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FQA36P15

Onsemi

FQA36P15 by Onsemi

FQA36P15 by Onsemi is a P-CHANNEL Power FET with 150V DS Breakdown Voltage and 144A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.09 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 294W and can handle up to 36A drain current.

Median Price

$3.840

Lifecycle Status

EOL

Suppliers In-Stock

13

In-Stock Inventory

1k+

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DigiKey

USA . 22,500 parts In-Stock

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$3.840

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22,500

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$3.840

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$2.700

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50

$2.700

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TME

Poland . 467 parts In-Stock

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$4.710

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$3.280

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467

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Forefront Electronics and Design

USA . 10 parts In-Stock

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$8.580

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$8.580

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Maritex

Poland . 38 parts In-Stock

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$10.084

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$6.083

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$5.139

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38

$10.084

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Flip Electronics

USA . 42,750 parts In-Stock

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Chip Stock

USA . 6,237 parts In-Stock

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Digiode

USA . 1,045 parts In-Stock

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Vyrian

USA . 689 parts In-Stock

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Florida Circuit

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Whistler Technology

UK . 22 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Prism Electronics

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Modulus Dynamics

Lithuania . 282 parts In-Stock

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$1.067

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$1.067

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$1.067

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282

$1.067

$1.067

$1.067

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Aztec Data Supply Inc.

USA . 1,381 parts In-Stock

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$1.230

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$1.230

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$1.257

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$1.194

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$1.194

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500

$1.257

$1.194

$1.194

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Corohmni

South Africa . 128 parts In-Stock

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$2.593

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128

$2.593

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Aranea Global

USA . 100 parts In-Stock

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$2.646

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$2.540

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100

$2.646

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$2.540

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Continental Prestige Electronics

USA . 5,180 parts In-Stock

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$2.700

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$2.646

5,180

$2.700

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$2.646

Argo Parts USA

USA . 4,564 parts In-Stock

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$2.700

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$2.700

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AZTECH Wire

Italy . 414 parts In-Stock

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$15.004

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414

$15.004

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Microchip USA

USA . 9,259 parts In-Stock

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$27.040

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$27.040

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Ampacity Inc.

Singapore . 1,423 parts In-Stock

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$45.050

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$45.050

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Semicontronic

India . 329 parts In-Stock

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$49.050

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$47.824

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$47.578

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$49.050

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Robosynatics

Brazil . 19,080 parts In-Stock

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Lucentia Tech

USA . 19,080 parts In-Stock

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$0.917

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$0.899

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$0.899

Lixinc

USA . 8,469 parts In-Stock

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TANS Electronics

Latvia . 7,443 parts In-Stock

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Kulean Microsystems

USA . 3,914 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,396 parts In-Stock

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Corphita

USA . 1,055 parts In-Stock

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Supply Digital

USA . 702 parts In-Stock

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Problanco Electronics

Mexico . 591 parts In-Stock

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Authorized Procurement Solutions

USA . 528 parts In-Stock

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UHIMA Technologies

Türkiye . 322 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6 parts In-Stock

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iodParts Technologies Inc.

India . 2 parts In-Stock

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Overview

Enhance your power management systems with the FQA36P15 by Onsemi, a high-quality P-Channel Power Field Effect Transistor. Designed for switching applications with a single configuration and built-in diode, this transistor offers a reliable solution for your power needs. With a maximum drain current of 36A and low on-resistance, this transistor provides efficient performance. Trust in Onsemi's expertise in semiconductor technology to deliver a product that meets your power requirements with precision and reliability. Elevate your power systems with the FQA36P15 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan and reliable performance.

Minimum DS Breakdown Voltage: 150 V

The high breakdown voltage allows for the efficient handling of high voltage applications, making this FET suitable for a wide range of power management tasks.

Maximum Pulsed Drain Current (IDM): 144 A

With a high pulsed drain current, this FET can handle sudden surges of power without compromising its performance, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 1400 mJ

The high avalanche energy rating indicates that this FET can withstand power spikes and surges, ensuring reliable operation in various conditions.

Maximum Power Dissipation (Abs): 294 W

With a high power dissipation rating, this FET can effectively dissipate heat generated during operation, preventing overheating and ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to function effectively in harsh environments and high-temperature conditions, making it a versatile choice for various applications.

Technical Specifications

Power Field Effect Transistors (FET) FQA36P15 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

1400 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

144 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA36P15 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-612-1966, 5961016121966

NIIN

016121966

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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