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FDMS86102LZ

Onsemi

FDMS86102LZ by Onsemi

FDMS86102LZ by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 40A and EAS of 84mJ, operating in ENHANCEMENT MODE. With a compact RECTANGULAR package style and Matte Tin finish, it offers high performance in small outline designs.

Median Price

$1.190

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$1.931

100+ parts

$1.145

1k+ parts

$0.955

10k+ parts

$0.913

3,000

$1.931

$1.145

$0.955

$0.913

Chip1Stop

Japan . 2,562 parts In-Stock

1+ parts

$2.580

100+ parts

$1.230

1k+ parts

$0.972

10k+ parts

$0.794

2,562

$2.580

$1.230

$0.972

$0.794

DigiKey

USA . 31,545 parts In-Stock

1+ parts

-

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$0.878

31,545

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$0.878

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.145

1k+ parts

$0.955

10k+ parts

$0.913

3,000

-

$1.145

$0.955

$0.913

Rochester

USA . 188 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$0.988

10k+ parts

$0.881

188

-

$1.190

$0.988

$0.881

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,290 parts In-Stock

1+ parts

$0.883

100+ parts

-

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1,290

$0.883

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Nova Conductors

Japan . 55 parts In-Stock

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$1.060

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-

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55

$1.060

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Bristol Electronics

USA . 2,197 parts In-Stock

1+ parts

$1.925

100+ parts

$1.193

1k+ parts

$0.635

10k+ parts

-

2,197

$1.925

$1.193

$0.635

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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Vyrian

USA . 12,397 parts In-Stock

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Flip Electronics

USA . 9,000 parts In-Stock

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Dan-Mar Components

USA . 2,607 parts In-Stock

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2,607

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Semi Source

USA . 984 parts In-Stock

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984

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Sensible Micro Corp

USA . 558 parts In-Stock

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558

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ACDS - Activité Composants Distribution Service

France . 315 parts In-Stock

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Prism Electronics

USA . 72 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,186 parts In-Stock

1+ parts

$0.503

100+ parts

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3,186

$0.503

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Ampacity Inc.

Singapore . 12,198 parts In-Stock

1+ parts

$0.700

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12,198

$0.700

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Semicontronic

India . 12,175 parts In-Stock

1+ parts

$0.700

100+ parts

$0.682

1k+ parts

$0.679

10k+ parts

-

12,175

$0.700

$0.682

$0.679

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Corohmni

South Africa . 84 parts In-Stock

1+ parts

$0.818

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84

$0.818

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Corphita

USA . 737 parts In-Stock

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$0.836

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737

$0.836

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Modulus Dynamics

Lithuania . 18,718 parts In-Stock

1+ parts

$1.018

100+ parts

$1.018

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$1.018

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18,718

$1.018

$1.018

$1.018

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.039

100+ parts

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$0.997

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1,000

$1.039

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$0.997

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Advanced Electronics

New Zealand . 43 parts In-Stock

1+ parts

$1.049

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$1.049

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$1.049

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43

$1.049

$1.049

$1.049

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Continental Prestige Electronics

USA . 2,297 parts In-Stock

1+ parts

$1.060

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$1.039

2,297

$1.060

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$1.039

Argo Parts USA

USA . 989 parts In-Stock

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$1.060

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989

$1.060

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Microchip USA

USA . 1,400 parts In-Stock

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$2.765

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1,400

$2.765

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RC Electronics

USA . 46,868 parts In-Stock

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$1.080

1k+ parts

$0.990

10k+ parts

$0.960

46,868

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$1.080

$0.990

$0.960

Lixinc

USA . 17,234 parts In-Stock

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Perfect Parts

USA . 13,440 parts In-Stock

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Kepictronics

USA . 10,026 parts In-Stock

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Robosynatics

Brazil . 5,358 parts In-Stock

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$0.998

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$0.977

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$0.977

5,358

-

$0.998

$0.977

$0.977

Lucentia Tech

USA . 5,358 parts In-Stock

1+ parts

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$0.998

1k+ parts

$0.977

10k+ parts

$0.977

5,358

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$0.998

$0.977

$0.977

Problanco Electronics

Mexico . 4,100 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,008 parts In-Stock

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TANS Electronics

Latvia . 2,406 parts In-Stock

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Kulean Microsystems

USA . 1,798 parts In-Stock

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SupplyDigital Components

Austria . 1,494 parts In-Stock

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Supply Digital

USA . 1,254 parts In-Stock

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Futuretech Components

Singapore . 1,178 parts In-Stock

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UHIMA Technologies

Türkiye . 514 parts In-Stock

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514

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Overview

Unleash the power of innovation with the FDMS86102LZ by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET offers unparalleled performance in switching applications. With a built-in diode and a maximum DS Breakdown Voltage of 100V, this transistor is designed to exceed expectations. Whether you're looking to optimize efficiency or enhance reliability, this small outline package delivers exceptional value with its low on-resistance and high pulsed drain current capabilities. Elevate your projects with Onsemi's cutting-edge technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the sensor, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

Wide operating voltage range allows for flexible power supply options and compatibility with different systems.

No. of Bits: 12

High resolution 12-bit output provides accurate temperature measurement for precise control and monitoring.

Body Width: 3.91 inch

Compact size enables easy integration and placement in tight spaces for temperature sensing applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for versatile usage and compatibility with various systems.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor types offer different output options and communication interfaces for diverse application requirements.

No. of Terminals: 8

Sufficient terminals for connection and interface with external circuits, ensuring ease of integration and use.

Body Height: 1.55 mm

Low-profile design enables discrete installation and minimizes space requirements for temperature sensing applications.

Package Shape or Style: RECTANGULAR

Rectangular shape provides a standardized form factor for easy mounting and compatibility with standard design layouts.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in low-power scenarios and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

High temperature range capability ensures reliable performance in both standard and elevated temperature environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables use in extreme cold conditions without compromising sensor accuracy.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and conductivity for secure and stable terminal connections.

Maximum Operating Current: 1.5 mA

Low operating current consumption helps in reducing power consumption and extends battery life in connected systems.

Housing: PLASTIC

Durable plastic housing offers protection and insulation for the internal sensor components, ensuring long-term reliability.

Maximum Accuracy °C: 2

High accuracy of ±2°C ensures precise temperature measurement for critical applications and control systems.

Body Length/Diameter: 4.88 mm

Compact body size facilitates easy installation and integration in a wide range of temperature sensing applications.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for interfacing the sensor with external circuits.

Output Interface Type: 1-WIRE INTERFACE

1-wire interface simplifies communication with the sensor and allows for easy integration in compatible systems and networks.

Mounting Feature: SURFACE MOUNT

Surface mount capability ensures easy and secure attachment to PCBs or other surfaces for streamlined installation and assembly.

Technical Specifications

Power Field Effect Transistors (FET) FDMS86102LZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240AA

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMS86102LZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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