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IPB100N10S305XT

Infineon Technologies

IPB100N10S305XT by Infineon Technologies

IPB100N10S305XT by Infineon is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 0.0048 ohm RDS(ON). It has 400A IDM, 1445 mJ EAS, and built-in diode. Ideal for power applications requiring high current handling capabilities in a compact package.

Median Price

$3.878

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 78 parts In-Stock

1+ parts

$3.878

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78

$3.878

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Vyrian

USA . 1,000 parts In-Stock

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1,000

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Digiode

USA . 269 parts In-Stock

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269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 34,402 parts In-Stock

1+ parts

$0.610

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34,402

$0.610

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Corohmni

South Africa . 866 parts In-Stock

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$1.025

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866

$1.025

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Modulus Dynamics

Lithuania . 19,088 parts In-Stock

1+ parts

$1.183

100+ parts

$1.136

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$1.088

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19,088

$1.183

$1.136

$1.088

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Argo Parts USA

USA . 3,285 parts In-Stock

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$3.878

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3,285

$3.878

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Continental Prestige Electronics

USA . 2,064 parts In-Stock

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$3.878

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$3.800

2,064

$3.878

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$3.800

AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$9.077

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275

$9.077

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Ampacity Inc.

Singapore . 982 parts In-Stock

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$50.050

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982

$50.050

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Corphita

USA . 508 parts In-Stock

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Bastille Electronics

Australia . 75 parts In-Stock

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Overview

Unlock the power of Infineon Technologies with the IPB100N10S305XT Power Field Effect Transistor. This N-CHANNEL FET boasts a high DS breakdown voltage of 100V and a maximum drain current of 100A, making it ideal for a wide range of applications. With a single configuration and built-in diode, this transistor offers reliable performance and efficiency. Trust in the quality and innovation of Infineon Technologies to deliver superior products that meet your needs. Elevate your next project with the IPB100N10S305XT and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and switching capabilities in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the design and implementation of circuits by combining the FET with a diode for specific applications.

Surface Mount: YES

Allows for easy and secure mounting onto circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 100 V

Ensures reliable operation and protection against voltage spikes or surges in the circuit.

Package Shape: RECTANGULAR

Facilitates easy placement and orientation of the FET on the circuit board during assembly.

Terminal Form: GULL WING

Enables secure electrical connections and efficient heat dissipation in the circuit.

Operating Mode: ENHANCEMENT MODE

Allows for enhanced control and modulation of the FET's conductivity in the circuit.

Maximum Pulsed Drain Current (IDM): 400 A

Supports high current applications and transient loads, making it suitable for power electronics.

Avalanche Energy Rating (EAS): 1445 mJ

Provides protection against voltage spikes and surges, ensuring the FET can withstand high energy events.

No. of Terminals: 2

Simplifies the connection and integration of the FET into the circuit, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

Occupies minimal space on the circuit board, allowing for compact and efficient circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers low power consumption, high efficiency, and fast switching speeds for energy-efficient applications.

Transistor Element Material: SILICON

Provides high reliability, temperature stability, and consistent performance over a wide range of operating conditions.

Maximum Drain Current (ID): 100 A

Supports high current flow through the FET, making it suitable for power-hungry applications and loads.

Maximum Drain-Source On Resistance: 0.0048 ohm

Offers low resistance for efficient power transfer and minimal heat dissipation, improving overall performance.

Terminal Position: SINGLE

Simplifies circuit connections and ensures proper orientation during installation, reducing the risk of errors.

Case Connection: DRAIN

Enables efficient heat dissipation and circuit protection by connecting the FET's drain terminal to the case structure.

Technical Specifications

Power Field Effect Transistors (FET) IPB100N10S305XT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1445 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0048 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB100N10S305XT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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