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NTB35N15

Onsemi

NTB35N15 by Onsemi

NTB35N15 by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage and 37A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 111A Pulsed Drain Current, and 0.05 ohm On Resistance. Suitable for surface mount with GULL WING terminals in a RECTANGULAR package style.

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1k+

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Vyrian

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ACDS - Activité Composants Distribution Service

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SupplyDigital Components

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TANS Electronics

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Corphita

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Kulean Microsystems

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UHIMA Technologies

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Overview

Looking for a reliable Power Field Effect Transistor for your switching applications? Look no further than the NTB35N15 by Onsemi. With a quality build and a maximum DS Breakdown Voltage of 150V, this N-CHANNEL transistor offers exceptional performance and reliability. Whether you need it for industrial, automotive, or consumer electronics, this single configuration transistor with a built-in diode is sure to meet your needs. Trust Onsemi's expertise in semiconductor technology and enhance your products with the NTB35N15.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the transistor, ensuring longevity and ease of handling during installation.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high electron mobility and faster switching speeds, making them suitable for applications requiring efficient performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protection against reverse voltage and inductive kickback, minimizing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable operation and efficient power control in various electronic circuits.

Surface Mount: YES

Facilitates easy and space-saving PCB mounting, allowing for high component density and streamlined manufacturing processes.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, enhancing its reliability in demanding applications.

Maximum Pulsed Drain Current (IDM): 111 A

Capable of handling high currents in short pulses, making it suitable for applications that require robust power handling capabilities.

Maximum Power Dissipation (Abs): 178 W

This high power dissipation rating allows the transistor to operate efficiently under heavy load conditions without overheating.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB35N15 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

37 A

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

111 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB35N15 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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