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MSCSM120HM31CT3AG

Microchip Technology

MSCSM120HM31CT3AG by Microchip Technology

MSCSM120HM31CT3AG by Microchip Technology is an N-CHANNEL FET with 1200V DS breakdown voltage, 180A IDM, and 0.031 ohm RDS(on). Ideal for switching applications, this bridge configuration transistor features a built-in diode and thermistor in a rectangular package style. Operating in enhancement mode, it can handle up to 395W power dissipation at temperatures ranging from -40°C to 175°C.

Median Price

$250.896

Lifecycle Status

Suppliers In-Stock

5

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< 1k

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Mouser Electronics

USA . 4 parts In-Stock

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$193.120

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$193.120

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Verical

USA . 4 parts In-Stock

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$308.671

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4

$308.671

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Nova Conductors

Japan . 870 parts In-Stock

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$204.002

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870

$204.002

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NAC Semi

USA . 4 parts In-Stock

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$220.700

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$203.280

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$188.400

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$220.700

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$188.400

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Vyrian

USA . 3 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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$0.494

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226

$0.494

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Aztec Data Supply Inc.

USA . 4,746 parts In-Stock

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$0.731

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4,746

$0.731

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AZTECH Wire

Italy . 671 parts In-Stock

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$18.566

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671

$18.566

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Continental Prestige Electronics

USA . 6,625 parts In-Stock

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$204.002

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$199.922

6,625

$204.002

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$199.922

Ampacity Inc.

Singapore . 3 parts In-Stock

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$229.810

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Microchip USA

USA . 5,324 parts In-Stock

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$405.555

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5,324

$405.555

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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West Coast Incorporated

USA . 1,411 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$199.922

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$193.802

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$189.722

500

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$199.922

$193.802

$189.722

Argo Parts USA

USA . 441 parts In-Stock

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441

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iodParts Technologies Inc.

India . 101 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Microchip Technology with the MSCSM120HM31CT3AG Power Field Effect Transistor. Designed for switching applications, this N-CHANNEL FET features a bridge configuration with 4 elements, built-in diode, and thermistor for enhanced performance. With a maximum operating temperature of 175°C and a minimum DS breakdown voltage of 1200V, this transistor offers unmatched durability and efficiency. Trust in Microchip Technology to provide cutting-edge solutions for your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

This allows for efficient switching in various electronic applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Enables easy implementation in bridge circuits with added functionality.

Transistor Application: SWITCHING

Ideal for applications where a high current switching capability is required.

Minimum DS Breakdown Voltage: 1200 V

Provides a high level of voltage protection for the circuit.

Package Shape: RECTANGULAR

Offers a compact design for space-saving installations.

Operating Mode: ENHANCEMENT MODE

Allows for precise control over the switching operation of the transistor.

No. of Elements: 4

Provides versatility in circuit design and implementation.

Maximum Pulsed Drain Current (IDM): 180 A

Offers high current handling capacity for demanding applications.

Maximum Drain Current (Abs) (ID): 89 A

Suitable for applications requiring a moderate current rating.

No. of Terminals: 25

Provides ample connection points for various circuit configurations.

Maximum Power Dissipation (Abs): 395 W

Ensures efficient operation under high load conditions.

Package Style (Meter): FLANGE MOUNT

Facilitates easy mounting and installation in a variety of setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides reliable performance and durability in a wide range of operating conditions.

Maximum Operating Temperature: 175 °C

Enables operation in high-temperature environments without performance degradation.

Transistor Element Material: SILICON CARBIDE

Offers high performance and reliability in demanding applications.

Minimum Operating Temperature: -40 °C

Allows for operation in low-temperature environments with minimal impact on performance.

Maximum Drain-Source On Resistance: 0.031 ohm

Ensures efficient power transfer with minimal power loss.

Terminal Position: UPPER

Facilitates easy and standardized connection in circuit setups.

Case Connection: ISOLATED

Helps prevent circuit interference and ensures reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) MSCSM120HM31CT3AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

89 A

Maximum Drain Current (ID):

89 A

Maximum Drain-Source On Resistance:

.031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X25

No. of Elements:

4

No. of Terminals:

25

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSCSM120HM31CT3AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.50.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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