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NTB30N06LT4

Onsemi

NTB30N06LT4 by Onsemi

NTB30N06LT4 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, 30A Drain Current, and 0.046 ohm On Resistance. Ideal for SWITCHING applications, it features a 90A Pulsed Drain Current and 101mJ Avalanche Energy Rating. The PLASTIC/EPOXY package with GULL WING terminals operates in ENHANCEMENT MODE up to 175 °C.

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Vyrian

USA . 4,942 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 967 parts In-Stock

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Kulean Microsystems

USA . 8,090 parts In-Stock

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SupplyDigital Components

Austria . 6,302 parts In-Stock

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Problanco Electronics

Mexico . 4,314 parts In-Stock

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Corphita

USA . 1,568 parts In-Stock

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TANS Electronics

Latvia . 1,162 parts In-Stock

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Corohmni

South Africa . 404 parts In-Stock

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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Overview

Unleash the power of innovation with the NTB30N06LT4 by Onsemi, a high-quality Power Field Effect Transistor that guarantees superior performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL FET is designed for switching applications with a built-in diode for added convenience. With a maximum drain current of 30 A and a minimum DS breakdown voltage of 60 V, this transistor offers unmatched efficiency and durability. Whether you're in need of enhanced power management solutions or seeking to optimize your electronics, the NTB30N06LT4 delivers value, benefits, and advantages that will exceed your expectations. Elevate your projects with this cutting-edge component and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material is lightweight and durable, making the FET easy to handle and resistant to damage.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage spikes, ensuring the FET's reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and low power dissipation.

Surface Mount: YES

Being surface mountable, this FET is easy to integrate onto PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltage levels, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 90 A

The high pulsed drain current rating allows this FET to handle brief current spikes without overheating, ensuring reliability under high load conditions.

Avalanche Energy Rating (EAS): 101 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage transients and power surges, ensuring long-term reliability.

Maximum Power Dissipation (Abs): 88.2 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.046 ohm

The low ON-resistance of the FET reduces power loss and heat generation, making it efficient for high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB30N06LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

101 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

90 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB30N06LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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