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MSCSM170AM11CT3AG

Microchip Technology

MSCSM170AM11CT3AG by Microchip Technology

MSCSM170AM11CT3AG by Microchip Technology is a N-CHANNEL FET with 1700V DS Breakdown Voltage, 480A IDM, and 0.0113 ohm RDS(on). It is used for SWITCHING applications in SERIES CONNECTED configuration. Operating from -40 to 175 °C, it features METAL-OXIDE SEMICONDUCTOR technology and SILICON CARBIDE material.

Median Price

$383.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 17 parts In-Stock

1+ parts

$383.480

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17

$383.480

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Distributors (In-Stock)

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Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$399.397

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99

$399.397

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Vyrian

USA . 3,222 parts In-Stock

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3,222

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 168 parts In-Stock

1+ parts

$0.730

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168

$0.730

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.268

100+ parts

$1.205

1k+ parts

$1.205

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-

40

$1.268

$1.205

$1.205

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Corohmni

South Africa . 145 parts In-Stock

1+ parts

$1.674

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145

$1.674

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AZTECH Wire

Italy . 450 parts In-Stock

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$12.196

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450

$12.196

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Continental Prestige Electronics

USA . 3,267 parts In-Stock

1+ parts

$388.330

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$380.563

3,267

$388.330

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$380.563

Argo Parts USA

USA . 1,963 parts In-Stock

1+ parts

$388.330

100+ parts

$384.447

1k+ parts

$380.563

10k+ parts

$376.680

1,963

$388.330

$384.447

$380.563

$376.680

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$456.340

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2

$456.340

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Microchip USA

USA . 2,857 parts In-Stock

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$590.557

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2,857

$590.557

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Semicontronic

India . 2 parts In-Stock

1+ parts

$993.210

100+ parts

$968.380

1k+ parts

$963.414

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2

$993.210

$968.380

$963.414

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West Coast Incorporated

USA . 6,439 parts In-Stock

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6,439

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Overview

Experience superior performance and reliability with the MSCSM170AM11CT3AG by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality Power Field Effect Transistors (FET) like no other. Ideal for switching applications, this N-CHANNEL transistor boasts a minimum DS Breakdown Voltage of 1700V and a maximum Pulsed Drain Current of 480A. With its innovative design featuring 2 elements with built-in diode and thermistor, this transistor offers unmatched value and benefits to customers looking for high efficiency and durability in their electronic devices. Trust Microchip Technology for all your power transistor needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs have better performance characteristics and lower on-resistance compared to P-CHANNEL FETs.

Minimum DS Breakdown Voltage: 1700 V

High breakdown voltage ensures the FET can handle high voltage applications effectively.

Maximum Pulsed Drain Current (IDM): 480 A

High pulsed drain current capability allows for handling sudden surges in current without damage.

Maximum Operating Temperature: 175 °C

The FET can operate at high temperatures without the risk of overheating or malfunctioning.

Maximum Drain Current (ID): 240 A

High drain current rating allows for handling of large currents in continuous operation.

Maximum Drain-Source On Resistance: 0.0113 ohm

Low on-resistance leads to reduced power losses and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) MSCSM170AM11CT3AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1700 V

Maximum Drain Current (ID):

240 A

Maximum Drain-Source On Resistance:

.0113 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

40 pF

JESD-30 Code:

R-XUFM-X25

No. of Elements:

2

No. of Terminals:

25

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSCSM170AM11CT3AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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