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IPB180P04P4L02ATMA1

Infineon Technologies

IPB180P04P4L02ATMA1 by Infineon Technologies

Infineon's IPB180P04P4L02ATMA1 is a P-CHANNEL FET with 40V DS Breakdown Voltage, 0.0039 ohm RDS(on), and 180A ID. Ideal for SWITCHING applications in automotive (AEC-Q101) due to its 720A IDM and 84mJ EAS ratings.

Median Price

$2.804

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,641 parts In-Stock

1+ parts

$3.520

100+ parts

$2.200

1k+ parts

$2.030

10k+ parts

-

1,641

$3.520

$2.200

$2.030

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$3.850

100+ parts

$2.480

1k+ parts

$2.060

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1,000

$3.850

$2.480

$2.060

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DigiKey

USA . 99 parts In-Stock

1+ parts

$4.150

100+ parts

-

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$1.482

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99

$4.150

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$1.482

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Element14

Singapore . 4,327 parts In-Stock

1+ parts

$7.270

100+ parts

$3.910

1k+ parts

$2.750

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4,327

$7.270

$3.910

$2.750

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Rochester

USA . 38,940 parts In-Stock

1+ parts

-

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$1.480

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$1.330

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$1.250

38,940

-

$1.480

$1.330

$1.250

Verical

USA . 27,247 parts In-Stock

1+ parts

-

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$1.663

10k+ parts

$1.563

27,247

-

-

$1.663

$1.563

RS (Exports)

UK . 12,801 parts In-Stock

1+ parts

-

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$2.084

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12,801

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-

$2.084

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.088

10k+ parts

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1,000

-

-

$2.088

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Distributors (In-Stock)

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Digiode

USA . 627 parts In-Stock

1+ parts

$1.568

100+ parts

-

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627

$1.568

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Chip Stock

USA . 22,210 parts In-Stock

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22,210

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Vyrian

USA . 5,408 parts In-Stock

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5,408

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ComSIT Distribution GmbH

Germany . 1,019 parts In-Stock

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1,019

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South Electronics

USA . 126 parts In-Stock

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126

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Velocity Electronics

USA . 20 parts In-Stock

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20

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Prism Electronics

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$1.341

100+ parts

$1.274

1k+ parts

$1.274

10k+ parts

-

16

$1.341

$1.274

$1.274

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Semicontronic

India . 10,558 parts In-Stock

1+ parts

$1.400

100+ parts

$1.365

1k+ parts

$1.358

10k+ parts

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10,558

$1.400

$1.365

$1.358

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Ampacity Inc.

Singapore . 10,436 parts In-Stock

1+ parts

$1.400

100+ parts

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10,436

$1.400

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Corphita

USA . 135 parts In-Stock

1+ parts

$1.485

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135

$1.485

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Benley Electronics

USA . 5 parts In-Stock

1+ parts

$1.500

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5

$1.500

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Aztec Data Supply Inc.

USA . 4,074 parts In-Stock

1+ parts

$1.642

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4,074

$1.642

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Corohmni

South Africa . 933 parts In-Stock

1+ parts

$1.830

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933

$1.830

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Modulus Dynamics

Lithuania . 350 parts In-Stock

1+ parts

$1.930

100+ parts

$1.853

1k+ parts

$1.776

10k+ parts

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350

$1.930

$1.853

$1.776

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Continental Prestige Electronics

USA . 8,258 parts In-Stock

1+ parts

$4.490

100+ parts

$2.900

1k+ parts

$2.020

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8,258

$4.490

$2.900

$2.020

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Microchip USA

USA . 6,928 parts In-Stock

1+ parts

$16.100

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6,928

$16.100

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 9,631 parts In-Stock

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9,631

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Perfect Parts

USA . 7,840 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Glotronic Ltd.

UK . 800 parts In-Stock

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800

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Argo Parts USA

USA . 480 parts In-Stock

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480

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Bastille Electronics

Australia . 17 parts In-Stock

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17

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Overview

Discover the power of innovation with the IPB180P04P4L02ATMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications, from switching to enhancement mode operation. With a maximum drain current of 180A and a low on-resistance of 0.0039 ohm, this P-channel transistor offers unmatched performance and reliability. Trust in Infineon for cutting-edge technology and superior products that will elevate your projects to new heights. Experience the difference with Infineon today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type: P-CHANNEL

The P-channel design allows for efficient current flow and low power consumption, making this FET suitable for power-saving applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit designs and enhances functionality, making this FET a convenient choice for switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers high performance and reliability in controlling electrical signals.

Surface Mount: YES

This FET is compatible with surface mount technology, allowing for easy integration onto circuit boards and saving space in compact designs.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle high voltage levels without the risk of damage, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy mounting and secure connection, making this FET a practical choice for various electronic setups.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring reliable performance in any application.

Operating Mode: ENHANCEMENT MODE

This FET operates in enhancement mode, offering precise control over signal amplification and making it ideal for signal processing applications.

Maximum Pulsed Drain Current (IDM): 720 A

With a high pulsed drain current rating, this FET can handle surge currents effectively, making it suitable for heavy-duty applications.

Avalanche Energy Rating (EAS): 84 mJ

The high avalanche energy rating of this FET ensures reliable operation during power surges, making it a dependable choice for tough conditions.

No. of Terminals: 6

With six terminals, this FET offers versatile connectivity options, allowing for flexible integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits while maintaining high performance, making this FET ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET provides efficient signal processing and low power consumption, making it a cost-effective choice for various applications.

Transistor Element Material: SILICON

Made of silicon, this FET offers high thermal conductivity and stability, ensuring long-term reliability in demanding environments.

Terminal Finish: Tin (Sn)

The tin terminal finish enhances connectivity and resistance to corrosion, ensuring stable performance over time in various operating conditions.

Maximum Drain Current (ID): 180 A

With a high drain current rating, this FET can handle heavy loads effectively, making it a reliable choice for power applications.

Maximum Drain-Source On Resistance: 0.0039 ohm

The low drain-source on resistance of this FET allows for efficient current flow and minimal power loss, making it suitable for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and circuit design, making this FET easy to use and integrate into various systems.

Case Connection: DRAIN

The drain case connection offers efficient heat dissipation and safe operation, making this FET a reliable choice for high-power applications.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 standard, this FET meets stringent quality and reliability requirements, making it suitable for automotive and industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB180P04P4L02ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB180P04P4L02ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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