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BSZ16DN25NS3GATMA1

Infineon Technologies

BSZ16DN25NS3GATMA1 by Infineon Technologies

Infineon BSZ16DN25NS3GATMA1 is a N-CHANNEL FET with 250V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 44A IDM, 120mJ EAS, and 0.165 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 150°C and DUAL terminal position for efficient performance.

Median Price

$1.292

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 7,092 parts In-Stock

1+ parts

$0.306

100+ parts

$0.306

1k+ parts

-

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7,092

$0.306

$0.306

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Chip1Stop

Japan . 20,758 parts In-Stock

1+ parts

$2.560

100+ parts

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20,758

$2.560

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DigiKey

USA . 154 parts In-Stock

1+ parts

$2.590

100+ parts

$1.145

1k+ parts

$0.918

10k+ parts

$0.750

154

$2.590

$1.145

$0.918

$0.750

Mouser Electronics

USA . 729 parts In-Stock

1+ parts

$2.670

100+ parts

$1.190

1k+ parts

$0.918

10k+ parts

$0.858

729

$2.670

$1.190

$0.918

$0.858

Farnell

UK . 37,314 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.016

10k+ parts

$0.985

37,314

-

$1.480

$1.016

$0.985

Element14

Singapore . 37,314 parts In-Stock

1+ parts

-

100+ parts

$1.573

1k+ parts

$1.066

10k+ parts

$1.029

37,314

-

$1.573

$1.066

$1.029

Rochester

USA . 33,235 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.847

10k+ parts

$0.755

33,235

-

$1.020

$0.847

$0.755

Verical

USA . 7,092 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.447

10k+ parts

$0.422

7,092

-

-

$0.447

$0.422

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

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$0.770

5,000

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$0.770

Arrow

USA . 5,000 parts In-Stock

1+ parts

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$0.762

5,000

-

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$0.762

RS (Exports)

UK . 80 parts In-Stock

1+ parts

-

100+ parts

$1.292

1k+ parts

$1.150

10k+ parts

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80

-

$1.292

$1.150

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 292 parts In-Stock

1+ parts

$0.685

100+ parts

-

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292

$0.685

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.265

100+ parts

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300

$1.265

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Vyrian

USA . 16,271 parts In-Stock

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16,271

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Chip Stock

USA . 13,992 parts In-Stock

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13,992

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IBS Electronics

USA . 10,000 parts In-Stock

1+ parts

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10k+ parts

$2.637

10,000

-

-

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$2.637

Rutronik

Germany . 5,000 parts In-Stock

1+ parts

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$0.838

5,000

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$0.838

NAC Semi

USA . 5,000 parts In-Stock

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$1.420

5,000

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$1.420

Cyclops Electronics Ltd

UK . 4,434 parts In-Stock

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4,434

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Bristol Electronics

USA . 2,605 parts In-Stock

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2,605

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ComSIT Distribution GmbH

Germany . 1,671 parts In-Stock

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1,671

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ComSIT USA

USA . 1,671 parts In-Stock

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1,671

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VNN

France . 844 parts In-Stock

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844

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 16,074 parts In-Stock

1+ parts

$0.610

100+ parts

-

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16,074

$0.610

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Semicontronic

India . 15,921 parts In-Stock

1+ parts

$0.610

100+ parts

$0.595

1k+ parts

$0.592

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15,921

$0.610

$0.595

$0.592

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Corphita

USA . 916 parts In-Stock

1+ parts

$0.649

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916

$0.649

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Argo Parts USA

USA . 1,424 parts In-Stock

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$1.265

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1,424

$1.265

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Modulus Dynamics

Lithuania . 5,626 parts In-Stock

1+ parts

$1.440

100+ parts

$1.382

1k+ parts

$1.325

10k+ parts

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5,626

$1.440

$1.382

$1.325

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Corohmni

South Africa . 41 parts In-Stock

1+ parts

$1.440

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41

$1.440

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.483

100+ parts

$1.409

1k+ parts

$1.409

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450

$1.483

$1.409

$1.409

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Aztec Data Supply Inc.

USA . 853 parts In-Stock

1+ parts

$1.849

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853

$1.849

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Component Stockers USA

USA . 40,209 parts In-Stock

1+ parts

$2.060

100+ parts

$1.110

1k+ parts

$0.920

10k+ parts

$0.810

40,209

$2.060

$1.110

$0.920

$0.810

Microchip USA

USA . 6,794 parts In-Stock

1+ parts

$6.347

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6,794

$6.347

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Continental Prestige Electronics

USA . 45,831 parts In-Stock

1+ parts

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100+ parts

$1.390

1k+ parts

$0.876

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45,831

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$1.390

$0.876

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RC Electronics

USA . 32,496 parts In-Stock

1+ parts

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100+ parts

$1.280

1k+ parts

$1.160

10k+ parts

$1.130

32,496

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$1.280

$1.160

$1.130

Perfect Parts

USA . 26,533 parts In-Stock

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26,533

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Allen Electronics Distributors

USA . 100 parts In-Stock

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$0.990

10k+ parts

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100

-

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$0.990

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Overview

Discover the Infineon Technologies BSZ16DN25NS3GATMA1, a top-of-the-line Power FET renowned for its superior quality and reliability. With a focus on switching applications, this N-channel transistor offers a seamless performance thanks to its built-in diode and enhanced mode operation. Ideal for a wide range of electronic devices, this FET provides a maximum drain current of 10.9A and operates at temperatures up to 150°C. Trust in Infineon's expertise in semiconductor technology and elevate your projects with the unmatched value and efficiency of the BSZ16DN25NS3GATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity than P-channel transistors, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency by allowing for reverse current flow protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low on-resistance for efficient performance.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the transistor onto a circuit board, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 250 V

The high breakdown voltage of 250V ensures that the transistor can handle high voltage levels without breakdown, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, enabling high-density packing of components.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and improves thermal performance, ensuring reliable connections with low thermal resistance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control of the output current and lower power consumption compared to depletion mode transistors, making them ideal for efficient power management.

Maximum Pulsed Drain Current (IDM): 44 A

The high maximum pulsed drain current rating of 44A allows for high current switching operations without risk of damage, making this transistor suitable for demanding applications.

Avalanche Energy Rating (EAS): 120 mJ

The high avalanche energy rating of 120mJ indicates the transistor's ability to withstand high energy spikes and transient overloads, ensuring reliable operation in harsh environments.

No. of Terminals: 8

The 8 terminals provide flexibility in circuit connections and enable the transistor to be easily integrated into various circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and facilitates high-density mounting of components for compact and efficient circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, with low gate leakage current and improved ruggedness for consistent operation over time.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the transistor to operate reliably in high-temperature environments, providing flexibility for a wide range of applications.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements due to its high thermal conductivity, stability, and reliability, ensuring consistent performance under varying operating conditions.

Terminal Finish: TIN

The tin terminal finish offers good solderability and corrosion resistance, ensuring reliable electrical connections with minimal contact resistance.

Maximum Drain Current (ID): 10.9 A

The high maximum drain current rating of 10.9A allows for reliable operation under high load conditions, making this transistor suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.165 ohm

The low maximum drain-source on resistance of 0.165 ohm results in minimal power loss and heat generation, improving efficiency and performance of the transistor in switching applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit layout and enable optimized thermal management, ensuring reliable operation and long-term performance of the transistor.

Case Connection: DRAIN

The drain case connection simplifies circuit design and thermal management, providing efficient heat dissipation and ensuring reliable operation of the transistor in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) BSZ16DN25NS3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (ID):

10.9 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSZ16DN25NS3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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