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IPB107N20N3G

Infineon Technologies

IPB107N20N3G by Infineon Technologies

IPB107N20N3G by Infineon Technologies is a power FET with N-channel configuration and a min DS breakdown voltage of 200V. It is suitable for switching applications, offering a max pulsed drain current of 352A and an avalanche energy rating of 560mJ.

Median Price

$7.482

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,992 parts In-Stock

1+ parts

$7.130

100+ parts

$3.440

1k+ parts

$2.700

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3,992

$7.130

$3.440

$2.700

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Verical

USA . 1,000 parts In-Stock

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$7.834

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$7.204

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$7.834

$7.204

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Distributors (In-Stock)

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Maritex

Poland . 5,013 parts In-Stock

1+ parts

$1.978

100+ parts

$1.347

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$1.141

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5,013

$1.978

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Digiode

USA . 120 parts In-Stock

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$6.906

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120

$6.906

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

USA . 4,949 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,465 parts In-Stock

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ComSIT USA

USA . 1,465 parts In-Stock

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Semtec, LLC

USA . 1,335 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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$3.790

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$3.790

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Sensible Micro Corp

USA . 190 parts In-Stock

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HZD GmbH

Germany . 55 parts In-Stock

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Bristol Electronics

USA . 30 parts In-Stock

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$2.016

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$2.016

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Sunrise Surplus Inc.

USA . 16 parts In-Stock

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Elcom Components

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,700 parts In-Stock

1+ parts

$0.549

100+ parts

$0.527

1k+ parts

$0.505

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20,700

$0.549

$0.527

$0.505

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Corohmni

South Africa . 46 parts In-Stock

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$0.846

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46

$0.846

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$1.181

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$1.122

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$1.122

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60

$1.181

$1.122

$1.122

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Ampacity Inc.

Singapore . 4,890 parts In-Stock

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$4.500

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$4.500

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Semicontronic

India . 4,533 parts In-Stock

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$4.500

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$4.388

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$4.365

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Corphita

USA . 801 parts In-Stock

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$6.543

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CoreStaff

Japan . 1,000 parts In-Stock

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$10.842

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$5.023

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$10.842

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Authorized Procurement Solutions

USA . 24,000 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 20,907 parts In-Stock

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Lixinc

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Kepictronics

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Argo Parts USA

USA . 4,740 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,321 parts In-Stock

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Continental Prestige Electronics

USA . 1,580 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 493 parts In-Stock

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Futuretech Components

Singapore . 126 parts In-Stock

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Overview

Infineon Power MOSFETs are designed to bring more efficiency and power density to designers' products. The full range of OptiMOS™ and StrongIRFET™ N-channel Power MOSFETs enable innovation and performance in applications such as switch mode power supplies (SMPS), motor control and drives, inverters, and computing. The OptiMOS™ and StrongIRFET™ families cover the 20V to 300V range of Power MOSFET products. Infineon offers the OptiMOS™ and StrongIRFET™ product families. These are two highly innovative families that consistently meet the highest quality and performance demands in key specifications for power system design. OptiMOS™ is the market leader in highly efficient solutions for power generation, power supply, and power consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures the product's longevity and ease of handling.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient power handling and improved performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

With a built-in diode, this product simplifies circuit design and enhances the efficiency of power switching.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product delivers fast and reliable performance in various electronic systems.

Surface Mount: YES

The surface mount capability facilitates easy installation and saves valuable space on circuit boards.

Minimum DS Breakdown Voltage: 200 V

With a minimum breakdown voltage of 200 V, this product can handle high voltage requirements, making it suitable for power applications.

Package Shape: RECTANGULAR

The rectangular package shape ensures a standardized form factor, allowing for easy integration into existing systems and designs.

Terminal Form: GULL WING

The gull wing terminal form offers secure and robust electrical connections, minimizing the risk of signal loss or failure.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode provides enhanced switching capabilities and improved power efficiency.

No. of Elements: 1

With a single element, this product offers simplicity and ease of use, making it a cost-effective choice for various applications.

Maximum Pulsed Drain Current (IDM): 352 A

This high maximum pulsed drain current ensures the product's ability to handle heavy-duty power requirements reliably.

Avalanche Energy Rating (EAS): 560 mJ

The high avalanche energy rating indicates the product's resilience and ability to withstand transient voltage spikes and surges effectively.

Maximum Drain Current (Abs) (ID): 88 A

With a maximum drain current of 88 A, this product offers reliable power handling capabilities, making it suitable for demanding applications.

No. of Terminals: 2

The two-terminal configuration ensures simplified installation and enables easy integration into existing circuits and systems.

Maximum Power Dissipation (Abs): 300 W

This high power dissipation rating allows the product to withstand significant power loads, ensuring stable and reliable operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact form factor while maintaining the necessary functionality, making it ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology employed in this product ensures efficient power handling and improved overall performance.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this product can withstand high-temperature environments, making it suitable for various applications.

Transistor Element Material: SILICON

Constructed using silicon, this transistor element material offers excellent electrical properties, ensuring reliable and consistent performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can operate reliably in extremely cold conditions, expanding its application range.

Terminal Finish: TIN

The use of tin as the terminal finish offers excellent conductivity and corrosion resistance, ensuring long-lasting performance.

Maximum Drain Current (ID): 88 A

This high maximum drain current capability allows the product to handle demanding power requirements effectively.

Maximum Drain-Source On Resistance: 0.0107 ohm

The low drain-source on resistance ensures minimal power loss and improved efficiency in power switching applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and ensures easy connectivity, enhancing usability and overall convenience.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product is protected against moisture-related damage, ensuring its reliability and longevity.

Case Connection: DRAIN

The drain case connection provides a secure grounding method and facilitates efficient heat dissipation, enhancing the product's overall performance.

Peak Reflow Temperature °C: 245

This high peak reflow temperature ensures effective soldering during the manufacturing process, resulting in reliable and durable connections.

Technical Specifications

Power Field Effect Transistors (FET) IPB107N20N3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

560 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

88 A

Maximum Drain Current (ID):

88 A

Maximum Drain-Source On Resistance:

.0107 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

352 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB107N20N3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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