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BSL606SNH6327XTSA1

Infineon Technologies

BSL606SNH6327XTSA1 by Infineon Technologies

Infineon's BSL606SNH6327XTSA1 is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 18.1A IDM for automotive applications. It features a built-in diode, 0.06 ohm RDS(on), and operates in the -55 to 150°C temperature range, meeting AEC-Q101 standards.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 415 parts In-Stock

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$0.060

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$0.060

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415

$0.060

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DigiKey

USA . 722 parts In-Stock

1+ parts

$1.050

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$0.421

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$0.290

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$0.219

722

$1.050

$0.421

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$0.219

EBV Elektronik

Germany . 102,000 parts In-Stock

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Arrow

USA . 27,000 parts In-Stock

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Farnell

UK . 7,986 parts In-Stock

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$0.234

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$0.195

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$0.167

7,986

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$0.167

RS (Exports)

UK . 2,980 parts In-Stock

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Chip1Stop

Japan . 1,867 parts In-Stock

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Verical

USA . 1,367 parts In-Stock

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Rochester

USA . 1,141 parts In-Stock

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$0.204

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$0.169

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$0.151

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$0.151

Element14

Singapore . 664 parts In-Stock

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$0.428

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$0.243

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$0.227

664

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Distributors (In-Stock)

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Digiode

USA . 656 parts In-Stock

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$0.159

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Nova Conductors

Japan . 500 parts In-Stock

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$0.302

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$0.302

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TME

Poland . 3,622 parts In-Stock

1+ parts

$0.800

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$0.308

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$0.226

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$0.216

3,622

$0.800

$0.308

$0.226

$0.216

Maritex

Poland . 5,533 parts In-Stock

1+ parts

$0.804

100+ parts

$0.402

1k+ parts

$0.299

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5,533

$0.804

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$0.299

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NAC Semi

USA . 81,000 parts In-Stock

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Chip Stock

USA . 43,110 parts In-Stock

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Cyclops Electronics Ltd

UK . 33,000 parts In-Stock

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Vyrian

USA . 10,828 parts In-Stock

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Semtec, LLC

USA . 9,632 parts In-Stock

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Rutronik

Germany . 3,000 parts In-Stock

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$0.157

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IBS Electronics

USA . 3,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,393 parts In-Stock

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ComSIT USA

USA . 2,393 parts In-Stock

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VNN

France . 1,960 parts In-Stock

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Rebound Electronics

UK . 873 parts In-Stock

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Prism Electronics

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Semicontronic

India . 10,805 parts In-Stock

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$0.103

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$0.100

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$0.100

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$0.103

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Ampacity Inc.

Singapore . 10,750 parts In-Stock

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$0.103

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Corphita

USA . 423 parts In-Stock

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Argo Parts USA

USA . 105 parts In-Stock

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$0.280

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$0.272

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Corohmni

South Africa . 395 parts In-Stock

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$0.574

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395

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Modulus Dynamics

Lithuania . 3,426 parts In-Stock

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$0.625

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$0.600

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$0.575

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.766

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$0.728

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$0.728

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500

$0.766

$0.728

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Aztec Data Supply Inc.

USA . 3,823 parts In-Stock

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$1.120

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RC Electronics

USA . 60,262 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Lixinc

USA . 13,156 parts In-Stock

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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Continental Prestige Electronics

USA . 11,947 parts In-Stock

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$0.358

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$0.227

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Perfect Parts

USA . 9,294 parts In-Stock

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Microchip USA

USA . 1,598 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.296

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$0.287

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$0.281

500

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$0.281

Overview

Experience superior quality and performance with the BSL606SNH6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers power Field Effect Transistors (FET) that are reliable and versatile. With a single configuration and built-in diode, this N-CHANNEL transistor is perfect for a wide range of applications. From automotive to industrial electronics, this product offers maximum efficiency and durability. Trust in the value and benefits that Infineon brings to the table with the BSL606SNH6327XTSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient control of current flow, making this FET suitable for a wide range of power management tasks.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET simplifies the circuit design and improves efficiency by reducing the need for additional components.

Surface Mount: YES

The surface mount capability of this FET makes it easy to integrate into compact designs, saving space and simplifying PCB layouts.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltage levels, making it suitable for use in power applications that require robust performance.

Package Shape: RECTANGULAR

The rectangular package shape offers a standard form factor that is easy to work with in various applications, ensuring compatibility and ease of installation.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and facilitates soldering, ensuring reliable performance in demanding operating conditions.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation of this FET allows for precise control over the power delivery, making it ideal for applications where efficiency is important.

Maximum Pulsed Drain Current (IDM): 18.1 A

With a high pulsed drain current rating, this FET can handle sudden surges of current, making it suitable for applications that require peak power capabilities.

Avalanche Energy Rating (EAS): 14 mJ

The high avalanche energy rating of 14mJ ensures the FET can withstand transient voltage spikes, offering protection against voltage fluctuations and enhancing device longevity.

Technical Specifications

Power Field Effect Transistors (FET) BSL606SNH6327XTSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

14 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18.1 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSL606SNH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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