parts

$0.650

37

$2.310

$1.160

$0.801

$0.650

Component Electronics Inc.

Canada . 1,462 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

1k+ parts

$5.000

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1,462

$7.690

$5.770

$5.000

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Cyclops Electronics Ltd

UK . 235,200 parts In-Stock

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Chip Stock

USA . 43,500 parts In-Stock

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Connector Distribution Corp

USA . 26,400 parts In-Stock

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26,400

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Right Parts Inc.

USA . 26,400 parts In-Stock

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26,400

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Rutronik

Germany . 3,200 parts In-Stock

1+ parts

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$0.612

10k+ parts

$0.472

3,200

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-

$0.612

$0.472

Vyrian

USA . 2,323 parts In-Stock

1+ parts

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2,323

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ComSIT Distribution GmbH

Germany . 1,865 parts In-Stock

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1,865

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Schukat

Germany . 1,380 parts In-Stock

1+ parts

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$0.746

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$0.599

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1,380

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$0.746

$0.599

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EMSNET

USA . 350 parts In-Stock

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350

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Semi Source

USA . 227 parts In-Stock

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Classic Components Corporation

USA . 35 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,239 parts In-Stock

1+ parts

$0.438

100+ parts

-

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2,239

$0.438

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Ampacity Inc.

Singapore . 1,680 parts In-Stock

1+ parts

$0.442

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1,680

$0.442

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Semicontronic

India . 1,440 parts In-Stock

1+ parts

$0.442

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$0.431

1k+ parts

$0.429

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1,440

$0.442

$0.431

$0.429

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Modulus Dynamics

Lithuania . 7,766 parts In-Stock

1+ parts

$0.911

100+ parts

$0.875

1k+ parts

$0.838

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7,766

$0.911

$0.875

$0.838

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Argo Parts USA

USA . 810 parts In-Stock

1+ parts

$0.985

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810

$0.985

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Corohmni

South Africa . 281 parts In-Stock

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$1.061

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281

$1.061

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.148

100+ parts

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1k+ parts

$1.091

10k+ parts

$1.068

1,000

$1.148

-

$1.091

$1.068

Continental Prestige Electronics

USA . 1,989 parts In-Stock

1+ parts

$1.420

100+ parts

$0.918

1k+ parts

$0.676

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1,989

$1.420

$0.918

$0.676

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Corphita

USA . 465 parts In-Stock

1+ parts

$1.476

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465

$1.476

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.820

100+ parts

$1.729

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$1.729

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3,000

$1.820

$1.729

$1.729

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Microchip USA

USA . 3,151 parts In-Stock

1+ parts

$7.464

100+ parts

$7.464

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$7.464

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$7.464

3,151

$7.464

$7.464

$7.464

$7.464

XScomponents

USA . 270,186 parts In-Stock

1+ parts

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$0.660

270,186

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$0.660

GreenTree Electronics

Israel . 20,000 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Perfect Parts

USA . 18,847 parts In-Stock

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18,847

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Lixinc

USA . 16,488 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,155 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,604 parts In-Stock

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4,604

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Authorized Procurement Solutions

USA . 3,200 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,069 parts In-Stock

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3,069

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Glotronic Ltd.

UK . 2,560 parts In-Stock

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2,560

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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$0.137

1k+ parts

$0.137

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$0.137

350

-

$0.137

$0.137

$0.137

Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.137

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$0.137

10k+ parts

$0.137

350

-

$0.137

$0.137

$0.137

Overview

Discover the power and reliability of the IRF3205ZSTRLPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers exceptional quality and performance with every product. The IRF3205ZSTRLPBF belongs to the category of Power Field Effect Transistors (FET), making it ideal for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers seamless operation and enhanced efficiency. Whether you need to power your industrial equipment or optimize your renewable energy systems, the IRF3205ZSTRLPBF provides the value, benefits, and advantages that customers deserve. Don't settle for anything less than excellence - choose Infineon Technologies for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the power FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for effective control of the power FET, making it suitable for applications that require efficient switching and amplification.

Configuration: SINGLE WITH BUILT-IN DIODE

With a built-in diode, this power FET configuration simplifies circuit design and offers enhanced protection against reverse current flow, making it an excellent choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET delivers fast and efficient performance, ensuring smooth operation and optimal energy transfer.

Surface Mount: YES

Being surface mount compatible, this power FET offers easy installation and integration onto circuit boards, saving valuable space and improving overall system efficiency.

Minimum DS Breakdown Voltage: 55 V

With a minimum breakdown voltage of 55 V, this power FET can handle high voltage applications and offers a reliable and safe solution for various electrical systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for compact and efficient mounting, making it suitable for applications where space is limited.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this power FET offers improved solderability and ease of assembly, ensuring a secure and reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode provides precise control over the power FET, allowing for improved efficiency and accuracy in applications such as switching power supplies and motor control.

No. of Elements: 1

With a single element, this power FET simplifies circuit design and offers reliable performance, making it a cost-effective choice for various applications.

Maximum Pulsed Drain Current (IDM): 440 A

With a high maximum pulsed drain current of 440 A, this power FET can handle large and sudden current spikes, making it suitable for demanding applications that require robust performance.

Avalanche Energy Rating (EAS): 250 mJ

The high avalanche energy rating of 250 mJ ensures reliable and safe operation, providing protection against voltage spikes and transient events.

Maximum Drain Current (Abs) (ID): 110 A

With a maximum drain current of 110 A, this power FET delivers high current handling capacity, making it ideal for applications that require efficient power transfer.

No. of Terminals: 2

Featuring two terminals, this power FET simplifies circuit connections and offers ease of integration, ensuring a straightforward and reliable electrical setup.

Maximum Power Dissipation (Abs): 170 W

This power FET can handle a maximum power dissipation of 170 W, enabling it to operate under high power conditions without compromising performance or reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides space-saving benefits, making it suitable for compact designs where size and weight are important considerations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this power FET offers high performance, low power loss, and improved reliability, making it an excellent choice for a wide range of applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this power FET can withstand elevated temperatures, making it suitable for demanding applications that require reliable performance in challenging environments.

Transistor Element Material: SILICON

Constructed with silicon as the transistor element material, this power FET offers excellent thermal stability, low leakage, and high breakdown voltage characteristics, ensuring reliable operation.

Terminal Finish: MATTE TIN OVER NICKEL

The use of matte tin over nickel terminal finish provides improved solderability and corrosion resistance, enhancing the overall durability and reliability of the power FET.

Maximum Drain Current (ID): 75 A

With a maximum drain current of 75 A, this power FET offers high current handling capabilities, making it suitable for a wide range of power management applications.

Maximum Drain-Source On Resistance: 0.0065 ohm

Featuring a low maximum drain-source on resistance of 0.0065 ohm, this power FET minimizes power loss and improves efficiency, making it an optimal choice for high-performance applications.

Terminal Position: SINGLE

With a single terminal position, this power FET simplifies circuit connections and ensures easy integration into various electronic systems.

Moisture Sensitivity Level (MSL): 1

Having a moisture sensitivity level of 1, this power FET is highly resistant to moisture and offers increased reliability and performance in humid conditions.

Case Connection: DRAIN

The case connection at the drain terminal ensures effective heat dissipation and provides enhanced thermal management, enabling the power FET to operate within its specified temperature limits.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this power FET can withstand the necessary soldering processes without compromising its electrical and mechanical properties.

Peak Reflow Temperature °C: 260

The power FET's ability to withstand a peak reflow temperature of 260°C ensures reliable solder joints, making it suitable for high-temperature applications and reflow soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) IRF3205ZSTRLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

250 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

440 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF3205ZSTRLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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