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IRF3415STRLPBF

Infineon Technologies

IRF3415STRLPBF by Infineon Technologies

IRF3415STRLPBF by Infineon is a N-CHANNEL FET with 150V DS Breakdown Voltage and 43A Max Drain Current. It is used for SWITCHING applications, featuring a built-in DIODE, 0.042 ohm Max RDS(on), and 150A IDM. The transistor operates in ENHANCEMENT MODE, has a GULL WING terminal form, and comes in a SMALL OUTLINE package style.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

31

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1k+

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Adafruit Industries

USA . 500 parts In-Stock

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$0.554

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$0.526

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$0.554

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Chip1Stop

Japan . 3,486 parts In-Stock

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Mouser Electronics

USA . 1,858 parts In-Stock

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$1.260

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Newark

USA . 1,884 parts In-Stock

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Element14

Singapore . 1,469 parts In-Stock

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$1.990

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Future Electronics

Canada . 49,600 parts In-Stock

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Arrow

USA . 36,000 parts In-Stock

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Verical

USA . 36,000 parts In-Stock

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EBV Elektronik

Germany . 8,000 parts In-Stock

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DigiKey

USA . 3,578 parts In-Stock

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Avnet

USA . 1,600 parts In-Stock

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Farnell

UK . 1,469 parts In-Stock

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Digiode

USA . 557 parts In-Stock

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$0.526

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Nova Conductors

Japan . 10 parts In-Stock

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IBS Electronics

USA . 57,600 parts In-Stock

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Chip Stock

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Sensible Micro Corp

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Bristol Electronics

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Inventory MP

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Vyrian

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Cyclops Electronics Ltd

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NAC Semi

USA . 1,600 parts In-Stock

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$1.950

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$1.770

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Rutronik

Germany . 800 parts In-Stock

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$0.938

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$0.723

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$0.723

EPE Components Inc.

USA . 663 parts In-Stock

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Schukat

Germany . 540 parts In-Stock

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$0.658

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$0.547

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ComSIT Distribution GmbH

Germany . 513 parts In-Stock

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North Shore Components

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ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

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Dan-Mar Components

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Classic Components Corporation

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Prism Electronics

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Aztec Data Supply Inc.

USA . 3,707 parts In-Stock

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$0.333

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Semicontronic

India . 2,368 parts In-Stock

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$0.471

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$0.459

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$0.457

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2,368

$0.471

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Ampacity Inc.

Singapore . 2,298 parts In-Stock

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$0.471

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Corphita

USA . 896 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.554

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$0.526

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500

$0.554

$0.526

$0.526

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Modulus Dynamics

Lithuania . 12,180 parts In-Stock

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$1.125

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$1.080

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$1.035

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Argo Parts USA

USA . 3,936 parts In-Stock

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$1.259

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Netroflash

USA . 500 parts In-Stock

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$1.303

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$1.237

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$1.211

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$1.303

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$1.211

Corohmni

South Africa . 229 parts In-Stock

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$1.836

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Perfect Parts

USA . 35,876 parts In-Stock

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Lixinc

USA . 16,889 parts In-Stock

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Eastek

USA . 5,600 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,967 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,311 parts In-Stock

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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Robosynatics

Brazil . 1,516 parts In-Stock

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$0.093

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Lucentia Tech

USA . 1,516 parts In-Stock

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$0.093

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$0.093

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$0.093

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Assy Fe

Spain . 1,195 parts In-Stock

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XScomponents

USA . 775 parts In-Stock

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Continental Prestige Electronics

USA . 530 parts In-Stock

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Kepictronics

USA . 238 parts In-Stock

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Overview

Enhance your power system with the IRF3415STRLPBF by Infineon Technologies, a top-tier manufacturer known for superior quality in Power Field Effect Transistors. Ideal for switching applications, this N-channel transistor offers a single configuration with a built-in diode, providing high performance and reliability. With a maximum pulsed drain current of 150A and a minimum DS breakdown voltage of 150V, this transistor ensures efficient operation. Upgrade your system with the IRF3415STRLPBF and experience enhanced power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount technology allows for easy and secure placement on circuit boards.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle higher voltages without failure.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and secure in different applications.

Terminal Form: GULL WING

Gull wing terminals provide a strong and reliable connection for secure circuit operation.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control and efficient performance.

Maximum Pulsed Drain Current (IDM): 150 A

A high pulsed drain current allows for handling of sudden surges of current.

Avalanche Energy Rating (EAS): 590 mJ

The high avalanche energy rating ensures reliability under extreme conditions.

No. of Terminals: 2

A two-terminal design simplifies circuit connections and reduces complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space and provides flexibility in design layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low power consumption and high switching speeds.

Transistor Element Material: SILICON

Silicon material provides stability and reliability for consistent performance.

Terminal Finish: MATTE TIN OVER NICKEL

The terminal finish helps in preventing corrosion and ensures long-term usability.

Maximum Drain Current (ID): 43 A

With a high drain current rating, this FET can handle substantial loads without overheating.

Maximum Drain-Source On Resistance: 0.042 ohm

Low on-resistance minimizes power loss and heat generation in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and improves reliability.

Case Connection: DRAIN

Drain connection allows for easy heat dissipation and efficient circuit operation.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand peak reflow temperatures for a specified time, ensuring durability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliable connection in different environments.

Technical Specifications

Power Field Effect Transistors (FET) IRF3415STRLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

590 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

43 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF3415STRLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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