Loading...

MSCSM70VM19C3AG

Microchip Technology

MSCSM70VM19C3AG by Microchip Technology

MSCSM70VM19C3AG by Microchip is an N-CHANNEL FET with 700V DS breakdown voltage, ideal for switching applications. It features 2 elements with built-in diode and SCR in a series connected configuration. With a max pulsed drain current of 250A and operating temperature up to 150°C, it offers high power dissipation capabilities.

Median Price

$131.200

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$131.200

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$131.200

-

-

-

Vyrian

USA . 5,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,114

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$4.050

-

-

-

AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$17.476

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$17.476

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$128.576

100+ parts

-

1k+ parts

$123.433

10k+ parts

-

100

$128.576

-

$123.433

-

Continental Prestige Electronics

USA . 5,446 parts In-Stock

1+ parts

$131.200

100+ parts

-

1k+ parts

-

10k+ parts

$128.576

5,446

$131.200

-

-

$128.576

Microchip USA

USA . 5,013 parts In-Stock

1+ parts

$241.695

100+ parts

-

1k+ parts

-

10k+ parts

-

5,013

$241.695

-

-

-

Argo Parts USA

USA . 4,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,843

-

-

-

-

Fulton Briggs Corp.

USA . 1,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,408

-

-

-

-

Overview

Experience the power of innovation with the MSCSM70VM19C3AG by Microchip Technology. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Microchip delivers a high-quality product that is perfect for switching applications. With its N-CHANNEL configuration, SERIES CONNECTED design, and built-in diode and SCR, this transistor offers unparalleled performance and reliability. Whether you're looking to enhance your power systems or improve efficiency, the MSCSM70VM19C3AG provides exceptional value and benefits that will elevate your projects to new heights. Trust Microchip's expertise and discover the advantages of this top-of-the-line transistor today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have faster switching speeds and lower ON resistance compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND SCR

This configuration allows for efficient switching and control of high voltages, providing reliability in power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power transfer and minimal losses.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for harsh environments.

Maximum Drain-Source On Resistance: 0.019 ohm

The low ON resistance results in minimal power dissipation and high efficiency in power handling.

Technical Specifications

Power Field Effect Transistors (FET) MSCSM70VM19C3AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (Abs) (ID):

124 A

Maximum Drain Current (ID):

124 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

29 pF

JESD-30 Code:

R-XUFM-X25

No. of Elements:

2

No. of Terminals:

25

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

250 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSCSM70VM19C3AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.50.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20