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BSZ160N10NS3GATMA1

Infineon Technologies

BSZ160N10NS3GATMA1 by Infineon Technologies

Infineon Technologies' BSZ160N10NS3GATMA1 is a power FET with N-channel configuration and a built-in diode. It is suitable for switching applications, offering a min DS breakdown voltage of 100V and max pulsed drain current of 160A. Its small outline package style and high operating temperature make it ideal for various electronic devices.

Median Price

$0.750

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

$0.718

100+ parts

$0.620

1k+ parts

$0.556

10k+ parts

$0.554

5,000

$0.718

$0.620

$0.556

$0.554

Farnell

UK . 6,211 parts In-Stock

1+ parts

$1.890

100+ parts

$1.063

1k+ parts

$0.690

10k+ parts

$0.666

6,211

$1.890

$1.063

$0.690

$0.666

Newark

USA . 157 parts In-Stock

1+ parts

$2.290

100+ parts

$0.989

1k+ parts

$0.721

10k+ parts

-

157

$2.290

$0.989

$0.721

-

Arrow

USA . 15,000 parts In-Stock

1+ parts

-

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$0.525

15,000

-

-

-

$0.525

Verical

USA . 15,000 parts In-Stock

1+ parts

-

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-

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$0.526

15,000

-

-

-

$0.526

Rochester

USA . 5,406 parts In-Stock

1+ parts

-

100+ parts

$0.750

1k+ parts

$0.623

10k+ parts

$0.555

5,406

-

$0.750

$0.623

$0.555

Element14

Singapore . 4,208 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$0.980

10k+ parts

$0.915

4,208

-

$1.370

$0.980

$0.915

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 546 parts In-Stock

1+ parts

$0.428

100+ parts

-

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546

$0.428

-

-

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Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$0.810

100+ parts

-

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34

$0.810

-

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Component Sense

UK . 50 parts In-Stock

1+ parts

$4.170

100+ parts

-

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50

$4.170

-

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Chip Stock

USA . 35,500 parts In-Stock

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35,500

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Vyrian

USA . 21,784 parts In-Stock

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Rutronik

Germany . 5,000 parts In-Stock

1+ parts

-

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$0.784

5,000

-

-

-

$0.784

IBS Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$0.792

5,000

-

-

-

$0.792

VNN

France . 3,692 parts In-Stock

1+ parts

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3,692

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Sensible Micro Corp

USA . 1,186 parts In-Stock

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1,186

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Bristol Electronics

USA . 583 parts In-Stock

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583

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Distributors (Availability)

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Semicontronic

India . 7,263 parts In-Stock

1+ parts

$0.357

100+ parts

$0.348

1k+ parts

$0.346

10k+ parts

-

7,263

$0.357

$0.348

$0.346

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Corphita

USA . 485 parts In-Stock

1+ parts

$0.405

100+ parts

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-

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485

$0.405

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Ampacity Inc.

Singapore . 21,441 parts In-Stock

1+ parts

$0.489

100+ parts

-

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21,441

$0.489

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$0.740

100+ parts

$0.703

1k+ parts

$0.703

10k+ parts

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5,000

$0.740

$0.703

$0.703

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.810

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2,000

$0.810

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Argo Parts USA

USA . 507 parts In-Stock

1+ parts

$0.810

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507

$0.810

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Modulus Dynamics

Lithuania . 3,898 parts In-Stock

1+ parts

$1.064

100+ parts

$1.021

1k+ parts

$0.979

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3,898

$1.064

$1.021

$0.979

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Continental Prestige Electronics

USA . 8,731 parts In-Stock

1+ parts

$1.450

100+ parts

$0.927

1k+ parts

$0.613

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8,731

$1.450

$0.927

$0.613

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Aztec Data Supply Inc.

USA . 8,614 parts In-Stock

1+ parts

$1.490

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8,614

$1.490

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Corohmni

South Africa . 241 parts In-Stock

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$1.783

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241

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Microchip USA

USA . 3,535 parts In-Stock

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$4.698

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$4.698

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RC Electronics

USA . 90,166 parts In-Stock

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GreenTree Electronics

Israel . 70,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 13,273 parts In-Stock

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13,273

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Lucentia Tech

USA . 13,273 parts In-Stock

1+ parts

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100+ parts

$1.720

1k+ parts

$1.685

10k+ parts

$1.685

13,273

-

$1.720

$1.685

$1.685

Overview

Experience the unrivaled performance and reliability of the BSZ160N10NS3GATMA1 by Infineon Technologies. As a leading manufacturer in power field effect transistors, Infineon Technologies brings you a product that exceeds expectations. With its N-channel configuration and built-in diode, this transistor is perfect for switching applications. Its high DS breakdown voltage of 100V ensures safe and efficient operation. The BSZ160N10NS3GATMA1 also offers a maximum pulsed drain current of 160A, guaranteeing exceptional power capabilities. Whether you need it for industrial or automotive applications, this transistor delivers unparalleled value, benefits, and advantages to meet all your needs. Trust Infineon Technologies for top-quality products that never disappoint.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, ensuring reliability and resistance to wear and tear.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration provides excellent performance and efficient operation for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

With a built-in diode, this product simplifies circuit designs and improves overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor excels in fast and reliable switching operations.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration into circuit boards, saving valuable space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100 V, this transistor can handle high voltage applications, making it suitable for demanding power-related tasks.

Package Shape: SQUARE

The square package shape enhances stability and facilitates easy mounting and securing within electronic devices.

Terminal Form: NO LEAD

The no-lead terminal form maximizes space utilization, improves thermal performance, and enhances overall reliability.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation ensures low power consumption and excellent control over switchable loads.

No. of Elements: 1

This transistor consists of a single element, simplifying circuit designs and reducing complexity.

Maximum Pulsed Drain Current (IDM): 160 A

With a high maximum pulsed drain current of 160 A, this transistor can handle heavy loads and high-power applications with ease.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating of 80 mJ ensures reliable performance and protection against voltage spikes and transients.

No. of Terminals: 8

With 8 terminals, this transistor provides extensive connectivity options, allowing for versatile circuit configurations.

Maximum Power Dissipation (Abs): 63 W

The high maximum power dissipation capability of 63 W enables efficient heat dissipation, ensuring reliable operation even under demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for easy integration into compact electronic devices, making it suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high switching speeds, low power consumption, and excellent reliability.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments, making it suitable for various industrial applications.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures optimal performance, high durability, and compatibility with a wide range of applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this transistor can handle extreme cold environments, making it suitable for outdoor and automotive applications.

Terminal Finish: TIN

The tin terminal finish provides excellent solderability, ensuring reliable electrical connections and ease of integration into circuit boards.

Maximum Drain Current (ID): 40 A

With a maximum drain current of 40 A, this transistor can handle high current applications effectively, making it ideal for power-related tasks.

Maximum Drain-Source On Resistance: 0.016 ohm

The low maximum drain-source on resistance of 0.016 ohm ensures minimal power loss and efficient operation.

Terminal Position: DUAL

The dual terminal position allows for flexible circuit configurations and ease of connectivity, offering versatility and convenience.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this transistor is less prone to moisture-related issues, ensuring long-term reliability and performance.

Case Connection: DRAIN

The drain case connection provides efficient heat dissipation and enhances overall thermal management, enabling reliable operation even under high power conditions.

Technical Specifications

Power Field Effect Transistors (FET) BSZ160N10NS3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSZ160N10NS3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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