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FDS4465-F085

Onsemi

FDS4465-F085 by Onsemi

FDS4465-F085 by Onsemi is a P-CHANNEL Power FET with 20V DS Breakdown Voltage and 13.5A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a RECTANGULAR package. Operating in ENHANCEMENT MODE, this transistor has 0.0085 ohm On Resistance and can handle up to 50A Pulsed Drain Current.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,122 parts In-Stock

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Digiode

USA . 1,210 parts In-Stock

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Nova Conductors

Japan . 110 parts In-Stock

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110

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Aztec Data Supply Inc.

USA . 4,041 parts In-Stock

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$1.722

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4,041

$1.722

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AZTECH Wire

Italy . 1,182 parts In-Stock

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$13.321

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$13.321

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Semicontronic

India . 322 parts In-Stock

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$39.050

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$38.074

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$37.878

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322

$39.050

$38.074

$37.878

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Ampacity Inc.

Singapore . 2,292 parts In-Stock

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$42.050

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2,292

$42.050

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Component Stockers USA

USA . 512 parts In-Stock

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$99.990

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512

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Perfect Parts

USA . 8,114 parts In-Stock

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TANS Electronics

Latvia . 7,469 parts In-Stock

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Argo Parts USA

USA . 4,154 parts In-Stock

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Continental Prestige Electronics

USA . 2,993 parts In-Stock

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Problanco Electronics

Mexico . 2,186 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 887 parts In-Stock

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Supply Digital

USA . 827 parts In-Stock

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Kulean Microsystems

USA . 454 parts In-Stock

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Corohmni

South Africa . 325 parts In-Stock

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SupplyDigital Components

Austria . 171 parts In-Stock

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UHIMA Technologies

Türkiye . 147 parts In-Stock

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Overview

Unleash the power of innovation with the FDS4465-F085 by Onsemi. Crafted with precision and expertise, this P-Channel Power Field Effect Transistor is designed for high-performance switching applications. The single configuration with a built-in diode ensures seamless operation, while the small outline package offers convenience and versatility. Experience maximum power dissipation of 2.5W and a low drain-source on resistance of 0.0085 ohm, making it an ideal choice for your next project. Elevate your designs with Onsemi's cutting-edge technology and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the FET, making it durable and reliable in various environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance, making them efficient for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for the efficient management of reverse current flow, protecting the FET and connected components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation.

Surface Mount: YES

The surface mount capability makes installation easy and saves space on the PCB, ideal for compact electronic designs.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET is suitable for handling moderate power levels in various circuits.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on the PCB and easy integration into circuit designs.

Terminal Form: GULL WING

The gull wing terminals provide a secure and reliable connection to the PCB, ensuring stable operation of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and high efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 50 A

With a high pulsed drain current rating of 50A, this FET can handle large current spikes without overheating.

Maximum Drain Current (Abs) (ID): 13.5 A

The maximum drain current rating of 13.5A allows for reliable operation in power circuits without the risk of damage.

No. of Terminals: 8

The 8 terminals provide flexibility in connecting the FET to other components, allowing for versatile circuit designs.

Maximum Power Dissipation (Abs): 2.5 W

The maximum power dissipation of 2.5W ensures that the FET can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high efficiency and fast switching speeds, making it suitable for power applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Silicon is a reliable and durable material for transistor elements, ensuring long-term stability and performance.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Maximum Drain-Source On Resistance: 0.0085 ohm

With a low on-resistance of 0.0085 ohm, this FET minimizes power loss and heat generation during operation.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and easy integration into circuit designs.

Case Connection: DRAIN

The drain case connection provides a stable and reliable connection to the power supply, ensuring efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of the FET to the PCB, ensuring secure connections.

Technical Specifications

Power Field Effect Transistors (FET) FDS4465-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

13.5 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS4465-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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