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IRLML9301TRPBF

Infineon Technologies

IRLML9301TRPBF by Infineon Technologies

Infineon's IRLML9301TRPBF is a P-CHANNEL FET for SWITCHING applications. Features include 30V DS Breakdown Voltage, 15A IDM, and 0.064 ohm RDS(ON). With a small outline package style, it operates b/w -55 to 150 °C and has a max power dissipation of 1.3W.

Median Price

$0.113

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

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Newark

USA . 13,961 parts In-Stock

1+ parts

$0.517

100+ parts

$0.220

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$0.157

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$0.517

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$0.157

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Adafruit Industries

USA . 900 parts In-Stock

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$1.840

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$1.674

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900

$1.840

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Future Electronics

Canada . 879,000 parts In-Stock

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Rochester

USA . 393,955 parts In-Stock

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Arrow

USA . 285,000 parts In-Stock

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Verical

USA . 285,000 parts In-Stock

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Chip1Stop

Japan . 46,338 parts In-Stock

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Element14

Singapore . 14,167 parts In-Stock

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Farnell

UK . 14,167 parts In-Stock

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Avnet

USA . 6,000 parts In-Stock

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Distrelec

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Digiode

USA . 559 parts In-Stock

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Maritex

Poland . 13,280 parts In-Stock

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Nova Conductors

Japan . 59 parts In-Stock

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TME

Poland . 12,261 parts In-Stock

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Voyager Components

USA . 596 parts In-Stock

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IBS Electronics

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Vyrian

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Chip Stock

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Bristol Electronics

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PC Components Company LLC

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Cyclops Electronics Ltd

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NAC Semi

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Schukat

Germany . 11,000 parts In-Stock

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Rutronik

Germany . 6,000 parts In-Stock

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Cogito LLC

Ukraine . 2,296 parts In-Stock

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ComSIT Distribution GmbH

Germany . 897 parts In-Stock

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LWI Electronics Inc

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Bas Electronics GmbH & Co. KG

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QIE Inc.

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Ampacity Inc.

Singapore . 145,366 parts In-Stock

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$0.048

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Semicontronic

India . 144,052 parts In-Stock

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Corphita

USA . 866 parts In-Stock

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Argo Parts USA

USA . 4,902 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.164

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CoreStaff

Japan . 5,982 parts In-Stock

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$0.390

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$0.203

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Continental Prestige Electronics

USA . 55,295 parts In-Stock

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$0.464

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$0.224

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$0.126

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$0.099

55,295

$0.464

$0.224

$0.126

$0.099

Corohmni

South Africa . 959 parts In-Stock

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$0.749

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Aztec Data Supply Inc.

USA . 4,243 parts In-Stock

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Modulus Dynamics

Lithuania . 16,833 parts In-Stock

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$1.744

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$1.674

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$1.604

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$1.744

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$1.604

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$1.840

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$1.674

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$1.509

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$1.840

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Perfect Parts

USA . 771,951 parts In-Stock

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Eastek

USA . 651,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

India . 72,765 parts In-Stock

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Glotronic Ltd.

UK . 69,600 parts In-Stock

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Allen Electronics Distributors

USA . 63,980 parts In-Stock

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$0.179

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Kepictronics

USA . 52,135 parts In-Stock

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iodParts Technologies Inc.

India . 29,750 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,250 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Spain . 8,839 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,778 parts In-Stock

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Benley Electronics

USA . 3,580 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Robosynatics

Brazil . 2,322 parts In-Stock

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$1.845

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$1.808

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$1.808

2,322

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$1.845

$1.808

$1.808

Lucentia Tech

USA . 2,322 parts In-Stock

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$1.845

1k+ parts

$1.808

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$1.808

2,322

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$1.808

$1.808

Lixinc

USA . 1,736 parts In-Stock

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Authorized Procurement Solutions

USA . 90 parts In-Stock

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Overview

Elevate your power management with the Infineon Technologies IRLML9301TRPBF Power Field Effect Transistor. Manufactured by a leader in the industry, this P-CHANNEL transistor offers enhanced performance and reliability for switching applications. With a single configuration and built-in diode, this surface mount transistor provides seamless operation. Experience the benefits of 30V minimum breakdown voltage, 15A maximum pulsed drain current, and 3.6A maximum drain current, all in a compact package. Trust Infineon Technologies to deliver quality solutions that meet your power needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package provides good durability and helps in protecting the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

P-CHANNEL type of transistor allows for efficient switching and control of current flow, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides protection against reverse current flow, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering high performance and efficiency in controlling power flow.

Surface Mount: YES

Surface mount capability enables easy and compact installation of the transistor on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 30 V

The minimum breakdown voltage of 30V ensures reliable operation in various voltage conditions, making it versatile for different applications.

Maximum Pulsed Drain Current (IDM): 15 A

High maximum pulsed drain current allows for handling peak current demands, making it suitable for applications with transient power requirements.

Maximum Drain Current (Abs) (ID): 3.6 A

With a maximum drain current of 3.6A, the transistor can handle moderate power loads effectively, ensuring stable performance.

Maximum Power Dissipation (Abs): 1.3 W

Efficient power dissipation capability enables the transistor to operate within safe temperature limits, enhancing its reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and reliable operation, making it a preferred choice for power FETs.

Technical Specifications

Power Field Effect Transistors (FET) IRLML9301TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.6 A

Maximum Drain Current (ID):

3.6 A

Maximum Drain-Source On Resistance:

.064 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

65 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.3 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

15 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLML9301TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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