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NVF2955T1G

Onsemi

NVF2955T1G by Onsemi

The Onsemi NVF2955T1G is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 17A and EAS of 225mJ, operating in ENHANCEMENT MODE. With a compact SMALL OUTLINE package and 0.185 ohm RDS(on), it offers efficient power dissipation up to 2.3W at 175°C.

Median Price

$0.809

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,190 parts In-Stock

1+ parts

$0.471

100+ parts

$0.463

1k+ parts

$0.413

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1,190

$0.471

$0.463

$0.413

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Farnell

UK . 2,734 parts In-Stock

1+ parts

$1.307

100+ parts

$0.729

1k+ parts

$0.476

10k+ parts

$0.470

2,734

$1.307

$0.729

$0.476

$0.470

Newark

USA . 724 parts In-Stock

1+ parts

$1.770

100+ parts

$0.754

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$0.533

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724

$1.770

$0.754

$0.533

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DigiKey

USA . 1,021 parts In-Stock

1+ parts

$1.840

100+ parts

$0.783

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$0.617

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1,021

$1.840

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$0.617

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Rochester

USA . 45,240 parts In-Stock

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$0.579

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$0.481

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$0.481

$0.429

Verical

USA . 45,000 parts In-Stock

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$0.601

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$0.536

45,000

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$0.536

Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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Arrow

USA . 4,000 parts In-Stock

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$0.621

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$0.505

4,000

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$0.505

Element14

Singapore . 2,999 parts In-Stock

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$1.010

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$0.664

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$0.627

2,999

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$1.010

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Future Electronics

Canada . 2,000 parts In-Stock

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$0.640

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$0.610

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Avnet

USA . 2,000 parts In-Stock

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Master Electronics

USA . 2,000 parts In-Stock

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$0.978

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$0.638

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$0.512

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$0.978

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$0.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,309 parts In-Stock

1+ parts

$0.450

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$0.450

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Nova Conductors

Japan . 83 parts In-Stock

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$0.562

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$0.562

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TME

Poland . 685 parts In-Stock

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$1.240

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$0.750

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$0.750

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Chip Stock

USA . 98,780 parts In-Stock

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NAC Semi

USA . 57,000 parts In-Stock

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Flip Electronics

USA . 16,000 parts In-Stock

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Vyrian

USA . 10,784 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,597 parts In-Stock

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IBS Electronics

USA . 3,000 parts In-Stock

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$1.256

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$0.688

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$0.580

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$1.256

$0.688

$0.580

Bristol Electronics

USA . 950 parts In-Stock

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Dan-Mar Components

USA . 329 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 328 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 10,798 parts In-Stock

1+ parts

$0.367

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10,798

$0.367

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Decca Corp

Germany . 10,544 parts In-Stock

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$0.367

100+ parts

$0.360

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$0.356

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10,544

$0.367

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$0.356

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Semicontronic

India . 15,913 parts In-Stock

1+ parts

$0.399

100+ parts

$0.389

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$0.387

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15,913

$0.399

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$0.387

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Corphita

USA . 1,994 parts In-Stock

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$0.427

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Corohmni

South Africa . 484 parts In-Stock

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$0.470

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Aztec Data Supply Inc.

USA . 3,343 parts In-Stock

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$0.480

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Argo Parts USA

USA . 3,915 parts In-Stock

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$0.543

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$0.527

3,915

$0.543

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$0.527

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.551

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$0.529

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2,000

$0.551

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$0.529

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Modulus Dynamics

Lithuania . 13,193 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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450

$0.579

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Microchip USA

USA . 9,789 parts In-Stock

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$3.525

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Perfect Parts

USA . 767,183 parts In-Stock

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GreenTree Electronics

Israel . 221,000 parts In-Stock

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RC Electronics

USA . 98,078 parts In-Stock

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Infinite Electronics LLP (Excess)

. 40,766 parts In-Stock

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Kepictronics

USA . 35,000 parts In-Stock

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Lixinc

USA . 16,053 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Robosynatics

Brazil . 9,874 parts In-Stock

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Lucentia Tech

USA . 9,874 parts In-Stock

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$0.540

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$0.540

9,874

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$0.551

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$0.540

SupplyDigital Components

Austria . 7,196 parts In-Stock

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Problanco Electronics

Mexico . 5,118 parts In-Stock

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Kulean Microsystems

USA . 4,528 parts In-Stock

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Futuretech Components

Singapore . 3,650 parts In-Stock

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Formix International (Excess)

India . 1,753 parts In-Stock

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TANS Electronics

Latvia . 1,496 parts In-Stock

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Component Connect

USA . 762 parts In-Stock

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Continental Prestige Electronics

USA . 530 parts In-Stock

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$0.674

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$0.447

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530

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$0.447

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UHIMA Technologies

Türkiye . 318 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NVF2955T1G P-Channel Power Field Effect Transistor by Onsemi. Designed for superior performance and reliability, this transistor is perfect for a wide range of switching applications. With a maximum pulsing drain current of 17A and an avalanche energy rating of 225mJ, the NVF2955T1G offers unbeatable value and efficiency. Trust in Onsemi's expertise and innovation to deliver top-quality products that exceed expectations. Elevate your projects with the NVF2955T1G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection, making it suitable for various environments.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration allows for efficient flow of current, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency.

Transistor Application: SWITCHING

Designed for switching applications, ensuring reliable and precise operation.

Surface Mount: YES

The surface mount capability makes installation easier and saves space on the PCB.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage offers robust protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and ease of soldering.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation ensures quick response and low power consumption.

Maximum Pulsed Drain Current (IDM): 17 A

With a high pulsed current rating, it can handle sudden surges in power.

Avalanche Energy Rating (EAS): 225 mJ

The high avalanche energy rating enhances reliability and ruggedness.

Maximum Drain Current (Abs) (ID): 2.6 A

The high drain current rating allows for efficient power handling.

No. of Terminals: 4

The 4 terminals provide versatility in circuit connections.

Maximum Power Dissipation (Abs): 2.3 W

The high power dissipation capability ensures stable performance under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high efficiency and fast switching speeds.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, it can withstand harsh conditions.

Transistor Element Material: SILICON

The silicon material is known for its reliability and long-term performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance.

Maximum Drain Current (ID): 1.7 A

The high drain current rating ensures efficient power handling.

Maximum Drain-Source On Resistance: 0.185 ohm

The low on-resistance minimizes power loss and heat generation.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and wiring options.

Case Connection: DRAIN

The drain connection ensures effective heat dissipation for enhanced reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable soldering connections.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 automotive standard, ensuring quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVF2955T1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

225 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.6 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

17 A

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVF2955T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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