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FDS4141-F085

Onsemi

FDS4141-F085 by Onsemi

FDS4141-F085 by Onsemi is a P-CHANNEL Power FET with 40V DS Breakdown Voltage and 36A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.013 ohm RDS(on), and operates in ENHANCEMENT MODE.

Median Price

$0.776

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 70 parts In-Stock

1+ parts

$0.776

100+ parts

$0.714

1k+ parts

$0.669

10k+ parts

-

70

$0.776

$0.714

$0.669

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Rochester

USA . 13,651 parts In-Stock

1+ parts

-

100+ parts

$0.758

1k+ parts

$0.629

10k+ parts

$0.561

13,651

-

$0.758

$0.629

$0.561

Verical

USA . 13,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.786

10k+ parts

$0.701

13,651

-

-

$0.786

$0.701

Distributors (In-Stock)

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Digiode

USA . 849 parts In-Stock

1+ parts

$0.472

100+ parts

-

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849

$0.472

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.669

100+ parts

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900

$0.669

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Chip Stock

USA . 13,999 parts In-Stock

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13,999

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Vyrian

USA . 10,364 parts In-Stock

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Martec Srl

Italy . 8,091 parts In-Stock

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8,091

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Component Sense

UK . 30 parts In-Stock

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30

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Distributors (Availability)

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Semicontronic

India . 14,601 parts In-Stock

1+ parts

$0.422

100+ parts

$0.411

1k+ parts

$0.409

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-

14,601

$0.422

$0.411

$0.409

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Ampacity Inc.

Singapore . 14,519 parts In-Stock

1+ parts

$0.422

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14,519

$0.422

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Corphita

USA . 2,801 parts In-Stock

1+ parts

$0.447

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2,801

$0.447

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Corohmni

South Africa . 132 parts In-Stock

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$0.497

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132

$0.497

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Continental Prestige Electronics

USA . 6,869 parts In-Stock

1+ parts

$0.669

100+ parts

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10k+ parts

$0.656

6,869

$0.669

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-

$0.656

Argo Parts USA

USA . 5,259 parts In-Stock

1+ parts

$0.669

100+ parts

-

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$0.649

5,259

$0.669

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-

$0.649

Aztec Data Supply Inc.

USA . 2,249 parts In-Stock

1+ parts

$0.770

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2,249

$0.770

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$10.620

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872

$10.620

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Component Stockers USA

USA . 253 parts In-Stock

1+ parts

$99.990

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253

$99.990

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Infinite Electronics LLP (Excess)

. 705,014 parts In-Stock

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Perfect Parts

USA . 8,501 parts In-Stock

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Kulean Microsystems

USA . 7,978 parts In-Stock

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SupplyDigital Components

Austria . 6,928 parts In-Stock

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TANS Electronics

Latvia . 6,117 parts In-Stock

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Advanced Electronics

New Zealand . 6,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 5,879 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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UHIMA Technologies

Türkiye . 698 parts In-Stock

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698

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Supply Digital

USA . 149 parts In-Stock

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149

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Netroflash

USA . 50 parts In-Stock

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$0.656

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$0.636

10k+ parts

$0.622

50

-

$0.656

$0.636

$0.622

Overview

Unlock the power of FDS4141-F085 by Onsemi, a top-quality P-Channel Power Field Effect Transistor that offers unparalleled performance in switching applications. Manufactured by Onsemi, a renowned leader in semiconductor technology, this transistor boasts a built-in diode and an impressive minimum DS breakdown voltage of 40V. With a maximum pulsed drain current of 36A and low on-resistance, this transistor delivers optimal efficiency and reliability. Ideal for a wide range of industrial and consumer electronics, this enhancement mode transistor is a game-changer in power management. Experience superior quality and performance with FDS4141-F085 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, making it suitable for various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance and ease of use in circuits, making this transistor a versatile choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves efficiency and protects other components in the circuit from voltage spikes, making this transistor a reliable choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and efficient operation in circuits.

Surface Mount: YES

With surface mount capability, this transistor can be easily integrated into printed circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 40 V

This high breakdown voltage ensures reliable operation in high voltage circuits, making this transistor suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and secure mounting on the circuit board.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical connections, ensuring reliable performance in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and efficient in switching applications, making this transistor a reliable choice for various circuits.

Maximum Pulsed Drain Current (IDM): 36 A

With a high maximum pulsed drain current, this transistor can handle surge currents and peak loads effectively, ensuring reliable performance in demanding applications.

Avalanche Energy Rating (EAS): 229 mJ

The high avalanche energy rating allows this transistor to withstand voltage spikes and transient events, ensuring durability and reliability in challenging conditions.

Maximum Drain Current (Abs) (ID): 10.8 A

With a high maximum drain current rating, this transistor can handle continuous current flow without overheating or performance degradation.

No. of Terminals: 8

With 8 terminals, this transistor offers versatile connection options for various circuit configurations, enhancing flexibility in design.

Maximum Power Dissipation (Abs): 1.6 W

The high maximum power dissipation rating ensures efficient heat dissipation, allowing this transistor to operate reliably under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making this transistor suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low on-resistance and high efficiency, making this transistor a reliable choice for various switching applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, ensuring reliable performance in demanding environments.

Transistor Element Material: SILICON

Silicon material provides reliable performance and consistent characteristics, making this transistor a durable and long-lasting choice for electronic circuits.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The multi-layer terminal finish provides stable and low-resistance connections, ensuring reliable performance and longevity in various applications.

Maximum Drain-Source On Resistance: 0.013 ohm

With low drain-source on-resistance, this transistor minimizes power loss and heat generation, ensuring efficient operation in switching applications.

Terminal Position: DUAL

Dual terminal positions provide versatile mounting options and enhance compatibility with different circuit layouts, offering flexibility in design.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly in manufacturing processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor can be soldered at elevated temperatures, ensuring secure connections and reliable operation in electronic devices.

Technical Specifications

Power Field Effect Transistors (FET) FDS4141-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

229 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

10.8 A

Maximum Drain Current (ID):

10.8 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS4141-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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