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IRF6215STRLPBF

Infineon Technologies

IRF6215STRLPBF by Infineon Technologies

IRF6215STRLPBF by Infineon Technologies is a P-CHANNEL FET with 150V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 44A and EAS of 310mJ, with an operating temperature up to 175°C. This SINGLE configuration transistor has 0.29 ohm RDS(on) and can handle a max ID of 13A.

Median Price

$0.888

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$0.795

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Adafruit Industries

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$1.931

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$1.835

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$1.835

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$0.711

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$0.614

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Verical

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$0.845

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Rochester

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$0.930

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$0.772

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$0.689

7

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$0.772

$0.689

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Digiode

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Nova Conductors

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Vyrian

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$0.585

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Argo Parts USA

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$0.708

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$0.687

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100

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Aztec Data Supply Inc.

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Component Stockers USA

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$1.740

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$0.690

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$0.630

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$0.520

5,643

$1.740

$0.690

$0.630

$0.520

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South Africa . 34 parts In-Stock

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Overview

Upgrade your power systems with the IRF6215STRLPBF by Infineon Technologies. Designed with quality in mind, this P-channel Power FET offers exceptional performance and reliability for switching applications. With a maximum pulsed drain current of 44 A and an avalanche energy rating of 310 mJ, this transistor is sure to meet your power needs. Its small outline package and matte tin finish make it perfect for surface mounting, providing convenience and efficiency in installation. Trust Infineon Technologies to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides a good balance of durability and cost-effectiveness for the product.

Polarity or Channel Type: P-CHANNEL

This channel type allows for efficient switching and control of power flow in the circuit.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and improves overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

The surface mount capability makes installation and circuit board assembly easier and more efficient.

Minimum DS Breakdown Voltage: 150 V

A high breakdown voltage ensures reliability and protection for the components in the circuit.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and easy to integrate into various designs.

Terminal Form: GULL WING

The gull wing terminal form allows for secure and stable connections in the circuit.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation enables precise control and efficient power management.

Maximum Pulsed Drain Current (IDM): 44 A

This high current rating allows for handling sudden power surges or spikes effectively.

Avalanche Energy Rating (EAS): 310 mJ

With a high avalanche energy rating, the transistor can withstand sudden voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 13 A

The high maximum drain current rating ensures reliable performance under heavy load conditions.

No. of Terminals: 2

Simplified two-terminal connection for ease of use and installation.

Maximum Power Dissipation (Abs): 110 W

High power dissipation capability allows for continuous operation under demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and reliability in power management applications.

Maximum Operating Temperature: 175 °C

A high operating temperature range ensures stable performance even in harsh environments.

Transistor Element Material: SILICON

Silicon material ensures durability and high performance in power management applications.

Terminal Finish: MATTE TIN OVER NICKEL

The terminal finish provides corrosion resistance and ensures long-term reliability.

Maximum Drain-Source On Resistance: 0.29 ohm

Low on-resistance ensures minimal power loss and efficient operation of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies the circuit design and installation process.

Case Connection: DRAIN

The drain case connection provides a secure grounding point for the transistor.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability in assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for reliable soldering and durability in the assembly process.

Technical Specifications

Power Field Effect Transistors (FET) IRF6215STRLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

310 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.29 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF6215STRLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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