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SUM110P08-11L-E3

Vishay Intertechnology

SUM110P08-11L-E3 by Vishay Intertechnology

Vishay Intertechnology's SUM110P08-11L-E3 is a P-channel FET with 80V DS breakdown voltage, ideal for switching applications. Features include 120A max pulsed drain current, 0.0112 ohm max RDS(on), and 375W max power dissipation. Suitable for enhancement mode operation in high-power circuits with operating temperatures ranging from -55 to 175°C.

Median Price

$4.109

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Mouser Electronics

USA . 68,030 parts In-Stock

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$5.900

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$2.830

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$2.430

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$5.900

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Newark

USA . 3,135 parts In-Stock

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$6.080

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$2.910

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Element14

Singapore . 12,484 parts In-Stock

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$4.440

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DigiKey

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$2.421

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TTI Europe

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Arrow

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Verical

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Future Electronics

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$2.320

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Chip1Stop

Japan . 800 parts In-Stock

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Ozdisan Elektronik

Türkiye . 1,761 parts In-Stock

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Nova Conductors

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Bristol Electronics

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$3.648

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$1.715

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Maritex

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$4.431

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$2.942

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TME

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$5.550

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$3.320

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Chip Stock

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IBS Electronics

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NAC Semi

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Vyrian

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Modulus Dynamics

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Advanced Electronics

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$0.583

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Corohmni

South Africa . 70 parts In-Stock

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$1.765

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Ampacity Inc.

Singapore . 17,183 parts In-Stock

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Aztec Data Supply Inc.

USA . 318 parts In-Stock

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Argo Parts USA

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$2.999

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Netroflash

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$2.953

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Continental Prestige Electronics

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$2.850

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$2.730

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Microchip USA

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Lucentia Tech

USA . 18,560 parts In-Stock

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$0.626

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Eastek

USA . 8,800 parts In-Stock

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RC Electronics

USA . 8,748 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

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Kepictronics

USA . 448 parts In-Stock

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Overview

Elevate your power management with the SUM110P08-11L-E3 by Vishay Intertechnology. Crafted with precision and quality, this P-CHANNEL power field effect transistor offers unparalleled performance in switching applications. With a maximum pulsated drain current of 120 A and a minimum DS breakdown voltage of 80 V, this transistor is designed to optimize efficiency and reliability. Say goodbye to power limitations and hello to seamless operation with the SUM110P08-11L-E3 - the ultimate solution for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low gate capacitance and high switching speeds, making them ideal for applications requiring efficient switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces the need for additional components, making the product more compact and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power flow and manage voltage levels in circuits.

Maximum Pulsed Drain Current (IDM): 120 A

With a high maximum pulsed drain current rating, this FET can handle sudden spikes in current without compromising performance or reliability.

Maximum Power Dissipation (Abs): 375 W

The high power dissipation capacity of this FET allows it to handle high-power applications without the risk of overheating or failure.

Maximum Operating Temperature: 175 °C

With a wide operating temperature range, this FET can withstand varying environmental conditions and maintain stable performance.

Technical Specifications

Power Field Effect Transistors (FET) SUM110P08-11L-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

281 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0112 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SUM110P08-11L-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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