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FDS6675

Onsemi

FDS6675 by Onsemi

FDS6675 by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 11A Drain Current, 0.014 ohm On Resistance, and operates in ENHANCEMENT MODE. With a max power dissipation of 2.5W and operating temperature range from -55 to 150 °C, it is suitable for various electronic designs.

Median Price

$1.105

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,000 parts In-Stock

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$0.913

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$0.867

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$0.867

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$0.913

$0.867

$0.867

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DigiKey

USA . 1,140 parts In-Stock

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$1.120

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$0.456

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$0.318

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Farnell

UK . 4,252 parts In-Stock

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Rochester

USA . 464 parts In-Stock

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$1.150

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$0.952

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$0.849

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$0.849

Distributors (In-Stock)

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Digiode

USA . 356 parts In-Stock

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$0.770

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Nova Conductors

Japan . 650 parts In-Stock

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$0.915

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$0.915

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Component Electronics Inc.

Canada . 500 parts In-Stock

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$3.850

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$2.880

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$2.500

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$3.850

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NAC Semi

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Chip Stock

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DigiKey Marketplace

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LIBRA Elektronik GmbH

Germany . 4,846 parts In-Stock

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Eagle Technology Solutions

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Mil-Aero Solutions, Inc.

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North Shore Components

USA . 2,177 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 1,485 parts In-Stock

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Beltway Electronics Company

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Carlin Systems, Inc.

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ABC Electronics Ltd.

UK . 98 parts In-Stock

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J2 Sourcing AB

Sweden . 96 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 67 parts In-Stock

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Prism Electronics

USA . 67 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 58 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 48 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,123 parts In-Stock

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$0.690

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$0.690

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Semicontronic

India . 1,977 parts In-Stock

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$0.690

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$0.673

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$0.669

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Corphita

USA . 1,406 parts In-Stock

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$0.729

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Corohmni

South Africa . 307 parts In-Stock

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$0.810

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$0.913

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$0.867

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$0.867

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$0.913

$0.867

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Argo Parts USA

USA . 4,905 parts In-Stock

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$0.915

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Component Stockers USA

USA . 9,561 parts In-Stock

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$0.960

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$0.900

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$0.820

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9,561

$0.960

$0.900

$0.820

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Aztec Data Supply Inc.

USA . 2,474 parts In-Stock

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$1.440

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Microchip USA

USA . 297 parts In-Stock

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$5.850

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Perfect Parts

USA . 25,200 parts In-Stock

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Continental Prestige Electronics

USA . 9,120 parts In-Stock

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Kulean Microsystems

USA . 6,765 parts In-Stock

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Problanco Electronics

Mexico . 6,195 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,907 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 2,489 parts In-Stock

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Assy Fe

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Supply Digital

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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iodParts Technologies Inc.

India . 67 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 67 parts In-Stock

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Glotronic Ltd.

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Overview

Elevate your electronics with the FDS6675 by Onsemi! This high-quality P-Channel Small Signal Field Effect Transistor (FET) offers exceptional performance in switching applications. With a maximum drain current of 11A and a low on-resistance of 0.014 ohm, this transistor provides reliable power management while operating at temperatures ranging from -55 to 150°C. Manufactured by Onsemi, a trusted leader in semiconductor technology, the FDS6675 guarantees top-notch quality and durability. Whether you're designing consumer electronics or industrial controls, this transistor's built-in diode and enhancement mode configuration will streamline your processes and enhance overall efficiency. Experience the value and benefits this cutting-edge product delivers to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the transistor.

Polarity or Channel Type: P-CHANNEL

Suitable for a wide range of applications, offering versatility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient built-in diode simplifies circuitry and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in these scenarios.

Surface Mount: YES

Allows for easy and secure mounting onto a PCB, ideal for automated manufacturing processes.

Minimum DS Breakdown Voltage: 30 V

High breakdown voltage ensures robustness and protection against voltage spikes.

Package Shape: RECTANGULAR

Compact rectangular shape saves space on the PCB and allows for efficient placement.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connections, ensuring reliable performance in various conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode design offers high gain and low distortion, making it suitable for various signal processing applications.

Maximum Drain Current (Abs) (ID): 11 A

High maximum drain current allows for handling of large currents, making it suitable for power applications.

No. of Terminals: 8

Sufficient number of terminals for versatile connectivity options in circuits.

Maximum Power Dissipation (Abs): 2.5 W

High power dissipation capability ensures the transistor can handle power loads effectively.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and low power consumption.

Maximum Operating Temperature: 150 °C

Wide operating temperature range enables the transistor to function reliably in various environmental conditions.

Transistor Element Material: SILICON

Silicon material provides high reliability and stability for the transistor.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the transistor to operate in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish ensures strong solder connections and prevents corrosion.

Maximum Drain-Source On Resistance: 0.014 ohm

Low on-resistance minimizes power loss and improves efficiency in circuit operation.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and connectivity options.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering process during PCB assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints during manufacturing.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS6675 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS6675 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-530-9034, 5961015309034

NIIN

015309034

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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