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AUIRFZ44NSTRR

Infineon Technologies

AUIRFZ44NSTRR by Infineon Technologies

AUIRFZ44NSTRR by Infineon is a N-CHANNEL FET with 55V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Pulsed Drain Current of 160A and Max Power Dissipation of 94W. With ENHANCEMENT MODE operation and METAL-OXIDE SEMICONDUCTOR technology, it offers high performance in various power management systems.

Median Price

$1.087

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 270 parts In-Stock

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$1.087

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$1.032

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$1.032

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270

$1.087

$1.032

$1.032

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Distributors (In-Stock)

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Digiode

USA . 209 parts In-Stock

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$1.033

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$1.033

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Vyrian

USA . 268 parts In-Stock

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VNN

France . 10 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 270 parts In-Stock

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$0.920

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270

$0.920

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Corphita

USA . 36 parts In-Stock

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$0.978

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36

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.087

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$1.032

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$1.032

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270

$1.087

$1.032

$1.032

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Aztec Data Supply Inc.

USA . 233 parts In-Stock

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$1.124

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Corohmni

South Africa . 930 parts In-Stock

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$1.489

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930

$1.489

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Modulus Dynamics

Lithuania . 18,435 parts In-Stock

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$1.886

100+ parts

$1.811

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$1.735

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18,435

$1.886

$1.811

$1.735

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AZTECH Wire

Italy . 833 parts In-Stock

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$10.691

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833

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Continental Prestige Electronics

USA . 6,006 parts In-Stock

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Argo Parts USA

USA . 3,711 parts In-Stock

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Bastille Electronics

Australia . 21 parts In-Stock

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Overview

Unleash the power of Infineon Technologies with the AUIRFZ44NSTRR Power Field Effect Transistor. Designed for switching applications, this N-Channel transistor comes with a built-in diode for added convenience. With a maximum pulsed drain current of 160A and a low on-resistance of 0.0175 ohm, this transistor offers reliable performance in a compact package. Trust in Infineon's expertise in semiconductor technology and elevate your projects with the exceptional quality and efficiency of the AUIRFZ44NSTRR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transistor, ensuring long-term reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON-state resistance, higher switching speeds, and higher current handling capabilities compared to P-channel FETs, making them ideal for many power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient energy dissipation and provides reverse polarity protection, enhancing the overall performance and reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it suitable for use in power management circuits and other switching systems.

Surface Mount: YES

Surface mount packaging enables easy integration onto circuit boards, saving space and facilitating automated assembly processes, making this FET a convenient choice for manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) AUIRFZ44NSTRR attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

49 A

Maximum Drain Current (ID):

49 A

Maximum Drain-Source On Resistance:

.0175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

AUIRFZ44NSTRR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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