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IRF7416TRPBF-1

Infineon Technologies

IRF7416TRPBF-1 by Infineon Technologies

Infineon's IRF7416TRPBF-1 is a P-CHANNEL FET with 10A max drain current and 2.5W power dissipation. Ideal for applications requiring high power efficiency in surface mount configurations, such as power supplies and motor control systems operating up to 150°C.

Median Price

$0.942

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 500 parts In-Stock

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$0.942

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$0.895

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$0.895

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500

$0.942

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Digiode

USA . 394 parts In-Stock

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$0.895

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Nova Conductors

Japan . 66 parts In-Stock

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Q Components

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Vyrian

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Semicontronic

India . 484 parts In-Stock

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$0.800

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$0.780

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$0.776

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484

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Ampacity Inc.

Singapore . 16 parts In-Stock

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$0.800

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Corphita

USA . 443 parts In-Stock

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$0.848

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.942

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$0.895

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$0.895

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$0.942

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Aztec Data Supply Inc.

USA . 183 parts In-Stock

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$1.437

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Corohmni

South Africa . 171 parts In-Stock

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Modulus Dynamics

Lithuania . 3,570 parts In-Stock

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$1.734

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$1.665

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$1.595

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AZTECH Wire

Italy . 377 parts In-Stock

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$12.989

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Microchip USA

USA . 5,817 parts In-Stock

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Continental Prestige Electronics

USA . 2,618 parts In-Stock

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Argo Parts USA

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 69 parts In-Stock

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Overview

Discover the power of Infineon Technologies with the IRF7416TRPBF-1 Power Field Effect Transistor. With a P-CHANNEL configuration and METAL-OXIDE SEMICONDUCTOR technology, this FET offers unrivaled performance and efficiency. Ideal for a range of applications, from power supplies to motor control, this transistor provides reliable operation at a maximum temperature of 150°C. Trust in Infineon's reputation for quality and innovation, and experience the benefits of superior power management with the IRF7416TRPBF-1.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-Channel FETs are known for their lower ON-state resistance compared to N-Channel FETs, making them suitable for high efficiency applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and require less circuitry, making them more cost-effective and easier to integrate into designs.

Surface Mount: YES

Surface mount FETs are compact, saving valuable board space and allowing for higher component density in the design.

Maximum Drain Current (Abs) (ID): 10 A

With a high maximum drain current rating of 10 A, this FET can handle high power applications with ease, providing reliable performance.

Maximum Power Dissipation (Abs): 2.5 W

The low maximum power dissipation of 2.5 W ensures that the FET operates efficiently and does not overheat under normal operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs are known for their reliability and fast switching speeds, making them suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this FET can withstand elevated temperatures without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) IRF7416TRPBF-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Trade Compliance

IRF7416TRPBF-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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