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IPB120P04P4L03ATMA2

Infineon Technologies

IPB120P04P4L03ATMA2 by Infineon Technologies

IPB120P04P4L03ATMA2 by Infineon is a P-CHANNEL FET with 40V DS Breakdown Voltage, 480A IDM, and 0.0049 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$3.175

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 345 parts In-Stock

1+ parts

$1.950

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345

$1.950

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Verical

USA . 345 parts In-Stock

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$3.678

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$1.819

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$1.599

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345

$3.678

$1.819

$1.599

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Mouser Electronics

USA . 3,166 parts In-Stock

1+ parts

$4.260

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$2.080

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$1.620

10k+ parts

$1.520

3,166

$4.260

$2.080

$1.620

$1.520

DigiKey

USA . 16,168 parts In-Stock

1+ parts

$4.580

100+ parts

$2.095

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$1.710

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16,168

$4.580

$2.095

$1.710

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Arrow

USA . 8,000 parts In-Stock

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$1.236

10k+ parts

$1.196

8,000

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$1.236

$1.196

EBV Elektronik

Germany . 1,000 parts In-Stock

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RS (Exports)

UK . 725 parts In-Stock

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$3.175

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$2.720

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725

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$3.175

$2.720

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Rochester

USA . 254 parts In-Stock

1+ parts

-

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$1.200

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$1.070

10k+ parts

$1.010

254

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$1.200

$1.070

$1.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 46 parts In-Stock

1+ parts

$1.330

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46

$1.330

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Nova Conductors

Japan . 550 parts In-Stock

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$2.590

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$2.590

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Chip Stock

USA . 23,630 parts In-Stock

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IBS Electronics

USA . 5,000 parts In-Stock

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$4.558

10k+ parts

$4.502

5,000

-

-

$4.558

$4.502

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

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$2.510

10k+ parts

$2.320

3,000

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$2.510

$2.320

Vyrian

USA . 2,212 parts In-Stock

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Bristol Electronics

USA . 44 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,527 parts In-Stock

1+ parts

$0.496

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2,527

$0.496

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Modulus Dynamics

Lithuania . 4,458 parts In-Stock

1+ parts

$0.825

100+ parts

$0.792

1k+ parts

$0.759

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4,458

$0.825

$0.792

$0.759

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Ampacity Inc.

Singapore . 2,034 parts In-Stock

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$1.190

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2,034

$1.190

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Semicontronic

India . 1,641 parts In-Stock

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$1.190

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$1.160

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$1.154

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1,641

$1.190

$1.160

$1.154

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Corphita

USA . 568 parts In-Stock

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$1.260

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568

$1.260

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Corohmni

South Africa . 306 parts In-Stock

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$1.954

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$1.954

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Continental Prestige Electronics

USA . 4,802 parts In-Stock

1+ parts

$2.270

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$2.225

4,802

$2.270

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$2.225

Argo Parts USA

USA . 863 parts In-Stock

1+ parts

$2.270

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863

$2.270

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$2.397

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$2.397

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$2.397

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2,000

$2.397

$2.397

$2.397

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$2.590

100+ parts

$2.460

1k+ parts

$2.337

10k+ parts

$2.305

100

$2.590

$2.460

$2.337

$2.305

Microchip USA

USA . 3,009 parts In-Stock

1+ parts

$12.814

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Robosynatics

Brazil . 145 parts In-Stock

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Lucentia Tech

USA . 145 parts In-Stock

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$1.791

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$1.755

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$1.755

145

-

$1.791

$1.755

$1.755

Overview

Unlock the power of Infineon Technologies with the IPB120P04P4L03ATMA2 Power Field Effect Transistor. Experience top-notch quality and cutting-edge technology in a single package, perfect for a variety of applications. With its P-Channel configuration and built-in diode, this transistor offers unrivaled performance and efficiency. Say goodbye to overheating and hello to seamless operation with a maximum power dissipation of 136W. Trust Infineon Technologies to deliver exceptional products that exceed expectations. Elevate your projects today with the IPB120P04P4L03ATMA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel transistors typically have lower on-resistance compared to N-channel transistors, making them suitable for high current applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltages without the risk of damage.

Maximum Pulsed Drain Current (IDM): 480 A

The high pulsed drain current rating of 480A allows this FET to handle short-term high current demands effectively.

Avalanche Energy Rating (EAS): 78 mJ

The high avalanche energy rating of 78 mJ indicates that this FET can withstand high energy transient events without failure.

Maximum Power Dissipation (Abs): 136 W

With a maximum power dissipation of 136W, this FET can handle high power loads effectively without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures that this FET can operate reliably in high temperature environments.

Maximum Drain Current (ID): 120 A

The high drain current rating of 120A allows this FET to handle high continuous current loads efficiently.

Maximum Drain-Source On Resistance: 0.0049 ohm

The low drain-source on-resistance of 0.0049 ohm results in minimal power loss and improved efficiency in conducting current.

Technical Specifications

Power Field Effect Transistors (FET) IPB120P04P4L03ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

78 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0049 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

270 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB120P04P4L03ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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