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FQP27P06_SW82127

Onsemi

FQP27P06_SW82127 by Onsemi

FQP27P06_SW82127 by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage and 108A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and operates in ENHANCEMENT MODE. With a max power dissipation of 120W, this transistor has a -55 to 175 °C operating temperature range.

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3

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1k+

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Digiode

USA . 2,499 parts In-Stock

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Vyrian

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Nova Conductors

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$1.575

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$1.496

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$1.496

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Aztec Data Supply Inc.

USA . 4,327 parts In-Stock

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$1.944

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Semicontronic

India . 610 parts In-Stock

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$6.050

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$5.899

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$5.868

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AZTECH Wire

Italy . 749 parts In-Stock

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Ampacity Inc.

Singapore . 1,236 parts In-Stock

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$51.050

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Problanco Electronics

Mexico . 6,301 parts In-Stock

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Continental Prestige Electronics

USA . 5,746 parts In-Stock

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TANS Electronics

Latvia . 3,635 parts In-Stock

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Supply Digital

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Kulean Microsystems

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Argo Parts USA

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Modulus Dynamics

Lithuania . 750 parts In-Stock

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SupplyDigital Components

Austria . 401 parts In-Stock

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UHIMA Technologies

Türkiye . 366 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 300 parts In-Stock

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Corohmni

South Africa . 257 parts In-Stock

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Overview

Experience the power of innovation with the FQP27P06_SW82127 Power Field Effect Transistor by Onsemi. Designed to meet the highest quality standards, this P-CHANNEL transistor offers seamless switching performance for a wide range of applications. With a maximum drain current of 27 A and an operating temperature range from -55°C to 175°C, this transistor delivers reliable and efficient results every time. Trust in Onsemi's expertise and elevate your projects with the FQP27P06_SW82127.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the outer casing of the power FET.

Polarity or Channel Type: P-CHANNEL

Suitable for applications requiring P-channel transistors, providing flexibility in circuit design.

Minimum DS Breakdown Voltage: 60 V

Can handle high voltage applications, providing reliability and safety.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for specific circuit requirements.

Maximum Power Dissipation (Abs): 120 W

High power dissipation capability for handling heavy loads.

Maximum Drain Current (ID): 27 A

High drain current rating for efficient operation in various applications.

Maximum Operating Temperature: 175 °C

Can withstand high temperatures, suitable for industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) FQP27P06_SW82127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

560 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

155 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

260 ns

Maximum Turn On Time (ton):

425 ns

Trade Compliance

FQP27P06_SW82127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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