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SUM110P06-08L

Vishay Intertechnology

SUM110P06-08L by Vishay Intertechnology

Vishay Intertechnology's SUM110P06-08L is a P-channel FET with 60V DS breakdown voltage, 200A IDM, and 0.008 ohm RDS(on). Ideal for switching applications, it features a built-in diode, operates in enhancement mode, and has a max power dissipation of 272W.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,265 parts In-Stock

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1,265

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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600

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Holdelec - ElecDif-Pro

France . 600 parts In-Stock

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600

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Corohmni

South Africa . 177 parts In-Stock

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$1.037

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177

$1.037

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Aztec Data Supply Inc.

USA . 4,754 parts In-Stock

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$1.400

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$1.400

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Semicontronic

India . 1,233 parts In-Stock

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$14.050

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$13.699

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$13.628

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1,233

$14.050

$13.699

$13.628

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AZTECH Wire

Italy . 499 parts In-Stock

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$17.577

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499

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Continental Prestige Electronics

USA . 5,128 parts In-Stock

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Argo Parts USA

USA . 2,314 parts In-Stock

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2,314

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Enhance your power management solutions with the SUM110P06-08L by Vishay Intertechnology. This high-quality P-Channel Power Field Effect Transistor offers reliable switching capabilities, making it ideal for various applications. With a robust design and built-in diode configuration, this transistor delivers exceptional performance and efficiency. Upgrade your projects with ease and trust in the value and benefits that Vishay Intertechnology products provide. Elevate your systems to new heights with the SUM110P06-08L.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and reliability are important factors.

Polarity or Channel Type: P-CHANNEL

The P-channel design allows for lower on-state resistance and faster switching speeds, making this FET efficient and high-performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse currents, enhancing the overall functionality of this FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency, making it suitable for a wide range of projects.

Surface Mount: YES

With surface mount capability, this FET can be easily integrated into compact circuit designs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60V

The high breakdown voltage allows for reliable operation in high voltage applications, making this FET versatile and robust.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and secure soldering, ensuring a stable connection in various environments.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and easy soldering, enhancing the overall durability and reliability of this FET.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control of the FET, enabling accurate switching and efficient power management.

Maximum Pulsed Drain Current (IDM): 200A

With a high pulsed drain current rating, this FET can handle surges in power without compromising performance, ensuring reliable operation in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) SUM110P06-08L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

211 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SUM110P06-08L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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