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IPB120P04P4L03ATMA1

Infineon Technologies

IPB120P04P4L03ATMA1 by Infineon Technologies

Infineon's IPB120P04P4L03ATMA1 is a P-CHANNEL FET with 40V DS Breakdown Voltage, 120A ID, and 0.0052 ohm RDS(on). Ideal for power applications in small outline packages.

Median Price

$2.818

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 6,055 parts In-Stock

1+ parts

$3.660

100+ parts

$1.640

1k+ parts

$1.240

10k+ parts

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6,055

$3.660

$1.640

$1.240

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Element14

Singapore . 6,095 parts In-Stock

1+ parts

$3.960

100+ parts

$2.360

1k+ parts

$1.980

10k+ parts

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6,095

$3.960

$2.360

$1.980

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RS (Exports)

UK . 920 parts In-Stock

1+ parts

-

100+ parts

$2.818

1k+ parts

$2.624

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920

-

$2.818

$2.624

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Rochester

USA . 275 parts In-Stock

1+ parts

-

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$1.260

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$1.130

10k+ parts

$1.060

275

-

$1.260

$1.130

$1.060

Verical

USA . 275 parts In-Stock

1+ parts

-

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-

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$1.413

10k+ parts

$1.325

275

-

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$1.413

$1.325

Distributors (In-Stock)

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Digiode

USA . 748 parts In-Stock

1+ parts

$1.330

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748

$1.330

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Vyrian

USA . 6,219 parts In-Stock

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6,219

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Elcom Components

USA . 17 parts In-Stock

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17

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Distributors (Availability)

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Semicontronic

India . 5,982 parts In-Stock

1+ parts

$1.160

100+ parts

$1.131

1k+ parts

$1.125

10k+ parts

-

5,982

$1.160

$1.131

$1.125

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Ampacity Inc.

Singapore . 5,954 parts In-Stock

1+ parts

$1.160

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5,954

$1.160

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Corphita

USA . 322 parts In-Stock

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$1.260

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322

$1.260

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Corohmni

South Africa . 45 parts In-Stock

1+ parts

$1.369

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45

$1.369

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Aztec Data Supply Inc.

USA . 3,724 parts In-Stock

1+ parts

$1.542

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-

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3,724

$1.542

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.835

100+ parts

$1.744

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$1.744

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3,000

$1.835

$1.744

$1.744

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Modulus Dynamics

Lithuania . 21,542 parts In-Stock

1+ parts

$1.845

100+ parts

$1.771

1k+ parts

$1.697

10k+ parts

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21,542

$1.845

$1.771

$1.697

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AZTECH Wire

Italy . 273 parts In-Stock

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$12.540

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273

$12.540

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Microchip USA

USA . 7,602 parts In-Stock

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$13.454

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7,602

$13.454

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RC Electronics

USA . 36,993 parts In-Stock

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36,993

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Continental Prestige Electronics

USA . 19,967 parts In-Stock

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$2.350

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$1.730

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19,967

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$2.350

$1.730

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A-Z Elektronik GmbH

Germany . 9,900 parts In-Stock

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Argo Parts USA

USA . 2,081 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Futuretech Components

Singapore . 778 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Perfect Parts

USA . 22 parts In-Stock

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Overview

Enhance your power management solutions with the high-quality IPB120P04P4L03ATMA1 P-Channel Power FET from Infineon Technologies. This single configuration transistor features a built-in diode for improved efficiency and reliable performance in various applications. With a maximum drain current of 120 A and a low on-resistance of 0.0052 ohm, this transistor ensures optimal power delivery and minimal heat dissipation. Trust in Infineon's expertise in semiconductor technology to provide you with a cutting-edge solution for your power needs. Upgrade your systems today with the IPB120P04P4L03ATMA1 and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides sturdy and durable protection for the internal components of the Power FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer lower resistance and faster switching speeds compared to N-channel FETs, making them suitable for high performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the FET helps prevent damage from reverse polarity or voltage spikes, enhancing the reliability of the overall circuit.

Surface Mount: YES

Being surface mountable makes this FET easy to integrate into compact PCB designs, saving space and simplifying assembly.

Maximum Pulsed Drain Current (IDM): 480 A

The high pulsed drain current rating allows for reliable operation in high-current applications such as power supplies and motor control.

Avalanche Energy Rating (EAS): 78 mJ

The high avalanche energy rating indicates the FET's ability to withstand short-term power surges or spikes, ensuring robust performance in demanding environments.

Maximum Drain-Source On Resistance: 0.0052 ohm

The low drain-source on resistance results in minimal power loss and efficient operation, making this FET ideal for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB120P04P4L03ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

78 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

IPB120P04P4L03ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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