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DMG2305UX-13

Diodes Incorporated

DMG2305UX-13 by Diodes Incorporated

DMG2305UX-13 by Diodes Inc. is a P-channel FET with 20V DS breakdown voltage and 4.2A max drain current, ideal for switching applications. It features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 1.4W. This MOSFET is surface mountable, with Gull Wing terminals and can withstand temperatures up to 150°C.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 234,301 parts In-Stock

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$0.036

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Mouser Electronics

USA . 135,774 parts In-Stock

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$0.148

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$0.096

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Element14

Singapore . 207,142 parts In-Stock

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Verical

USA . 100,000 parts In-Stock

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Farnell

UK . 669 parts In-Stock

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Arrow

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Tomark Electronics Ltd

UK . 4,893 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Maritex

Poland . 58 parts In-Stock

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$0.334

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$0.072

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$0.054

58

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NAC Semi

USA . 2,010,000 parts In-Stock

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Vyrian

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Dan-Mar Components

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Component Sense

UK . 157,674 parts In-Stock

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Chip Stock

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Semtec, LLC

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Rutronik

Germany . 70,000 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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EZ Electronic Parts

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Mil-Aero Solutions, Inc.

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Micros

Poland . 10,000 parts In-Stock

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Partservice

France . 10,000 parts In-Stock

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$0.107

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Micros sp.j. W. Kędra i J. Lic

Poland . 10,000 parts In-Stock

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Elcom Components

USA . 9,320 parts In-Stock

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ACDS - Activité Composants Distribution Service

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IBS Electronics

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NexGen Digital

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ComSIT Distribution GmbH

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Prism Electronics

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LWI Electronics Inc

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Cyclops Electronics Ltd

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Component Stockers USA

USA . 4,269,080 parts In-Stock

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Ampacity Inc.

Singapore . 1,219,053 parts In-Stock

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Semicontronic

India . 1,124,890 parts In-Stock

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Argo Parts USA

USA . 3,834 parts In-Stock

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$0.079

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$0.077

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Netroflash

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 229,651 parts In-Stock

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$0.351

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$0.140

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$0.057

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229,651

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$0.140

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Modulus Dynamics

Lithuania . 2,914 parts In-Stock

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$0.400

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Corohmni

South Africa . 944 parts In-Stock

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Aztec Data Supply Inc.

USA . 553 parts In-Stock

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$1.112

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$1.905

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$1.734

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$1.562

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RC Electronics

USA . 142,502 parts In-Stock

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$0.090

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Kepictronics

USA . 72,000 parts In-Stock

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Lixinc

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iodParts Technologies Inc.

India . 14,230 parts In-Stock

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XScomponents

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Kulean Microsystems

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 2,620 parts In-Stock

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$0.359

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Lucentia Tech

USA . 2,620 parts In-Stock

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$0.359

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,882 parts In-Stock

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Assy Fe

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GreenTree Electronics

Israel . 550 parts In-Stock

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Formix International (Excess)

India . 188 parts In-Stock

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Overview

Power up your projects with the DMG2305UX-13 by Diodes Incorporated. This high-quality P-Channel Power Field Effect Transistor offers reliable switching capabilities in a compact, surface-mount package. With a maximum pulsed drain current of 10A and a low on-resistance of 0.052 ohm, this transistor is ideal for a variety of applications where efficiency and performance are key. Trust Diodes Incorporated to deliver top-notch components that bring value and innovation to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-Channel transistors have lower conduction losses compared to N-Channel transistors, making them more efficient for certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide reverse polarity protection, increasing the convenience and reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and efficient power management in various electronic devices.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation onto printed circuit boards, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages without risk of damage, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 1.4 W

The high power dissipation capability ensures that the FET can handle moderate power levels without overheating, increasing its reliability in operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperatures, suitable for use in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) DMG2305UX-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

4.2 A

Maximum Drain Current (ID):

4.2 A

Maximum Drain-Source On Resistance:

.052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMG2305UX-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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