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FDS4559-F085

Onsemi

FDS4559-F085 by Onsemi

FDS4559-F085 by Onsemi is a N-CHANNEL Power FET for switching applications. It features 60V DS breakdown voltage, 4.5A max drain current, and 0.055 ohm max on resistance. With a small outline package style and gull wing terminals, it operates in enhancement mode at up to 150°C peak temperature.

Median Price

$0.892

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$1.357

100+ parts

$1.289

1k+ parts

$1.289

10k+ parts

-

5,000

$1.357

$1.289

$1.289

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Rochester

USA . 116,954 parts In-Stock

1+ parts

-

100+ parts

$0.860

1k+ parts

$0.714

10k+ parts

$0.637

116,954

-

$0.860

$0.714

$0.637

Verical

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.892

10k+ parts

$0.796

90,000

-

-

$0.892

$0.796

Distributors (In-Stock)

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Digiode

USA . 410 parts In-Stock

1+ parts

$1.289

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410

$1.289

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Chip Stock

USA . 70,000 parts In-Stock

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Flip Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 4,398 parts In-Stock

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4,398

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Nova Conductors

Japan . 1,050 parts In-Stock

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1,050

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 5,865 parts In-Stock

1+ parts

$0.392

100+ parts

-

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5,865

$0.392

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Ampacity Inc.

Singapore . 141,276 parts In-Stock

1+ parts

$0.770

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141,276

$0.770

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Semicontronic

India . 141,183 parts In-Stock

1+ parts

$0.770

100+ parts

$0.751

1k+ parts

$0.747

10k+ parts

-

141,183

$0.770

$0.751

$0.747

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Corphita

USA . 2,080 parts In-Stock

1+ parts

$1.221

100+ parts

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2,080

$1.221

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Advanced Electronics

New Zealand . 10,000 parts In-Stock

1+ parts

$1.357

100+ parts

$1.289

1k+ parts

$1.289

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10,000

$1.357

$1.289

$1.289

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Corohmni

South Africa . 1,432 parts In-Stock

1+ parts

$1.577

100+ parts

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1,432

$1.577

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AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$16.380

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771

$16.380

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Component Stockers USA

USA . 423 parts In-Stock

1+ parts

$99.990

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423

$99.990

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Kepictronics

USA . 25,000 parts In-Stock

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Lixinc

USA . 16,294 parts In-Stock

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Perfect Parts

USA . 7,548 parts In-Stock

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SupplyDigital Components

Austria . 5,514 parts In-Stock

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Continental Prestige Electronics

USA . 5,301 parts In-Stock

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Argo Parts USA

USA . 5,079 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 3,243 parts In-Stock

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Kulean Microsystems

USA . 2,860 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Supply Digital

USA . 1,126 parts In-Stock

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TANS Electronics

Latvia . 944 parts In-Stock

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944

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Lucentia Tech

USA . 600 parts In-Stock

1+ parts

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$0.368

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$0.368

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$0.368

600

-

$0.368

$0.368

$0.368

UHIMA Technologies

Türkiye . 588 parts In-Stock

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588

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Bastille Electronics

Australia . 500 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$0.024

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$0.024

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$0.024

500

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$0.024

$0.024

$0.024

Overview

Unleash the power of innovation with the FDS4559-F085 by Onsemi. This high-quality Power Field Effect Transistor (FET) offers superior performance and reliability for a wide range of switching applications. With its N-CHANNEL polarity, separate configuration, and built-in diode, this transistor is designed to optimize efficiency and enhance functionality. Trust in Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your electronic systems with the FDS4559-F085 and experience seamless operation, increased power efficiency, and unmatched durability. Elevate your projects to new heights with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, ensuring reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs usually have better performance and efficiency compared to P-channel FETs, making this transistor a suitable choice for switching applications.

Minimum DS Breakdown Voltage: 60 V

Provides a high breakdown voltage, ensuring the transistor can handle higher voltages without failure.

Maximum Drain Current (ID): 4.5 A

With a high maximum drain current, this transistor can handle high current loads effectively.

Maximum Power Dissipation (Abs): 2 W

The high maximum power dissipation allows the transistor to operate at higher power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics, such as low leakage current and high switching speeds.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate reliably in a variety of environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) FDS4559-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS4559-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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