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FDS4465

Onsemi

FDS4465 by Onsemi

FDS4465 by Onsemi is a P-CHANNEL power field effect transistor (FET) with a min DS breakdown voltage of 20V. It is used for switching applications and has a max drain current of 13.5A and max power dissipation of 2.5W.

Median Price

$1.131

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,448 parts In-Stock

1+ parts

$1.617

100+ parts

$0.794

1k+ parts

$0.581

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2,448

$1.617

$0.794

$0.581

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Mouser Electronics

USA . 406 parts In-Stock

1+ parts

$2.210

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$0.951

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406

$2.210

$0.951

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RS (Exports)

UK . 3,460 parts In-Stock

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$0.700

3,460

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$0.700

Chip1Stop

Japan . 1,762 parts In-Stock

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$0.786

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$0.574

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$0.548

1,762

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$0.786

$0.574

$0.548

Verical

USA . 1,500 parts In-Stock

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$1.224

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$0.789

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$1.224

$0.789

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Master Electronics

USA . 1,500 parts In-Stock

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$1.038

1k+ parts

$0.671

10k+ parts

$0.662

1,500

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$1.038

$0.671

$0.662

Distributors (In-Stock)

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Digiode

USA . 2,646 parts In-Stock

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$0.630

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Forefront Electronics and Design

USA . 2 parts In-Stock

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$0.980

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Maritex

Poland . 3,473 parts In-Stock

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$1.387

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$0.810

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$0.753

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$0.673

3,473

$1.387

$0.810

$0.753

$0.673

Nova Conductors

Japan . 79 parts In-Stock

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$1.679

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TME

Poland . 352 parts In-Stock

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$2.040

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$0.940

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$0.890

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352

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Ozdisan Elektronik

Türkiye . 4,199 parts In-Stock

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$39.207

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Chip Stock

USA . 147,291 parts In-Stock

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Cyclops Electronics Ltd

UK . 28,276 parts In-Stock

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IBS Electronics

USA . 4,000 parts In-Stock

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$1.562

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$0.875

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$0.724

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$0.724

Bristol Electronics

USA . 3,694 parts In-Stock

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North Shore Components

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,258 parts In-Stock

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Semi Source

USA . 1,890 parts In-Stock

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Atlantic Semiconductor

USA . 1,510 parts In-Stock

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ComSIT Distribution GmbH

Germany . 396 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 368 parts In-Stock

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EPE Components Inc.

USA . 308 parts In-Stock

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A&K Electronics

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

USA . 136 parts In-Stock

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Speed Components Ltd

Israel . 119 parts In-Stock

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EMSNET

USA . 12 parts In-Stock

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Executive Electronics, Inc.

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Resion

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LWI Electronics Inc

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,223 parts In-Stock

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$0.580

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$0.580

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Semicontronic

India . 2,631 parts In-Stock

1+ parts

$0.580

100+ parts

$0.566

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$0.563

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2,631

$0.580

$0.566

$0.563

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Corohmni

South Africa . 490 parts In-Stock

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$0.580

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490

$0.580

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Corphita

USA . 1,316 parts In-Stock

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$0.597

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Argo Parts USA

USA . 3,253 parts In-Stock

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$0.805

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Continental Prestige Electronics

USA . 982 parts In-Stock

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$0.805

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$0.789

982

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$0.789

Advanced Electronics

New Zealand . 40 parts In-Stock

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$1.071

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$1.018

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$1.018

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40

$1.071

$1.018

$1.018

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Aztec Data Supply Inc.

USA . 4,652 parts In-Stock

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$1.198

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4,652

$1.198

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Microchip USA

USA . 8,717 parts In-Stock

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$4.764

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Perfect Parts

USA . 213,300 parts In-Stock

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RC Electronics

USA . 57,238 parts In-Stock

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$0.830

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$0.760

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$0.740

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Eastek

USA . 25,000 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Robosynatics

Brazil . 15,746 parts In-Stock

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$0.696

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$0.682

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$0.682

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$0.696

$0.682

$0.682

Lucentia Tech

USA . 15,746 parts In-Stock

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$0.696

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$0.682

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$0.682

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$0.682

$0.682

SupplyDigital Components

Austria . 8,391 parts In-Stock

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Kulean Microsystems

USA . 7,020 parts In-Stock

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Problanco Electronics

Mexico . 4,024 parts In-Stock

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Computer Components Inc. - USA

USA . 3,243 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 1,999 parts In-Stock

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TANS Electronics

Latvia . 1,487 parts In-Stock

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Supply Digital

USA . 1,469 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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500

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Cyclops Electronics Ltd (Excess)

UK . 368 parts In-Stock

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368

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UHIMA Technologies

Türkiye . 242 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 29 parts In-Stock

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Overview

Discover the power of innovation with the FDS4465 by Onsemi. As a leading manufacturer, Onsemi ensures top-notch quality and reliability in every product they create. The FDS4465 is a game-changer in the field of Power Field Effect Transistors (FET). With its P-CHANNEL configuration and built-in diode, it excels in switching applications. Offering maximum convenience, this surface mount transistor boasts a small outline package style and gull-wing terminals. Its impressive maximum drain current of 13.5A and low on-resistance of 0.0085 ohm guarantee optimal performance. Whether you're designing power supplies, motor controls, or battery management systems, the FDS4465 delivers exceptional value, benefits, and advantages to meet your needs. Trust Onsemi for unparalleled expertise and choose the FDS4465 for unmatched results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product durable and resistant to physical damage.

Polarity or Channel Type: P-CHANNEL

With a P-channel design, this power FET provides excellent performance in switching applications, making it a reliable choice for various electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this power FET allows for efficient and reliable switching, enhancing overall performance and simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET ensures fast and efficient switching, making it ideal for a wide range of electronic devices.

Surface Mount: YES

The surface mount capability of this power FET allows for easy and convenient integration into circuit boards, saving space and facilitating manufacturing processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum DS breakdown voltage of 20 V, this power FET can handle higher voltage levels, ensuring reliable operation and providing safety margins for various applications.

Package Shape: RECTANGULAR

The rectangular package shape of this power FET offers a compact form factor, enabling easy integration into tight spaces and ensuring efficient use of PCB real estate.

Terminal Form: GULL WING

The gull-wing terminal form allows for simple and reliable soldering, ensuring secure connections and facilitating manufacturing processes.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode, this power FET offers enhanced control and flexibility in various switching applications, making it a versatile choice for electronic devices.

No. of Elements: 1

With a single element design, this power FET provides straightforward and reliable operation, reducing complexity and ensuring ease of use.

Maximum Pulsed Drain Current (IDM): 50 A

The high maximum pulsed drain current of 50 A allows this power FET to handle demanding applications and ensures reliable performance in high current scenarios.

Maximum Drain Current (Abs) (ID): 13.5 A

With a maximum drain current of 13.5 A, this power FET is capable of handling moderate power requirements, making it suitable for a wide range of electronic devices.

No. of Terminals: 8

The 8-terminal design of this power FET provides multiple connections for circuit integration, allowing for versatile use in various electronic applications.

Maximum Power Dissipation (Abs): 2.5 W

With a maximum power dissipation of 2.5 W, this power FET can handle high power applications, ensuring efficient operation and preventing overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this power FET offers compact dimensions, making it suitable for space-constrained electronic devices, while providing excellent thermal characteristics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this power FET delivers reliable performance, low power consumption, and excellent switching characteristics.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this power FET can withstand high-temperature environments and provide reliable performance even under demanding conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance, reliability, and compatibility with a wide range of electronic devices, making it a dependable choice.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability, reducing the risk of poor connections and ensuring reliable operation in various applications.

Maximum Drain-Source On Resistance: 0.0085 ohm

The low maximum drain-source on resistance of 0.0085 ohm minimizes power losses and improves efficiency, making this power FET an ideal choice for high-performance applications.

Terminal Position: DUAL

With dual terminal positions, this power FET offers flexibility in circuit board layout and facilitates easy and secure connections, enhancing overall reliability.

Moisture Sensitivity Level (MSL): 1

Having a moisture sensitivity level of 1 ensures that this power FET can withstand various humidity conditions, making it suitable for diverse environmental conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and prevents overheating during assembly, ensuring the longevity of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this power FET can undergo high-temperature soldering processes without compromising its performance and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDS4465 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

13.5 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS4465 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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