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IRLML2030TRPBF

Infineon Technologies

IRLML2030TRPBF by Infineon Technologies

IRLML2030TRPBF by Infineon is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 11A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in PLASTIC/EPOXY package. Operating from -55 to 150 °C, it has 0.1 ohm Drain-Source On Resistance and 12pF Feedback Capacitance.

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

44

In-Stock Inventory

1k+

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Mouser Electronics

USA . 22,331 parts In-Stock

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$0.390

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$0.139

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$0.105

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$0.067

22,331

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$0.139

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$0.067

Newark

USA . 9,229 parts In-Stock

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$0.415

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$0.178

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$0.126

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DigiKey

USA . 7,581 parts In-Stock

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$0.420

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$0.108

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$0.078

Adafruit Industries

USA . 95 parts In-Stock

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Arrow

USA . 375,000 parts In-Stock

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Rochester

USA . 76,299 parts In-Stock

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Future Electronics

Canada . 54,000 parts In-Stock

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Avnet

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Farnell

UK . 12,945 parts In-Stock

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Verical

USA . 11,500 parts In-Stock

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Element14

Singapore . 10,571 parts In-Stock

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Chip1Stop

Japan . 6,290 parts In-Stock

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Distrelec

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Greenchips

USA . 2,594 parts In-Stock

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$0.074

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$0.070

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$0.067

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2,594

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$0.070

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$0.061

Nova Conductors

Japan . 15 parts In-Stock

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Digiode

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Voyager Components

USA . 3,270 parts In-Stock

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3,270

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TME

Poland . 5,880 parts In-Stock

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Maritex

Poland . 818 parts In-Stock

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J2 Sourcing AB

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Connector Distribution Corp

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LIBRA Elektronik GmbH

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Prism Electronics

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Ampacity Inc.

Singapore . 87,193 parts In-Stock

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Semicontronic

India . 86,853 parts In-Stock

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Argo Parts USA

USA . 1,917 parts In-Stock

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CoreStaff

Japan . 11,500 parts In-Stock

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Corphita

USA . 621 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,722 parts In-Stock

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Advanced Electronics

New Zealand . 95 parts In-Stock

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Corohmni

South Africa . 972 parts In-Stock

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Modulus Dynamics

Lithuania . 20,519 parts In-Stock

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Eastek

USA . 810,000 parts In-Stock

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Canada . 90,000 parts In-Stock

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USA . 84,226 parts In-Stock

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Kepictronics

USA . 42,580 parts In-Stock

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Continental Prestige Electronics

USA . 31,263 parts In-Stock

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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Israel . 16,353 parts In-Stock

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Brazil . 10,714 parts In-Stock

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Lucentia Tech

USA . 10,714 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,285 parts In-Stock

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iodParts Technologies Inc.

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Germany . 2,700 parts In-Stock

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Overview

Upgrade your power management systems with the IRLML2030TRPBF from Infineon Technologies. This high-quality N-channel power FET offers reliable switching capabilities, ideal for a wide range of applications. With its built-in diode and small outline package style, this transistor provides efficient performance while saving space in your designs. Trust in Infineon's expertise in semiconductor technology to deliver the value and reliability you need for your projects. Experience seamless power control with the IRLML2030TRPBF and take your applications to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the packaging of the FET ensures durability and protection against external elements, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-state resistance compared to P-Channel FETs, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and helps protect against reverse current flow, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast turn-on and turn-off times, making it ideal for high-speed operations.

Surface Mount: YES

The surface-mount capability of this FET makes it easy to integrate into compact electronic designs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET offers reliable performance in a wide range of voltage applications, providing a high level of protection.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on circuit boards, enhancing the overall efficiency of the assembly process.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical stability and secure solder connections, ensuring reliable operation in various environmental conditions.

Operating Mode: ENHANCEMENT MODE

Being an enhancement mode FET, this device can be easily controlled by applying a positive voltage, offering flexibility and precise control in switching applications.

Maximum Pulsed Drain Current (IDM): 11 A

The high pulsed drain current rating of 11 A allows for handling of sudden current spikes or surges, making this FET suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 2.7 A

With a maximum drain current of 2.7 A, this FET can reliably handle moderate electrical loads, ensuring stable operation under normal operating conditions.

No. of Terminals: 3

Having 3 terminals allows for easy connections and control of the FET in various circuit configurations, providing flexibility in design and application.

Maximum Power Dissipation (Abs): 1.3 W

The maximum power dissipation of 1.3 W ensures efficient heat dissipation, preventing overheating and prolonging the lifespan of the FET.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices and enabling higher integration levels.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low leakage current, and low ON-state resistance, enhancing the overall efficiency and reliability of the FET.

Maximum Power Dissipation Ambient: 1.3 W

With a maximum power dissipation of 1.3 W in ambient conditions, this FET can operate efficiently under normal temperature ranges, ensuring stable performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable operation in elevated temperature environments, expanding the range of applications for this FET.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability, stability, and performance, making it a suitable choice for high-quality FETs.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures that this FET can operate in extreme cold conditions without compromising performance, making it versatile and robust.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and stable electrical connections.

Maximum Drain Current (ID): 2.7 A

With a maximum drain current of 2.7 A, this FET can handle moderate electrical loads with ease, offering stable performance in various applications.

Maximum Drain-Source On Resistance: 0.1 ohm

The low drain-source ON resistance of 0.1 ohm minimizes power losses and improves efficiency, making this FET suitable for high-performance switching applications.

Terminal Position: DUAL

Having a dual terminal position allows for flexibility in mounting and connecting the FET in different orientations, enhancing the overall versatility of the device.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reflow process, preventing damage to the FET during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for safe and reliable soldering of the FET onto the PCB, ensuring secure connections and long-term performance.

Maximum Feedback Capacitance (Crss): 12 pF

The low feedback capacitance of 12 pF minimizes signal distortion and improves high-frequency performance, making this FET suitable for fast-switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IRLML2030TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

2.7 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.3 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

11 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLML2030TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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