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FDMS86300DC

Onsemi

FDMS86300DC by Onsemi

FDMS86300DC by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. It features 260A IDM Pulsed Drain Current, 0.0031 ohm RDS(ON), and 240mJ EAS Avalanche Energy Rating. With a max power dissipation of 125W and operating temperature up to 150°C, it is suitable for high-power switching circuits in various electronic devices.

Median Price

$2.468

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 813 parts In-Stock

1+ parts

$2.340

100+ parts

$1.210

1k+ parts

$1.040

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813

$2.340

$1.210

$1.040

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Newark

USA . 3,349 parts In-Stock

1+ parts

$3.860

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$1.650

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$1.460

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3,349

$3.860

$1.650

$1.460

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Mouser Electronics

USA . 35,207 parts In-Stock

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$4.000

100+ parts

$1.770

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$1.530

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35,207

$4.000

$1.770

$1.530

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DigiKey

USA . 53 parts In-Stock

1+ parts

$4.010

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$1.840

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$1.519

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53

$4.010

$1.840

$1.519

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Element14

Singapore . 3,319 parts In-Stock

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$5.430

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$2.320

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$2.060

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$2.060

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Arrow

USA . 12,000 parts In-Stock

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$1.266

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Verical

USA . 9,000 parts In-Stock

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$1.226

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Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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Chip1Stop

Japan . 3,000 parts In-Stock

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$1.191

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Rochester

USA . 3,000 parts In-Stock

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$1.240

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$1.110

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$1.040

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$1.240

$1.110

$1.040

RS (Exports)

UK . 2,400 parts In-Stock

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$2.596

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$1.752

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2,400

-

$2.596

$1.752

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Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$1.761

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15

$1.761

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Digiode

USA . 522 parts In-Stock

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$2.802

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522

$2.802

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Chip Stock

USA . 70,100 parts In-Stock

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IBS Electronics

USA . 33,000 parts In-Stock

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$3.212

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$3.212

NAC Semi

USA . 21,000 parts In-Stock

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$1.510

21,000

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$1.510

Vyrian

USA . 11,546 parts In-Stock

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Flip Electronics

USA . 9,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Sensible Micro Corp

USA . 335 parts In-Stock

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ComSIT Distribution GmbH

Germany . 70 parts In-Stock

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70

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ComSIT USA

USA . 70 parts In-Stock

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70

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Cogito LLC

Ukraine . 11 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,733 parts In-Stock

1+ parts

$1.010

100+ parts

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11,733

$1.010

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Semicontronic

India . 11,467 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

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$0.980

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11,467

$1.010

$0.985

$0.980

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Corohmni

South Africa . 343 parts In-Stock

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$1.191

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343

$1.191

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Aztec Data Supply Inc.

USA . 1,515 parts In-Stock

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$1.282

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$1.282

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Continental Prestige Electronics

USA . 4,363 parts In-Stock

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$1.590

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$1.558

4,363

$1.590

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$1.558

Argo Parts USA

USA . 1,384 parts In-Stock

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$1.590

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1,384

$1.590

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Aranea Global

USA . 100 parts In-Stock

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$1.726

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$1.657

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100

$1.726

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$1.657

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Modulus Dynamics

Lithuania . 9,028 parts In-Stock

1+ parts

$1.882

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$1.882

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$1.882

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9,028

$1.882

$1.882

$1.882

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.938

100+ parts

$1.842

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$1.842

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1,000

$1.938

$1.842

$1.842

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Corphita

USA . 1,922 parts In-Stock

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$2.655

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Perfect Parts

USA . 65,710 parts In-Stock

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RC Electronics

USA . 34,567 parts In-Stock

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$1.820

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$1.660

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$1.610

34,567

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$1.820

$1.660

$1.610

Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Lixinc

USA . 15,574 parts In-Stock

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Kepictronics

USA . 13,700 parts In-Stock

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TANS Electronics

Latvia . 7,562 parts In-Stock

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Problanco Electronics

Mexico . 7,366 parts In-Stock

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Eastek

USA . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 5,639 parts In-Stock

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5,639

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Infinite Electronics LLP (Excess)

. 5,002 parts In-Stock

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Supply Digital

USA . 2,513 parts In-Stock

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iodParts Technologies Inc.

India . 2,330 parts In-Stock

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Kulean Microsystems

USA . 835 parts In-Stock

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835

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UHIMA Technologies

Türkiye . 357 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$0.011

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$0.011

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$0.011

100

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$0.011

$0.011

$0.011

Lucentia Tech

USA . 100 parts In-Stock

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$0.011

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$0.011

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$0.011

100

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$0.011

$0.011

$0.011

Computer Components Inc. - USA

USA . 39 parts In-Stock

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Overview

Discover the power and efficiency of the FDMS86300DC by Onsemi, a top-quality Power FET that delivers exceptional performance in switching applications. With its N-CHANNEL design and built-in diode, this transistor offers unparalleled reliability and functionality. Whether you're looking to optimize your power management system or enhance your electronic devices, this transistor is the perfect solution. Trust in Onsemi's expertise and innovation to bring value and benefits to your projects with the FDMS86300DC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the transistor ideal for portable devices or applications where weight is a concern.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher electron mobility compared to P-channel FETs, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this transistor is suitable for high voltage applications, providing greater reliability and safety.

Maximum Drain Current (ID): 60 A

The high drain current rating allows the FET to handle large currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, the FET can handle significant heat generation, ensuring reliability under heavy loads.

Maximum Operating Temperature: 150 °C

The high operating temperature range enables the FET to withstand elevated temperatures, making it suitable for industrial or automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FDMS86300DC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW RESISTANCE

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240AA

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

260 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMS86300DC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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