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FQP24N08

Onsemi

FQP24N08 by Onsemi

FQP24N08 by Onsemi is a Power FET with 80V DS Breakdown Voltage, 96A IDM, and 0.06 ohm RDS. Ideal for switching applications in enhancement mode operation, it features a single configuration with built-in diode. With a max power dissipation of 75W and operating temperature up to 175 °C, this N-channel transistor is suitable for various high-power electronic designs.

Median Price

$0.508

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 531 parts In-Stock

1+ parts

$0.508

100+ parts

$0.478

1k+ parts

$0.432

10k+ parts

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531

$0.508

$0.478

$0.432

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Distributors (In-Stock)

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Digiode

USA . 1,453 parts In-Stock

1+ parts

$0.483

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1,453

$0.483

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DF Sales Co.

USA . 76 parts In-Stock

1+ parts

$0.950

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76

$0.950

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DF Sales Co.

USA . 76 parts In-Stock

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$0.950

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76

$0.950

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Vyrian

USA . 8,736 parts In-Stock

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Flip Electronics

USA . 1,000 parts In-Stock

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EMSNET

USA . 402 parts In-Stock

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402

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Distributors (Availability)

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Corphita

USA . 853 parts In-Stock

1+ parts

$0.457

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853

$0.457

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Corohmni

South Africa . 312 parts In-Stock

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$0.508

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312

$0.508

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Native Components

USA . 107 parts In-Stock

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$7.865

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107

$7.865

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Northwest PG Solutions

USA . 1,001 parts In-Stock

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$8.651

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$7.786

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1,001

$8.651

$7.786

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RC Electronics

USA . 92,416 parts In-Stock

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$0.640

1k+ parts

$0.590

10k+ parts

$0.570

92,416

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$0.640

$0.590

$0.570

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,550 parts In-Stock

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Problanco Electronics

Mexico . 3,676 parts In-Stock

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Supply Digital

USA . 2,830 parts In-Stock

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Perfect Parts

USA . 2,006 parts In-Stock

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TANS Electronics

Latvia . 1,706 parts In-Stock

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Kulean Microsystems

USA . 1,607 parts In-Stock

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SupplyDigital Components

Austria . 1,242 parts In-Stock

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1,242

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 620 parts In-Stock

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620

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of innovation with the FQP24N08 by Onsemi! Crafted with precision and expertise, this Power Field Effect Transistor is designed to elevate your switching applications to new heights. With a robust build and cutting-edge technology, this N-CHANNEL transistor offers unrivaled performance and reliability. Whether you're looking to optimize your power management system or enhance your electronic designs, the FQP24N08 is the ultimate solution. Trust Onsemi for superior quality and efficiency in every component. Elevate your projects with the FQP24N08 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher mobility, making them efficient for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode simplifies circuit design and protects against reverse voltage, increasing reliability and efficiency.

Minimum DS Breakdown Voltage: 80 V

The high minimum breakdown voltage allows for operation in high voltage applications, providing reliable performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in power control circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors require positive gate voltage to turn on, offering precise control over the switching process.

Maximum Power Dissipation (Abs): 75 W

With a high maximum power dissipation rating, this FET can handle significant power levels without overheating, ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high electron mobility and low gate leakage, providing efficient performance in power applications.

Maximum Drain-Source On Resistance: 0.06 ohm

The low on-resistance of 0.06 ohm results in minimal power loss and higher efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) FQP24N08 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

230 mJ

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP24N08 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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