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HUF75842P3

Onsemi

HUF75842P3 by Onsemi

HUF75842P3 by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage and 43A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a RECTANGULAR package suitable for ENHANCEMENT MODE operation up to 175°C.

Median Price

$3.940

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 172 parts In-Stock

1+ parts

$3.940

100+ parts

$2.990

1k+ parts

$2.740

10k+ parts

$2.590

172

$3.940

$2.990

$2.740

$2.590

DigiKey

USA . 772 parts In-Stock

1+ parts

$5.450

100+ parts

$2.612

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772

$5.450

$2.612

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Rochester

USA . 1,600 parts In-Stock

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$2.140

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$1.910

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$1.800

1,600

-

$2.140

$1.910

$1.800

Distributors (In-Stock)

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Digiode

USA . 518 parts In-Stock

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$2.670

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518

$2.670

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Vyrian

USA . 1,249 parts In-Stock

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$2.810

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1,249

$2.810

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Electronic Expediters

USA . 1,202 parts In-Stock

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ComSIT Distribution GmbH

Germany . 593 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 400 parts In-Stock

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Semi Source

USA . 61 parts In-Stock

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A2Z Electronics, Inc.

USA . 25 parts In-Stock

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Sunrise Surplus Inc.

USA . 12 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,169 parts In-Stock

1+ parts

$2.529

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1,169

$2.529

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Corohmni

South Africa . 473 parts In-Stock

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$2.810

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473

$2.810

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Andel Nordic

Denmark . 479 parts In-Stock

1+ parts

$9.378

100+ parts

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$9.002

10k+ parts

$9.002

479

$9.378

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$9.002

$9.002

Microchip USA

USA . 6,594 parts In-Stock

1+ parts

$31.265

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6,594

$31.265

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Component Stockers USA

USA . 642 parts In-Stock

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$99.990

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642

$99.990

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Perfect Parts

USA . 10,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,049 parts In-Stock

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Supply Digital

USA . 5,534 parts In-Stock

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SupplyDigital Components

Austria . 3,953 parts In-Stock

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TANS Electronics

Latvia . 3,751 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,734 parts In-Stock

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Problanco Electronics

Mexico . 2,533 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kepictronics

USA . 1,641 parts In-Stock

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iodParts Technologies Inc.

India . 1,604 parts In-Stock

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Kulean Microsystems

USA . 1,094 parts In-Stock

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Assy Fe

Spain . 400 parts In-Stock

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UHIMA Technologies

Türkiye . 206 parts In-Stock

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Overview

Unlock the power of innovation with the HUF75842P3 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for switching applications. With a maximum drain current of 43A and a minimum DS breakdown voltage of 150V, this N-channel transistor offers unmatched performance and reliability. The HUF75842P3 is designed with a built-in diode and operates in enhancement mode, making it ideal for a wide range of applications. Experience the value and benefits of this product today and take your projects to new heights with Onsemi's advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides reliable insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow in the desired direction, enabling better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 150 V

Can withstand high voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Facilitates easy mounting and integration into circuit boards.

Terminal Form: THROUGH-HOLE

Enables secure and reliable connections within the circuit.

Operating Mode: ENHANCEMENT MODE

Enhances control over the transistor's behavior, allowing for precise switching operations.

Maximum Drain Current (ID): 43 A

Capable of handling high currents, suitable for demanding applications.

Maximum Power Dissipation (Abs): 230 W

Can dissipate heat effectively, ensuring consistent performance under high power conditions.

Package Style (Meter): FLANGE MOUNT

Enables easy mounting and secure attachment in the intended application.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and efficient technology for power FET applications, ensuring high performance and durability.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Provides good performance characteristics and reliability for the transistor.

Terminal Finish: Matte Tin (Sn) - annealed

Ensures good electrical conductivity and corrosion resistance for the terminals.

Maximum Drain-Source On Resistance: 0.042 ohm

Low on-resistance leads to minimal power loss and improved efficiency in switching applications.

Terminal Position: SINGLE

Simplifies circuit layout and connection, ensuring easy integration.

Case Connection: DRAIN

Provides easy access to the drain terminal for external connections.

Technical Specifications

Power Field Effect Transistors (FET) HUF75842P3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

43 A

Maximum Drain Current (ID):

43 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

HUF75842P3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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