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IPB120N06S4H1ATMA2

Infineon Technologies

IPB120N06S4H1ATMA2 by Infineon Technologies

IPB120N06S4H1ATMA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage and 480A IDM. Ideal for power applications, it features 0.0021 ohm Drain-Source On Resistance and 1060mJ Avalanche Energy Rating. AEC-Q101 certified, suitable for automotive industry.

Median Price

$4.180

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 830 parts In-Stock

1+ parts

$4.180

100+ parts

$3.090

1k+ parts

$1.760

10k+ parts

-

830

$4.180

$3.090

$1.760

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Newark

USA . 189 parts In-Stock

1+ parts

$4.180

100+ parts

$3.090

1k+ parts

$1.760

10k+ parts

-

189

$4.180

$3.090

$1.760

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Farnell

UK . 94 parts In-Stock

1+ parts

$4.190

100+ parts

-

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94

$4.190

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Chip1Stop

Japan . 902 parts In-Stock

1+ parts

$4.870

100+ parts

$2.540

1k+ parts

$2.110

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$2.000

902

$4.870

$2.540

$2.110

$2.000

Rochester

USA . 1,240 parts In-Stock

1+ parts

-

100+ parts

$1.760

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$1.570

10k+ parts

$1.480

1,240

-

$1.760

$1.570

$1.480

Element14

Singapore . 943 parts In-Stock

1+ parts

-

100+ parts

$3.600

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$2.900

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943

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$3.600

$2.900

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Verical

USA . 900 parts In-Stock

1+ parts

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$1.962

10k+ parts

$1.850

900

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-

$1.962

$1.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 794 parts In-Stock

1+ parts

$1.862

100+ parts

-

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794

$1.862

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$2.740

100+ parts

-

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39

$2.740

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Chip Stock

USA . 34,620 parts In-Stock

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34,620

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Vyrian

USA . 626 parts In-Stock

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626

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,947 parts In-Stock

1+ parts

$0.581

100+ parts

-

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3,947

$0.581

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Semicontronic

India . 516 parts In-Stock

1+ parts

$1.670

100+ parts

$1.628

1k+ parts

$1.620

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516

$1.670

$1.628

$1.620

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Ampacity Inc.

Singapore . 326 parts In-Stock

1+ parts

$1.670

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326

$1.670

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Corphita

USA . 229 parts In-Stock

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$1.764

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229

$1.764

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Argo Parts USA

USA . 4,103 parts In-Stock

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$2.740

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4,103

$2.740

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Modulus Dynamics

Lithuania . 13,691 parts In-Stock

1+ parts

$2.902

100+ parts

$2.786

1k+ parts

$2.670

10k+ parts

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13,691

$2.902

$2.786

$2.670

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Corohmni

South Africa . 953 parts In-Stock

1+ parts

$2.902

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953

$2.902

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Continental Prestige Electronics

USA . 972 parts In-Stock

1+ parts

$3.220

100+ parts

$2.100

1k+ parts

$1.440

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972

$3.220

$2.100

$1.440

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Microchip USA

USA . 3,636 parts In-Stock

1+ parts

$14.988

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3,636

$14.988

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RC Electronics

USA . 37,756 parts In-Stock

1+ parts

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100+ parts

$2.790

1k+ parts

$2.550

10k+ parts

$2.470

37,756

-

$2.790

$2.550

$2.470

Perfect Parts

USA . 23,421 parts In-Stock

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iodParts Technologies Inc.

India . 23,421 parts In-Stock

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23,421

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the unparalleled quality and reliability of Infineon Technologies with the IPB120N06S4H1ATMA2 Power Field Effect Transistor. This N-CHANNEL FET offers superior performance in a range of applications, from automotive to industrial. With a robust design and built-in diode, this transistor delivers maximum efficiency and power handling capabilities. Trust Infineon Technologies for cutting-edge technology that exceeds expectations and drives innovation. Elevate your projects with the IPB120N06S4H1ATMA2 and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the FET, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and lower ON resistance compared to P-Channel FETs, making them suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for protection against reverse current flow, making this FET suitable for applications where backflow of current needs to be prevented.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages without breakdown, making it suitable for high power applications.

Surface Mount: YES

Surface mount package makes it easy to mount the FET on PCBs and saves space, making it ideal for compact electronic devices.

Maximum Pulsed Drain Current (IDM): 480 A

High maximum pulsed drain current capability allows this FET to handle high current spikes without damage, making it suitable for applications with high current requirements.

Avalanche Energy Rating (EAS): 1060 mJ

High avalanche energy rating indicates the FET's ability to handle high energy pulses, making it suitable for applications with inductive loads or switching operations.

No. of Terminals: 2

With only 2 terminals, this FET is easy to integrate into circuit designs, simplifying the overall design process.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and fast switching speed, making this FET suitable for applications requiring high performance.

Transistor Element Material: SILICON

Silicon-based FETs offer high reliability and temperature stability, making them a good choice for a wide range of applications.

Maximum Drain Current (ID): 120 A

High maximum drain current allows this FET to handle high continuous current flow, making it suitable for power electronics applications.

Maximum Drain-Source On Resistance: 0.0021 ohm

Low ON resistance results in minimal power loss and improved efficiency, making this FET suitable for high power applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality, making this FET suitable for automotive and other demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB120N06S4H1ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

GREEN

Avalanche Energy Rating (EAS):

1060 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0021 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB120N06S4H1ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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